HK118597A - Bonding method using solder composed of multiple alternating gold and tin layers - Google Patents

Bonding method using solder composed of multiple alternating gold and tin layers

Info

Publication number
HK118597A
HK118597A HK118597A HK118597A HK118597A HK 118597 A HK118597 A HK 118597A HK 118597 A HK118597 A HK 118597A HK 118597 A HK118597 A HK 118597A HK 118597 A HK118597 A HK 118597A
Authority
HK
Hong Kong
Prior art keywords
bonding method
tin layers
multiple alternating
solder composed
gold
Prior art date
Application number
HK118597A
Other languages
English (en)
Inventor
Avishay Katz
Chien-Hsun Lee
King Lien Tai
Yiu-Man Wong
Original Assignee
At & T Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by At & T Corp filed Critical At & T Corp
Publication of HK118597A publication Critical patent/HK118597A/xx

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/001—Interlayers, transition pieces for metallurgical bonding of workpieces
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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Die Bonding (AREA)
  • Semiconductor Lasers (AREA)
HK118597A 1991-11-15 1997-06-26 Bonding method using solder composed of multiple alternating gold and tin layers HK118597A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/792,559 US5197654A (en) 1991-11-15 1991-11-15 Bonding method using solder composed of multiple alternating gold and tin layers

Publications (1)

Publication Number Publication Date
HK118597A true HK118597A (en) 1997-09-05

Family

ID=25157327

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HK118597A HK118597A (en) 1991-11-15 1997-06-26 Bonding method using solder composed of multiple alternating gold and tin layers

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EP (1) EP0542475B1 (ja)
JP (1) JPH0777280B2 (ja)
CA (1) CA2080931C (ja)
DE (1) DE69217617T2 (ja)
HK (1) HK118597A (ja)
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Publication number Publication date
DE69217617T2 (de) 1997-07-17
EP0542475A1 (en) 1993-05-19
CA2080931C (en) 1994-08-23
JPH0669608A (ja) 1994-03-11
DE69217617D1 (de) 1997-04-03
JPH0777280B2 (ja) 1995-08-16
US5197654A (en) 1993-03-30
CA2080931A1 (en) 1993-05-16
EP0542475B1 (en) 1997-02-26
SG43759A1 (en) 1997-11-14

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