HK1186890A1 - 用於飛行時間傳感器的電路配置和方法 - Google Patents

用於飛行時間傳感器的電路配置和方法

Info

Publication number
HK1186890A1
HK1186890A1 HK13114110.1A HK13114110A HK1186890A1 HK 1186890 A1 HK1186890 A1 HK 1186890A1 HK 13114110 A HK13114110 A HK 13114110A HK 1186890 A1 HK1186890 A1 HK 1186890A1
Authority
HK
Hong Kong
Prior art keywords
time
circuit configuration
flight sensor
flight
sensor
Prior art date
Application number
HK13114110.1A
Other languages
English (en)
Inventor
．沙阿 阿希什．
Original Assignee
豪威科技股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 豪威科技股份有限公司 filed Critical 豪威科技股份有限公司
Publication of HK1186890A1 publication Critical patent/HK1186890A1/zh

Links

Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N13/00—Stereoscopic video systems; Multi-view video systems; Details thereof
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
    • G01S7/00—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00
    • G01S7/48—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00 of systems according to group G01S17/00
    • G01S7/483—Details of pulse systems
    • G01S7/486—Receivers
    • G01S7/4861—Circuits for detection, sampling, integration or read-out
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/22—Measuring arrangements characterised by the use of optical techniques for measuring depth
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
    • G01C3/00—Measuring distances in line of sight; Optical rangefinders
    • G01C3/02—Details
    • G01C3/06—Use of electric means to obtain final indication
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
    • G01S17/00—Systems using the reflection or reradiation of electromagnetic waves other than radio waves, e.g. lidar systems
    • G01S17/02—Systems using the reflection of electromagnetic waves other than radio waves
    • G01S17/06—Systems determining position data of a target
    • G01S17/08—Systems determining position data of a target for measuring distance only
    • G01S17/10—Systems determining position data of a target for measuring distance only using transmission of interrupted, pulse-modulated waves
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
    • G01S17/00—Systems using the reflection or reradiation of electromagnetic waves other than radio waves, e.g. lidar systems
    • G01S17/88—Lidar systems specially adapted for specific applications
    • G01S17/89—Lidar systems specially adapted for specific applications for mapping or imaging
    • G01S17/894—3D imaging with simultaneous measurement of time-of-flight at a 2D array of receiver pixels, e.g. time-of-flight cameras or flash lidar
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14609—Pixel-elements with integrated switching, control, storage or amplification elements
    • H01L27/14612—Pixel-elements with integrated switching, control, storage or amplification elements involving a transistor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14609—Pixel-elements with integrated switching, control, storage or amplification elements
    • H01L27/14612—Pixel-elements with integrated switching, control, storage or amplification elements involving a transistor
    • H01L27/14614—Pixel-elements with integrated switching, control, storage or amplification elements involving a transistor having a special gate structure
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
    • G01S7/00—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00
    • G01S7/48—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00 of systems according to group G01S17/00
    • G01S7/483—Details of pulse systems
    • G01S7/486—Receivers
    • G01S7/4861—Circuits for detection, sampling, integration or read-out
    • G01S7/4863—Detector arrays, e.g. charge-transfer gates

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Power Engineering (AREA)
  • Remote Sensing (AREA)
  • Radar, Positioning & Navigation (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Signal Processing (AREA)
  • Multimedia (AREA)
  • Optical Radar Systems And Details Thereof (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
  • Solid State Image Pick-Up Elements (AREA)
HK13114110.1A 2012-03-01 2013-12-20 用於飛行時間傳感器的電路配置和方法 HK1186890A1 (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US13/410,086 US8686367B2 (en) 2012-03-01 2012-03-01 Circuit configuration and method for time of flight sensor

Publications (1)

Publication Number Publication Date
HK1186890A1 true HK1186890A1 (zh) 2014-03-21

Family

ID=47754327

Family Applications (1)

Application Number Title Priority Date Filing Date
HK13114110.1A HK1186890A1 (zh) 2012-03-01 2013-12-20 用於飛行時間傳感器的電路配置和方法

Country Status (7)

Country Link
US (1) US8686367B2 (zh)
EP (1) EP2634595B1 (zh)
JP (1) JP5579893B2 (zh)
KR (1) KR101465318B1 (zh)
CN (1) CN103297714B (zh)
HK (1) HK1186890A1 (zh)
TW (1) TWI480586B (zh)

Families Citing this family (63)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101797014B1 (ko) * 2011-09-14 2017-11-14 삼성전자주식회사 3차원 이미지 센서의 단위 픽셀
US8686367B2 (en) * 2012-03-01 2014-04-01 Omnivision Technologies, Inc. Circuit configuration and method for time of flight sensor
US10324033B2 (en) * 2012-07-20 2019-06-18 Samsung Electronics Co., Ltd. Image processing apparatus and method for correcting an error in depth
US10354448B1 (en) * 2013-03-15 2019-07-16 Lockheed Martin Corporation Detection of optical components in a scene
LU92173B1 (en) * 2013-03-20 2014-09-22 Iee Sarl Distance determination method
JP6320132B2 (ja) * 2014-04-04 2018-05-09 キヤノン株式会社 撮像システム
EP2966856B1 (en) * 2014-07-08 2020-04-15 Sony Depthsensing Solutions N.V. A high dynamic range pixel and a method for operating it
US9523765B2 (en) 2014-07-14 2016-12-20 Omnivision Technologies, Inc. Pixel-level oversampling for a time of flight 3D image sensor with dual range measurements
US9313476B2 (en) * 2014-08-07 2016-04-12 Omnivision Technologies, Inc. Precharged latched pixel cell for a time of flight 3D image sensor
US9658336B2 (en) 2014-08-20 2017-05-23 Omnivision Technologies, Inc. Programmable current source for a time of flight 3D image sensor
JP6433243B2 (ja) * 2014-11-04 2018-12-05 キヤノン株式会社 固体撮像素子及び撮像装置
JP6520053B2 (ja) 2014-11-06 2019-05-29 株式会社デンソー 光飛行型測距装置
JP6424581B2 (ja) * 2014-11-21 2018-11-21 株式会社デンソー 光飛行型測距装置
JP6539990B2 (ja) * 2014-11-14 2019-07-10 株式会社デンソー 光飛行型測距装置
DE112015005163T5 (de) 2014-11-14 2017-07-27 Denso Corporation Flugzeitabstandsmessvorrichtung
US10068935B2 (en) 2015-01-22 2018-09-04 X-Fab Semiconductor Foundries Ag Image lag free pixel
JP6291632B1 (ja) * 2015-02-19 2018-03-14 コーニンクレッカ フィリップス エヌ ヴェＫｏｎｉｎｋｌｉｊｋｅ Ｐｈｉｌｉｐｓ Ｎ．Ｖ． 赤外線レーザ照明装置
US9864048B2 (en) * 2015-05-17 2018-01-09 Microsoft Technology Licensing, Llc. Gated time of flight camera
US9819930B2 (en) 2015-05-26 2017-11-14 Omnivision Technologies, Inc. Time of flight imaging with improved initiation signaling
FR3039928B1 (fr) 2015-08-03 2019-06-07 Teledyne E2V Semiconductors Sas Procede de commande d'un capteur d'image a pixels actifs
US10761599B2 (en) * 2015-08-04 2020-09-01 Artilux, Inc. Eye gesture tracking
EP3159711A1 (en) 2015-10-23 2017-04-26 Xenomatix NV System and method for determining a distance to an object
CN108463995B (zh) * 2015-11-26 2020-11-03 欧都思影像公司 成像系统、距离测量装置、操作成像系统和距离测量装置的方法
JP6700758B2 (ja) * 2015-12-04 2020-05-27 キヤノン株式会社 撮像装置の駆動方法
US9876047B2 (en) * 2015-12-15 2018-01-23 Canon Kabushiki Kaisha Photoelectric conversion apparatus and information processing apparatus
FR3046495B1 (fr) * 2015-12-30 2018-02-16 Stmicroelectronics (Crolles 2) Sas Pixel de detection de temps de vol
EP3414599B1 (en) 2016-02-08 2019-12-18 Denso Corporation Time-of-flight distance measuring device and method for detecting multipath error
WO2017138032A1 (en) 2016-02-08 2017-08-17 Denso Corporation Time-of-flight distance measuring device and method for detecting multipath error
DE102016208347B4 (de) * 2016-05-13 2017-12-21 Infineon Technologies Ag Optische Sensorvorrichtung und Verfahren zum Betreiben eines Laufzeitsensors
WO2018030318A1 (ja) 2016-08-10 2018-02-15 パナソニックＩｐマネジメント株式会社 投光撮像装置および投光撮像方法
EP3301477A1 (en) 2016-10-03 2018-04-04 Xenomatix NV System for determining a distance to an object
EP3301480A1 (en) 2016-10-03 2018-04-04 Xenomatix NV System and method for determining a distance to an object
EP3301478A1 (en) 2016-10-03 2018-04-04 Xenomatix NV System for determining a distance to an object
EP3301479A1 (en) 2016-10-03 2018-04-04 Xenomatix NV Method for subtracting background light from an exposure value of a pixel in an imaging array, and pixel for use in same
US10291895B2 (en) 2016-10-25 2019-05-14 Omnivision Technologies, Inc. Time of flight photosensor
JP6988071B2 (ja) * 2016-11-16 2022-01-05 株式会社リコー 距離測定装置及び距離測定方法
CN108209867B (zh) * 2016-12-15 2022-03-18 松下知识产权经营株式会社 摄像装置
EP3343246A1 (en) 2016-12-30 2018-07-04 Xenomatix NV System for characterizing surroundings of a vehicle
EP3367668B1 (en) * 2017-02-24 2019-10-02 Melexis Technologies NV Noise reduction in sample and hold systems
GB201704443D0 (en) * 2017-03-21 2017-05-03 Photonic Vision Ltd Time of flight sensor
EP3392674A1 (en) 2017-04-23 2018-10-24 Xenomatix NV A pixel structure
JP6742531B2 (ja) * 2017-09-29 2020-08-19 ソニーセミコンダクタソリューションズ株式会社 時間計測デバイスおよび時間計測装置
JP6692339B2 (ja) 2017-10-13 2020-05-13 株式会社ソディック 金属粉末積層造形用の金属粉末材料
WO2019115839A1 (en) 2017-12-15 2019-06-20 Xenomatix Nv System and method for determining a distance to an object
US10356351B1 (en) * 2018-02-07 2019-07-16 Omnivision Technologies, Inc. Image sensor with dual conversion gain readout
CN108322678B (zh) * 2018-03-01 2020-03-31 思特威(上海)电子科技有限公司 支持全局曝光的tof图像传感器像素结构及tof成像系统
CN108282626B (zh) * 2018-03-01 2021-04-23 思特威(上海)电子科技股份有限公司 Tof图像传感器像素结构及tof成像系统
CN108419032B (zh) * 2018-03-01 2021-01-05 思特威(上海)电子科技有限公司 支持多种曝光模式的hdr图像传感器像素结构及成像系统
WO2019196049A1 (zh) * 2018-04-12 2019-10-17 深圳市汇顶科技股份有限公司 影像传感系统及电子装置
US10497738B2 (en) * 2018-04-20 2019-12-03 Omnivision Technologies, Inc. First photon correlated time-of-flight sensor
CN110412607B (zh) * 2018-04-28 2021-12-03 思特威(上海)电子科技股份有限公司 具有高动态范围的tof像素电路及测距系统
CN110418083B (zh) * 2018-04-28 2021-09-17 思特威(上海)电子科技股份有限公司 具有hdr模式的tof像素电路及测距系统
US10684373B2 (en) 2018-05-07 2020-06-16 Omnivision Technologies, Inc. Image sensor with boosted photodiodes for time of flight measurements
US10986290B2 (en) * 2018-05-18 2021-04-20 Omnivision Technologies, Inc. Wide dynamic range image sensor with global shutter
JP7419336B2 (ja) 2018-07-16 2024-01-22 ギガジョット テクノロジー，インコーポレイテッド 非アバランシェ光検出器を有する高感度深度センサ
WO2020049906A1 (ja) 2018-09-03 2020-03-12 パナソニックＩｐマネジメント株式会社 距離測定装置
WO2020188782A1 (ja) * 2019-03-20 2020-09-24 株式会社ブルックマンテクノロジ 距離画像撮像装置、距離画像撮像システム、および距離画像撮像方法
CN111108411B (zh) * 2019-10-10 2021-06-08 深圳市汇顶科技股份有限公司 光传感器、基于飞行时间的测距系统和电子装置
US11768277B2 (en) * 2019-11-05 2023-09-26 Pixart Imaging Incorporation Time-of-flight sensor and control method thereof
JP7175872B2 (ja) * 2019-11-14 2022-11-21 株式会社日立エルジーデータストレージ 測距装置
KR20210072423A (ko) * 2019-12-09 2021-06-17 에스케이하이닉스 주식회사 비행시간거리측정 방식의 센싱 시스템 및 이미지 센서
KR20210115715A (ko) * 2020-03-16 2021-09-27 에스케이하이닉스 주식회사 이미지 센싱 장치 및 그의 동작 방법
CN215953857U (zh) * 2020-09-11 2022-03-04 神盾股份有限公司 Tof光学感测模块

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6580496B2 (en) 2000-11-09 2003-06-17 Canesta, Inc. Systems for CMOS-compatible three-dimensional image sensing using quantum efficiency modulation
JP4235729B2 (ja) 2003-02-03 2009-03-11 国立大学法人静岡大学 距離画像センサ
US7542085B2 (en) * 2003-11-26 2009-06-02 Aptina Imaging Corporation Image sensor with a capacitive storage node linked to transfer gate
JP3906202B2 (ja) 2003-12-15 2007-04-18 株式会社東芝 固体撮像装置およびそれを利用した撮像システム
US7045754B2 (en) * 2004-03-30 2006-05-16 Omnivision Technologies, Inc. Hybrid charge coupled CMOS image sensor having an amplification transistor controlled by a sense node
WO2007119626A1 (ja) * 2006-03-31 2007-10-25 National University Corporation Shizuoka University 半導体測距素子及び固体撮像装置
US8184191B2 (en) * 2006-08-09 2012-05-22 Tohoku University Optical sensor and solid-state imaging device
KR101467509B1 (ko) 2008-07-25 2014-12-01 삼성전자주식회사 이미지 센서 및 이미지 센서 동작 방법
JP5585903B2 (ja) 2008-07-30 2014-09-10 国立大学法人静岡大学 距離画像センサ、及び撮像信号を飛行時間法により生成する方法
KR100984698B1 (ko) * 2008-08-04 2010-10-01 주식회사 동부하이텍 이미지 센서 및 그 구동 방법
JP5404112B2 (ja) 2009-03-12 2014-01-29 キヤノン株式会社 固体撮像素子、その駆動方法及び撮像システム
US8089036B2 (en) * 2009-04-30 2012-01-03 Omnivision Technologies, Inc. Image sensor with global shutter and in pixel storage transistor
KR101668869B1 (ko) * 2009-05-29 2016-10-28 삼성전자주식회사 거리 센서, 3차원 이미지 센서 및 그 거리 산출 방법
TW201115183A (en) * 2009-10-20 2011-05-01 Ind Tech Res Inst Stereovision system and calculation method for the distance between object and diffractive optical element
TWI427273B (zh) * 2010-07-29 2014-02-21 Pixart Imaging Inc 可提高訊雜比之測距裝置及其方法
KR20110093212A (ko) 2010-02-12 2011-08-18 삼성전자주식회사 이미지 센서의 픽셀 및 픽셀 동작 방법
KR101711061B1 (ko) * 2010-02-12 2017-02-28 삼성전자주식회사 깊이 추정 장치를 이용한 깊이 정보 추정 방법
JP2011243862A (ja) 2010-05-20 2011-12-01 Sony Corp 撮像デバイス及び撮像装置
TWM423406U (en) * 2011-09-14 2012-02-21 Tlj Intertech Inc Object-depth calculation device
US8642938B2 (en) * 2012-01-13 2014-02-04 Omnivision Technologies, Inc. Shared time of flight pixel
US8686367B2 (en) * 2012-03-01 2014-04-01 Omnivision Technologies, Inc. Circuit configuration and method for time of flight sensor

Also Published As

Publication number Publication date
KR20130100735A (ko) 2013-09-11
EP2634595A1 (en) 2013-09-04
JP5579893B2 (ja) 2014-08-27
CN103297714B (zh) 2016-07-06
TWI480586B (zh) 2015-04-11
TW201339644A (zh) 2013-10-01
US20130228691A1 (en) 2013-09-05
CN103297714A (zh) 2013-09-11
JP2013183460A (ja) 2013-09-12
US8686367B2 (en) 2014-04-01
EP2634595B1 (en) 2020-01-15
KR101465318B1 (ko) 2014-12-04

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