HK1180356A1 - 環氧樹脂固化劑、環氧樹脂組合物和層壓用粘接劑 - Google Patents

環氧樹脂固化劑、環氧樹脂組合物和層壓用粘接劑

Info

Publication number
HK1180356A1
HK1180356A1 HK13107492.3A HK13107492A HK1180356A1 HK 1180356 A1 HK1180356 A1 HK 1180356A1 HK 13107492 A HK13107492 A HK 13107492A HK 1180356 A1 HK1180356 A1 HK 1180356A1
Authority
HK
Hong Kong
Prior art keywords
epoxy resin
laminate
resin composition
agent
curing agent
Prior art date
Application number
HK13107492.3A
Other languages
English (en)
Inventor
松本信彥
本多榮
熊本佳奈
Original Assignee
三菱瓦斯化學株式會社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 三菱瓦斯化學株式會社 filed Critical 三菱瓦斯化學株式會社
Publication of HK1180356A1 publication Critical patent/HK1180356A1/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C08G59/56—Amines together with other curing agents
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
    • C08G59/4014—Nitrogen containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/44—Amides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/44—Amides
    • C08G59/46—Amides together with other curing agents
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y10T428/31515—As intermediate layer

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Laminated Bodies (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Wrappers (AREA)
  • Epoxy Resins (AREA)
  • Packages (AREA)
HK13107492.3A 2010-04-21 2013-06-26 環氧樹脂固化劑、環氧樹脂組合物和層壓用粘接劑 HK1180356A1 (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2010097920 2010-04-21
PCT/JP2011/059524 WO2011132637A1 (ja) 2010-04-21 2011-04-18 エポキシ樹脂硬化剤、エポキシ樹脂組成物及びラミネート用接着剤

Publications (1)

Publication Number Publication Date
HK1180356A1 true HK1180356A1 (zh) 2013-10-18

Family

ID=44834156

Family Applications (1)

Application Number Title Priority Date Filing Date
HK13107492.3A HK1180356A1 (zh) 2010-04-21 2013-06-26 環氧樹脂固化劑、環氧樹脂組合物和層壓用粘接劑

Country Status (8)

Country Link
US (1) US9169347B2 (zh)
EP (1) EP2562194A4 (zh)
JP (1) JP5641043B2 (zh)
KR (1) KR20130088007A (zh)
CN (1) CN102858838B (zh)
HK (1) HK1180356A1 (zh)
TW (1) TWI507440B (zh)
WO (1) WO2011132637A1 (zh)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8431653B2 (en) * 2005-12-16 2013-04-30 Mitsubishi Electric Company, Inc. Curing agent composition for epoxy resins and epoxy resin composition
CN103052503B (zh) * 2010-08-05 2014-12-17 三菱瓦斯化学株式会社 层压薄膜
JP5640770B2 (ja) * 2011-01-28 2014-12-17 三菱瓦斯化学株式会社 エポキシ樹脂硬化剤の製造方法
CN104487476B (zh) * 2012-04-27 2017-07-14 三菱瓦斯化学株式会社 环氧树脂固化剂、环氧树脂组合物和阻气性粘接剂以及阻气性层叠体
JP6195102B2 (ja) * 2013-02-28 2017-09-13 キョーラク株式会社 包装袋
JP6537248B2 (ja) * 2014-10-31 2019-07-03 株式会社康井精機 機能性物質薄膜素材の製造方法並びに機能性物質薄膜素材およびその積層体
JP6587090B2 (ja) 2015-03-30 2019-10-09 国立大学法人名古屋大学 転削工具
JP6718870B2 (ja) * 2015-07-01 2020-07-08 株式会社細川洋行 積層体、包装袋、口栓付包装袋および水素水入り口栓付包装袋
US10854556B2 (en) * 2016-10-12 2020-12-01 Advanced Semiconductor Engineering Korea, Inc. Semiconductor package device and method of manufacturing the same
EP3532290B1 (en) 2016-10-28 2022-01-05 Kuraray Europe GmbH Wedge-shaped multilayer interlayer and glass laminate
CN114835879A (zh) * 2022-04-24 2022-08-02 中国林业科学研究院林产化学工业研究所 一种以硅烷偶联剂固化的双组分水性树脂体系及其制备方法

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE1004334A3 (fr) 1991-01-08 1992-11-03 Solvay Compositions polymeriques a proprietes barriere et materiaux d'emballage faconnes a partir de ces compositions.
JP2848047B2 (ja) 1991-08-23 1999-01-20 東洋インキ製造株式会社 接着剤組成物
JP3183300B2 (ja) * 1991-11-15 2001-07-09 三菱瓦斯化学株式会社 酸素捕捉性組成物
JPH09316422A (ja) 1996-05-28 1997-12-09 Nippon Polyurethane Ind Co Ltd ラミネート用接着剤組成物、およびそれを用いたラミネートフィルムの製造方法
US20020006484A1 (en) 1998-05-20 2002-01-17 Balasubramaniam Ramalingam Adhesive and coating formulations for flexible packaging
JP2000154365A (ja) 1998-11-18 2000-06-06 Takeda Chem Ind Ltd ドライラミネート用接着剤
JP4763190B2 (ja) 2000-12-26 2011-08-31 三菱瓦斯化学株式会社 ガスバリア性塗料用組成物および塗料
CA2365922C (en) * 2000-12-26 2010-03-09 Mitsubishi Gas Chemical Company, Inc. Composition for coating having a gas barrier property, coating and coated film having a gas barrier property using the same
JP4366563B2 (ja) * 2001-09-05 2009-11-18 三菱瓦斯化学株式会社 ガスバリア性ラミネート用接着剤およびラミネートフィルム
ES2528402T3 (es) * 2001-09-05 2015-02-09 Mitsubishi Gas Chemical Company, Inc. Adhesivo para laminados de barrera para gas y películas laminadas
JP2003251775A (ja) 2002-03-01 2003-09-09 Mitsubishi Gas Chem Co Inc 多層構造体
CN100343046C (zh) * 2002-06-25 2007-10-17 三菱瓦斯化学株式会社 气体屏蔽性容器
JP4189634B2 (ja) 2002-06-25 2008-12-03 三菱瓦斯化学株式会社 ガスバリア性樹脂組成物、塗料および接着剤
KR100713256B1 (ko) * 2002-12-04 2007-05-02 데노버스 엘엘씨 폴리부타디엔, 멜라민 및 에폭시 작용성 화합물에 대한경화제로서 사용되는 금속-아크릴레이트
EP2189278B1 (en) * 2004-12-10 2011-08-17 Mitsubishi Gas Chemical Company, Inc. Laminate film
WO2006074394A2 (en) * 2005-01-07 2006-07-13 Denovus Llc Heat activated sealants and foamed materials
CN101679611B (zh) 2007-05-21 2013-01-09 三菱瓦斯化学株式会社 胺类环氧树脂固化剂、含有该固化剂的气体阻隔性环氧树脂组合物、涂料和层压用粘合剂
JP2009167335A (ja) 2008-01-18 2009-07-30 Mitsubishi Gas Chem Co Inc 非鉄金属に対する接着性に優れた被覆材料
CN102812067B (zh) 2010-03-16 2014-09-10 三菱瓦斯化学株式会社 环氧树脂固化剂、环氧树脂组合物以及层压用粘接剂
CN103052503B (zh) * 2010-08-05 2014-12-17 三菱瓦斯化学株式会社 层压薄膜

Also Published As

Publication number Publication date
CN102858838B (zh) 2015-04-01
KR20130088007A (ko) 2013-08-07
US9169347B2 (en) 2015-10-27
TW201211095A (en) 2012-03-16
US20130028540A1 (en) 2013-01-31
EP2562194A1 (en) 2013-02-27
JPWO2011132637A1 (ja) 2013-07-18
WO2011132637A1 (ja) 2011-10-27
JP5641043B2 (ja) 2014-12-17
EP2562194A4 (en) 2016-08-03
TWI507440B (zh) 2015-11-11
CN102858838A (zh) 2013-01-02

Similar Documents

Publication Publication Date Title
HK1178925A1 (zh) 環氧樹脂固化劑、環氧樹脂組合物以及層壓用粘接劑
HK1180356A1 (zh) 環氧樹脂固化劑、環氧樹脂組合物和層壓用粘接劑
EP2392603A4 (en) EPOXY RESIN COMPOSITION, HARDENERS AND CLEANING ACCENT
EP2842982A4 (en) EPOXY RESIN HARDENERS, EPOXY RESIN COMPOSITION, GAS BARRIER ADHESIVES AND GAS BARRIER LAMINATE BODIES
EP2530103A4 (en) POLYIMIDE RESIN COMPOSITION, ADHESIVE AGENT AND LAMINATE CONTAINING EACH COMPOSITION
HK1204795A1 (zh) 環氧樹脂固化劑、環氧樹脂組合物、阻氣性黏接劑以及阻氣性層疊體
EP2623533A4 (en) Epoxy resin composition, prepreg and fiber-reinforced compound material
EP2426153A4 (en) CURABLE RESIN COMPOSITION, ADHESIVE COMPOSITION, AND CURED OBJECT OR COMPOSITE
EP2660261A4 (en) TWIN COMPONENT HARDENABLE OXYGEN ABSORBABLE RESIN COMPOSITION AND OXYGEN ABSORBENT ADHESIVE
SG10201501469PA (en) Resin composition, prepreg, and laminated sheet
EP2578631A4 (en) RESIN COMPOSITION AND PREPREG AND LAMINATED FILM THEREWITH
EP2557121A4 (en) RESIN COMPOSITION, PRE-IMPREGNATED AND LAMINATE
SG10201602081SA (en) Resin composition, prepreg, and laminate
GB2497906B (en) Epoxy resin composition for transparent sheets and cured product thereof
EP2915830A4 (en) EPOXY RESIN CURING AGENT
EP2620460A4 (en) Epoxy resin composition for fiber-reinforced composite material, prepreg, and fiber-reinforced composite material
EP2612885A4 (en) Resin composition, prepreg, and laminate
EP2532693A4 (en) Curable epoxy resin composition
EP2716676A4 (en) RESIN COMPOSITION, PREPREG AND LAMINATE
EP2623534A4 (en) Water-dispersible epoxy resin, aqueous epoxy resin composition and cured article thereof
EP2647667A4 (en) HARDENABLE EPOXY RESIN COMPOSITION
PL2640773T3 (pl) Utwardzająca się szybko masa o dobrych właściwościach dotyczących przyczepności
EP2770000A4 (en) BY ARTICULAR RADIATION HARDENABLE ARTIFICIAL RESIN COMPOSITION, ADHESIVE AND LAYERING FOIL
PL2571917T3 (pl) Semikarbazony jako przyspieszacze utwardzania żywic epoksydowych
EP2657293A4 (en) WATER ABSORBENT RESIN COMPOSITION AND LAMINATE MANUFACTURED THEREWITH

Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20190413