HK1179753A1 - Woven mesh substrate with semiconductors, and method and device for manufacturing same - Google Patents
Woven mesh substrate with semiconductors, and method and device for manufacturing sameInfo
- Publication number
- HK1179753A1 HK1179753A1 HK13106735.2A HK13106735A HK1179753A1 HK 1179753 A1 HK1179753 A1 HK 1179753A1 HK 13106735 A HK13106735 A HK 13106735A HK 1179753 A1 HK1179753 A1 HK 1179753A1
- Authority
- HK
- Hong Kong
- Prior art keywords
- semiconductors
- manufacturing same
- woven mesh
- mesh substrate
- substrate
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title 1
- 238000000034 method Methods 0.000 title 1
- 239000004065 semiconductor Substances 0.000 title 1
- 239000000758 substrate Substances 0.000 title 1
Classifications
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- D—TEXTILES; PAPER
- D02—YARNS; MECHANICAL FINISHING OF YARNS OR ROPES; WARPING OR BEAMING
- D02G—CRIMPING OR CURLING FIBRES, FILAMENTS, THREADS, OR YARNS; YARNS OR THREADS
- D02G3/00—Yarns or threads, e.g. fancy yarns; Processes or apparatus for the production thereof, not otherwise provided for
- D02G3/44—Yarns or threads characterised by the purpose for which they are designed
- D02G3/441—Yarns or threads with antistatic, conductive or radiation-shielding properties
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
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- D—TEXTILES; PAPER
- D03—WEAVING
- D03D—WOVEN FABRICS; METHODS OF WEAVING; LOOMS
- D03D1/00—Woven fabrics designed to make specified articles
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- D—TEXTILES; PAPER
- D03—WEAVING
- D03D—WOVEN FABRICS; METHODS OF WEAVING; LOOMS
- D03D1/00—Woven fabrics designed to make specified articles
- D03D1/0076—Photovoltaic fabrics
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- D—TEXTILES; PAPER
- D03—WEAVING
- D03D—WOVEN FABRICS; METHODS OF WEAVING; LOOMS
- D03D1/00—Woven fabrics designed to make specified articles
- D03D1/0088—Fabrics having an electronic function
-
- D—TEXTILES; PAPER
- D03—WEAVING
- D03D—WOVEN FABRICS; METHODS OF WEAVING; LOOMS
- D03D13/00—Woven fabrics characterised by the special disposition of the warp or weft threads, e.g. with curved weft threads, with discontinuous warp threads, with diagonal warp or weft
- D03D13/008—Woven fabrics characterised by the special disposition of the warp or weft threads, e.g. with curved weft threads, with discontinuous warp threads, with diagonal warp or weft characterised by weave density or surface weight
-
- D—TEXTILES; PAPER
- D03—WEAVING
- D03D—WOVEN FABRICS; METHODS OF WEAVING; LOOMS
- D03D15/00—Woven fabrics characterised by the material, structure or properties of the fibres, filaments, yarns, threads or other warp or weft elements used
- D03D15/20—Woven fabrics characterised by the material, structure or properties of the fibres, filaments, yarns, threads or other warp or weft elements used characterised by the material of the fibres or filaments constituting the yarns or threads
- D03D15/242—Woven fabrics characterised by the material, structure or properties of the fibres, filaments, yarns, threads or other warp or weft elements used characterised by the material of the fibres or filaments constituting the yarns or threads inorganic, e.g. basalt
- D03D15/267—Glass
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- D—TEXTILES; PAPER
- D03—WEAVING
- D03D—WOVEN FABRICS; METHODS OF WEAVING; LOOMS
- D03D15/00—Woven fabrics characterised by the material, structure or properties of the fibres, filaments, yarns, threads or other warp or weft elements used
- D03D15/40—Woven fabrics characterised by the material, structure or properties of the fibres, filaments, yarns, threads or other warp or weft elements used characterised by the structure of the yarns or threads
- D03D15/47—Woven fabrics characterised by the material, structure or properties of the fibres, filaments, yarns, threads or other warp or weft elements used characterised by the structure of the yarns or threads multicomponent, e.g. blended yarns or threads
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- D—TEXTILES; PAPER
- D03—WEAVING
- D03D—WOVEN FABRICS; METHODS OF WEAVING; LOOMS
- D03D41/00—Looms not otherwise provided for, e.g. for weaving chenille yarn; Details peculiar to these looms
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- D—TEXTILES; PAPER
- D03—WEAVING
- D03D—WOVEN FABRICS; METHODS OF WEAVING; LOOMS
- D03D9/00—Open-work fabrics
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- D—TEXTILES; PAPER
- D03—WEAVING
- D03J—AUXILIARY WEAVING APPARATUS; WEAVERS' TOOLS; SHUTTLES
- D03J1/00—Auxiliary apparatus combined with or associated with looms
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- D—TEXTILES; PAPER
- D03—WEAVING
- D03J—AUXILIARY WEAVING APPARATUS; WEAVERS' TOOLS; SHUTTLES
- D03J1/00—Auxiliary apparatus combined with or associated with looms
- D03J1/06—Auxiliary apparatus combined with or associated with looms for treating fabric
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/0248—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies
- H01L31/0352—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their shape or by the shapes, relative sizes or disposition of the semiconductor regions
- H01L31/035272—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their shape or by the shapes, relative sizes or disposition of the semiconductor regions characterised by at least one potential jump barrier or surface barrier
- H01L31/035281—Shape of the body
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/048—Encapsulation of modules
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/05—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells
- H01L31/0504—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells specially adapted for series or parallel connection of solar cells in a module
- H01L31/0508—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells specially adapted for series or parallel connection of solar cells in a module the interconnection means having a particular shape
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/06—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by potential barriers
- H01L31/068—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by potential barriers the potential barriers being only of the PN homojunction type, e.g. bulk silicon PN homojunction solar cells or thin film polycrystalline silicon PN homojunction solar cells
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
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- D—TEXTILES; PAPER
- D10—INDEXING SCHEME ASSOCIATED WITH SUBLASSES OF SECTION D, RELATING TO TEXTILES
- D10B—INDEXING SCHEME ASSOCIATED WITH SUBLASSES OF SECTION D, RELATING TO TEXTILES
- D10B2101/00—Inorganic fibres
- D10B2101/02—Inorganic fibres based on oxides or oxide ceramics, e.g. silicates
- D10B2101/06—Glass
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- D—TEXTILES; PAPER
- D10—INDEXING SCHEME ASSOCIATED WITH SUBLASSES OF SECTION D, RELATING TO TEXTILES
- D10B—INDEXING SCHEME ASSOCIATED WITH SUBLASSES OF SECTION D, RELATING TO TEXTILES
- D10B2101/00—Inorganic fibres
- D10B2101/10—Inorganic fibres based on non-oxides other than metals
- D10B2101/12—Carbon; Pitch
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- D—TEXTILES; PAPER
- D10—INDEXING SCHEME ASSOCIATED WITH SUBLASSES OF SECTION D, RELATING TO TEXTILES
- D10B—INDEXING SCHEME ASSOCIATED WITH SUBLASSES OF SECTION D, RELATING TO TEXTILES
- D10B2101/00—Inorganic fibres
- D10B2101/20—Metallic fibres
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- D—TEXTILES; PAPER
- D10—INDEXING SCHEME ASSOCIATED WITH SUBLASSES OF SECTION D, RELATING TO TEXTILES
- D10B—INDEXING SCHEME ASSOCIATED WITH SUBLASSES OF SECTION D, RELATING TO TEXTILES
- D10B2401/00—Physical properties
- D10B2401/16—Physical properties antistatic; conductive
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- D—TEXTILES; PAPER
- D10—INDEXING SCHEME ASSOCIATED WITH SUBLASSES OF SECTION D, RELATING TO TEXTILES
- D10B—INDEXING SCHEME ASSOCIATED WITH SUBLASSES OF SECTION D, RELATING TO TEXTILES
- D10B2401/00—Physical properties
- D10B2401/20—Physical properties optical
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16245—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/1015—Shape
- H01L2924/1017—Shape being a sphere
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/20—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular shape, e.g. curved or truncated substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/20—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular shape, e.g. curved or truncated substrate
- H01L33/24—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular shape, e.g. curved or truncated substrate of the light emitting region, e.g. non-planar junction
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/505—Wavelength conversion elements characterised by the shape, e.g. plate or foil
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/547—Monocrystalline silicon PV cells
Landscapes
- Engineering & Computer Science (AREA)
- Textile Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Inorganic Chemistry (AREA)
- Crystallography & Structural Chemistry (AREA)
- Photovoltaic Devices (AREA)
- Woven Fabrics (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2010/064459 WO2012026013A1 (ja) | 2010-08-26 | 2010-08-26 | 半導体素子付き織網基材の製造方法、その製造装置及び半導体素子付き織網基材 |
PCT/JP2010/067376 WO2012026046A1 (ja) | 2010-08-26 | 2010-10-04 | 半導体素子付き織網基材の製造方法、その製造装置及び半導体素子付き織網基材 |
PCT/JP2011/052579 WO2012026142A1 (ja) | 2010-08-26 | 2011-02-08 | 半導体素子付き織網基材、その製造方法及びその製造装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
HK1179753A1 true HK1179753A1 (en) | 2013-10-04 |
Family
ID=45723041
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK13106735.2A HK1179753A1 (en) | 2010-08-26 | 2013-06-06 | Woven mesh substrate with semiconductors, and method and device for manufacturing same |
Country Status (10)
Country | Link |
---|---|
US (1) | US8709841B2 (ja) |
EP (1) | EP2610919A4 (ja) |
KR (1) | KR101445351B1 (ja) |
CN (1) | CN103026498B (ja) |
AU (1) | AU2011294612B2 (ja) |
CA (1) | CA2808264C (ja) |
HK (1) | HK1179753A1 (ja) |
MX (1) | MX2013001711A (ja) |
TW (1) | TWI442580B (ja) |
WO (3) | WO2012026013A1 (ja) |
Families Citing this family (54)
Publication number | Priority date | Publication date | Assignee | Title |
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CN103384920B (zh) * | 2011-02-23 | 2016-02-17 | 日立化成株式会社 | 波长转换型太阳能电池密封材料及太阳能电池组件 |
EP2660878B1 (en) * | 2012-05-04 | 2014-12-31 | Sol Invictus Energy | Hybrid woven materials useful in the production of back-contact solar cells. |
EP3035391A4 (en) * | 2013-08-16 | 2017-04-05 | Shenzhen Zhitan Organic Farming Energy Comprehensi | Photoelectric conversion eyelet fabric and sun shed |
TWI509842B (zh) * | 2013-09-02 | 2015-11-21 | Lextar Electronics Corp | 發光二極體的封裝結構及其製造方法 |
US9666733B2 (en) | 2013-09-04 | 2017-05-30 | Hyeon Woo AHN | Solar cell using printed circuit board |
EP2846361B1 (en) * | 2013-09-04 | 2020-05-13 | SOFTPV Inc. | Solar cell using printed circuit board |
CN106104813B (zh) * | 2014-03-19 | 2018-01-02 | 思飞乐电力股份有限公司 | 附有半导体功能元件的功能丝线 |
US9575560B2 (en) | 2014-06-03 | 2017-02-21 | Google Inc. | Radar-based gesture-recognition through a wearable device |
US9811164B2 (en) | 2014-08-07 | 2017-11-07 | Google Inc. | Radar-based gesture sensing and data transmission |
US9921660B2 (en) | 2014-08-07 | 2018-03-20 | Google Llc | Radar-based gesture recognition |
CN104153087B (zh) * | 2014-08-13 | 2015-06-10 | 朱永春 | 一种通丝与综丝杆的连接设备的拉紧装置 |
US10268321B2 (en) | 2014-08-15 | 2019-04-23 | Google Llc | Interactive textiles within hard objects |
US9588625B2 (en) | 2014-08-15 | 2017-03-07 | Google Inc. | Interactive textiles |
US11169988B2 (en) | 2014-08-22 | 2021-11-09 | Google Llc | Radar recognition-aided search |
US9778749B2 (en) | 2014-08-22 | 2017-10-03 | Google Inc. | Occluded gesture recognition |
CN111676561A (zh) * | 2014-09-30 | 2020-09-18 | 苹果公司 | 具有嵌入式电子部件的织物 |
US9600080B2 (en) | 2014-10-02 | 2017-03-21 | Google Inc. | Non-line-of-sight radar-based gesture recognition |
DE102015101121A1 (de) * | 2015-01-27 | 2016-07-28 | Webasto SE | Anordnung für ein Fahrzeugdach |
JP6582187B2 (ja) * | 2015-03-12 | 2019-10-02 | 松文産業株式会社 | 半導体素子付き繊維構造体 |
US10016162B1 (en) | 2015-03-23 | 2018-07-10 | Google Llc | In-ear health monitoring |
US9983747B2 (en) | 2015-03-26 | 2018-05-29 | Google Llc | Two-layer interactive textiles |
US10139916B2 (en) | 2015-04-30 | 2018-11-27 | Google Llc | Wide-field radar-based gesture recognition |
JP6427279B2 (ja) | 2015-04-30 | 2018-11-21 | グーグル エルエルシー | ジェスチャの追跡および認識のための、rfに基づいた微細動作追跡 |
CN107466389B (zh) | 2015-04-30 | 2021-02-12 | 谷歌有限责任公司 | 用于确定类型不可知的rf信号表示的方法和装置 |
US10088908B1 (en) | 2015-05-27 | 2018-10-02 | Google Llc | Gesture detection and interactions |
US9693592B2 (en) * | 2015-05-27 | 2017-07-04 | Google Inc. | Attaching electronic components to interactive textiles |
US20180240956A1 (en) * | 2015-09-30 | 2018-08-23 | Purdue Research Foundation | Flexible thermoelectric generator |
US10817065B1 (en) | 2015-10-06 | 2020-10-27 | Google Llc | Gesture recognition using multiple antenna |
TWI590433B (zh) * | 2015-10-12 | 2017-07-01 | 財團法人工業技術研究院 | 發光元件以及顯示器的製作方法 |
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-
2010
- 2010-08-26 WO PCT/JP2010/064459 patent/WO2012026013A1/ja active Application Filing
- 2010-10-04 WO PCT/JP2010/067376 patent/WO2012026046A1/ja active Application Filing
-
2011
- 2011-02-08 AU AU2011294612A patent/AU2011294612B2/en not_active Ceased
- 2011-02-08 US US13/816,858 patent/US8709841B2/en not_active Expired - Fee Related
- 2011-02-08 MX MX2013001711A patent/MX2013001711A/es not_active Application Discontinuation
- 2011-02-08 CN CN201180035329.6A patent/CN103026498B/zh not_active Expired - Fee Related
- 2011-02-08 WO PCT/JP2011/052579 patent/WO2012026142A1/ja active Application Filing
- 2011-02-08 EP EP11819618.7A patent/EP2610919A4/en not_active Withdrawn
- 2011-02-08 CA CA2808264A patent/CA2808264C/en not_active Expired - Fee Related
- 2011-02-08 KR KR1020137006664A patent/KR101445351B1/ko not_active IP Right Cessation
- 2011-03-03 TW TW100107191A patent/TWI442580B/zh not_active IP Right Cessation
-
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- 2013-06-06 HK HK13106735.2A patent/HK1179753A1/xx not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
CA2808264C (en) | 2016-06-28 |
CN103026498B (zh) | 2015-06-03 |
KR20130054368A (ko) | 2013-05-24 |
TW201236165A (en) | 2012-09-01 |
WO2012026013A1 (ja) | 2012-03-01 |
KR101445351B1 (ko) | 2014-09-30 |
EP2610919A1 (en) | 2013-07-03 |
US20130145588A1 (en) | 2013-06-13 |
US8709841B2 (en) | 2014-04-29 |
CN103026498A (zh) | 2013-04-03 |
WO2012026046A1 (ja) | 2012-03-01 |
EP2610919A4 (en) | 2014-05-14 |
TWI442580B (zh) | 2014-06-21 |
AU2011294612A1 (en) | 2013-02-21 |
CA2808264A1 (en) | 2012-03-01 |
MX2013001711A (es) | 2013-02-26 |
AU2011294612B2 (en) | 2013-10-03 |
WO2012026142A1 (ja) | 2012-03-01 |
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