HK1180356A1 - Epoxy resin curing agent, epoxy resin composition, and adhesive agent for laminate - Google Patents

Epoxy resin curing agent, epoxy resin composition, and adhesive agent for laminate

Info

Publication number
HK1180356A1
HK1180356A1 HK13107492.3A HK13107492A HK1180356A1 HK 1180356 A1 HK1180356 A1 HK 1180356A1 HK 13107492 A HK13107492 A HK 13107492A HK 1180356 A1 HK1180356 A1 HK 1180356A1
Authority
HK
Hong Kong
Prior art keywords
epoxy resin
laminate
resin composition
agent
curing agent
Prior art date
Application number
HK13107492.3A
Other languages
English (en)
Chinese (zh)
Inventor
松本信彥
本多榮
熊本佳奈
Original Assignee
三菱瓦斯化學株式會社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 三菱瓦斯化學株式會社 filed Critical 三菱瓦斯化學株式會社
Publication of HK1180356A1 publication Critical patent/HK1180356A1/xx

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C08G59/56—Amines together with other curing agents
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
    • C08G59/4014—Nitrogen containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/44—Amides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/44—Amides
    • C08G59/46—Amides together with other curing agents
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y10T428/31515—As intermediate layer

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Laminated Bodies (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Wrappers (AREA)
  • Epoxy Resins (AREA)
  • Packages (AREA)
HK13107492.3A 2010-04-21 2013-06-26 Epoxy resin curing agent, epoxy resin composition, and adhesive agent for laminate HK1180356A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2010097920 2010-04-21
PCT/JP2011/059524 WO2011132637A1 (fr) 2010-04-21 2011-04-18 Agent de durcissement de résine époxy, composition de résine époxy et agent adhésif pour stratifié

Publications (1)

Publication Number Publication Date
HK1180356A1 true HK1180356A1 (en) 2013-10-18

Family

ID=44834156

Family Applications (1)

Application Number Title Priority Date Filing Date
HK13107492.3A HK1180356A1 (en) 2010-04-21 2013-06-26 Epoxy resin curing agent, epoxy resin composition, and adhesive agent for laminate

Country Status (8)

Country Link
US (1) US9169347B2 (fr)
EP (1) EP2562194A4 (fr)
JP (1) JP5641043B2 (fr)
KR (1) KR20130088007A (fr)
CN (1) CN102858838B (fr)
HK (1) HK1180356A1 (fr)
TW (1) TWI507440B (fr)
WO (1) WO2011132637A1 (fr)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8431653B2 (en) * 2005-12-16 2013-04-30 Mitsubishi Electric Company, Inc. Curing agent composition for epoxy resins and epoxy resin composition
CN103052503B (zh) * 2010-08-05 2014-12-17 三菱瓦斯化学株式会社 层压薄膜
JP5640770B2 (ja) * 2011-01-28 2014-12-17 三菱瓦斯化学株式会社 エポキシ樹脂硬化剤の製造方法
CN104487476B (zh) * 2012-04-27 2017-07-14 三菱瓦斯化学株式会社 环氧树脂固化剂、环氧树脂组合物和阻气性粘接剂以及阻气性层叠体
JP6195102B2 (ja) * 2013-02-28 2017-09-13 キョーラク株式会社 包装袋
JP6537248B2 (ja) * 2014-10-31 2019-07-03 株式会社康井精機 機能性物質薄膜素材の製造方法並びに機能性物質薄膜素材およびその積層体
JP6587090B2 (ja) 2015-03-30 2019-10-09 国立大学法人名古屋大学 転削工具
WO2017002753A1 (fr) * 2015-07-01 2017-01-05 株式会社細川洋行 Stratifié, sac d'emballage, sac d'emballage avec bec verseur, et emballage d'eau hydrogénée avec bec verseur
US10854556B2 (en) * 2016-10-12 2020-12-01 Advanced Semiconductor Engineering Korea, Inc. Semiconductor package device and method of manufacturing the same
US20180117883A1 (en) 2016-10-28 2018-05-03 Kuraray America, Inc. Wedge-shaped multilayer interlayer and glass laminate
CN114835879A (zh) * 2022-04-24 2022-08-02 中国林业科学研究院林产化学工业研究所 一种以硅烷偶联剂固化的双组分水性树脂体系及其制备方法
CN115447244B (zh) * 2022-10-19 2024-05-31 浙江和顺新材料有限公司 一种吸音隔音多层薄膜及其复合结构、壁纸及制备方法

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE1004334A3 (fr) 1991-01-08 1992-11-03 Solvay Compositions polymeriques a proprietes barriere et materiaux d'emballage faconnes a partir de ces compositions.
JP2848047B2 (ja) 1991-08-23 1999-01-20 東洋インキ製造株式会社 接着剤組成物
JP3183300B2 (ja) 1991-11-15 2001-07-09 三菱瓦斯化学株式会社 酸素捕捉性組成物
JPH09316422A (ja) 1996-05-28 1997-12-09 Nippon Polyurethane Ind Co Ltd ラミネート用接着剤組成物、およびそれを用いたラミネートフィルムの製造方法
US20020006484A1 (en) 1998-05-20 2002-01-17 Balasubramaniam Ramalingam Adhesive and coating formulations for flexible packaging
JP2000154365A (ja) 1998-11-18 2000-06-06 Takeda Chem Ind Ltd ドライラミネート用接着剤
US7267877B2 (en) 2000-12-26 2007-09-11 Mitsubishi Gas Chemical Company, Inc. Composition for coating having a gas barrier property, coating and coated film having a gas barrier property used the same
JP4763190B2 (ja) 2000-12-26 2011-08-31 三菱瓦斯化学株式会社 ガスバリア性塗料用組成物および塗料
AU2002328410B2 (en) * 2001-09-05 2008-06-26 Mitsubishi Gas Chemical Company, Inc. Adhesive for gas barrier laminates and laminated films
JP4366563B2 (ja) * 2001-09-05 2009-11-18 三菱瓦斯化学株式会社 ガスバリア性ラミネート用接着剤およびラミネートフィルム
JP2003251775A (ja) 2002-03-01 2003-09-09 Mitsubishi Gas Chem Co Inc 多層構造体
CN100343046C (zh) * 2002-06-25 2007-10-17 三菱瓦斯化学株式会社 气体屏蔽性容器
JP4189634B2 (ja) * 2002-06-25 2008-12-03 三菱瓦斯化学株式会社 ガスバリア性樹脂組成物、塗料および接着剤
BR0316860A (pt) * 2002-12-04 2005-10-25 Denovus Llc Composição curável, e composição curável por calor
EP1826000B1 (fr) * 2004-12-10 2010-12-01 Mitsubishi Gas Chemical Company, Inc. Film stratifié
WO2006074394A2 (fr) * 2005-01-07 2006-07-13 Denovus Llc Agents d'etancheite et materiaux a base de mousse actives par la chaleur
EP2149586B1 (fr) 2007-05-21 2018-01-03 Mitsubishi Gas Chemical Company, Inc. Agent de durcissement pour résine amine époxy, composition de résine époxy formant une barrière contre les gaz qui comprend l'agent de durcissement, agent de revêtement et agent adhésif pour stratifié
JP2009167335A (ja) * 2008-01-18 2009-07-30 Mitsubishi Gas Chem Co Inc 非鉄金属に対する接着性に優れた被覆材料
US9303116B2 (en) 2010-03-16 2016-04-05 Mitsubishi Gas Chemical Company, Inc. Epoxy resin curing agent, epoxy resin composition, and adhesive agent for laminate
CN103052503B (zh) * 2010-08-05 2014-12-17 三菱瓦斯化学株式会社 层压薄膜

Also Published As

Publication number Publication date
TW201211095A (en) 2012-03-16
KR20130088007A (ko) 2013-08-07
JP5641043B2 (ja) 2014-12-17
WO2011132637A1 (fr) 2011-10-27
US9169347B2 (en) 2015-10-27
JPWO2011132637A1 (ja) 2013-07-18
CN102858838A (zh) 2013-01-02
EP2562194A4 (fr) 2016-08-03
CN102858838B (zh) 2015-04-01
TWI507440B (zh) 2015-11-11
EP2562194A1 (fr) 2013-02-27
US20130028540A1 (en) 2013-01-31

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Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20190413