HK1166180A1 - A method for fabricating thin touch sensor panels - Google Patents
A method for fabricating thin touch sensor panelsInfo
- Publication number
- HK1166180A1 HK1166180A1 HK12106686.2A HK12106686A HK1166180A1 HK 1166180 A1 HK1166180 A1 HK 1166180A1 HK 12106686 A HK12106686 A HK 12106686A HK 1166180 A1 HK1166180 A1 HK 1166180A1
- Authority
- HK
- Hong Kong
- Prior art keywords
- touch sensor
- sensor panels
- fabricating thin
- thin touch
- fabricating
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0097—Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/0416—Control or interface arrangements specially adapted for digitisers
- G06F3/04166—Details of scanning methods, e.g. sampling time, grouping of sub areas or time sharing with display driving
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
- G06F3/0445—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using two or more layers of sensing electrodes, e.g. using two layers of electrodes separated by a dielectric layer
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
- G06F3/0446—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using a grid-like structure of electrodes in at least two directions, e.g. using row and column electrodes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0302—Properties and characteristics in general
- H05K2201/0317—Thin film conductor layer; Thin film passive component
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/032—Materials
- H05K2201/0326—Inorganic, non-metallic conductor, e.g. indium-tin oxide [ITO]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1536—Temporarily stacked PCBs
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49126—Assembling bases
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49128—Assembling formed circuit to base
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49147—Assembling terminal to base
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
- Y10T29/49156—Manufacturing circuit on or in base with selective destruction of conductive paths
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Position Input By Displaying (AREA)
- Push-Button Switches (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12/351,767 US7918019B2 (en) | 2009-01-09 | 2009-01-09 | Method for fabricating thin touch sensor panels |
PCT/US2010/020485 WO2010080988A2 (en) | 2009-01-09 | 2010-01-08 | A method for fabricating thin touch sensor panels |
Publications (1)
Publication Number | Publication Date |
---|---|
HK1166180A1 true HK1166180A1 (en) | 2012-10-19 |
Family
ID=42074531
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK12106686.2A HK1166180A1 (en) | 2009-01-09 | 2012-07-09 | A method for fabricating thin touch sensor panels |
Country Status (4)
Country | Link |
---|---|
US (2) | US7918019B2 (xx) |
CN (1) | CN102318054B (xx) |
HK (1) | HK1166180A1 (xx) |
WO (1) | WO2010080988A2 (xx) |
Families Citing this family (43)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8673163B2 (en) * | 2008-06-27 | 2014-03-18 | Apple Inc. | Method for fabricating thin sheets of glass |
US7810355B2 (en) | 2008-06-30 | 2010-10-12 | Apple Inc. | Full perimeter chemical strengthening of substrates |
US9063605B2 (en) | 2009-01-09 | 2015-06-23 | Apple Inc. | Thin glass processing using a carrier |
US7918019B2 (en) | 2009-01-09 | 2011-04-05 | Apple Inc. | Method for fabricating thin touch sensor panels |
US20110019354A1 (en) * | 2009-03-02 | 2011-01-27 | Christopher Prest | Techniques for Strengthening Glass Covers for Portable Electronic Devices |
CN102388003B (zh) | 2009-03-02 | 2014-11-19 | 苹果公司 | 用于强化用于便携式电子设备的玻璃盖的技术 |
US9778685B2 (en) | 2011-05-04 | 2017-10-03 | Apple Inc. | Housing for portable electronic device with reduced border region |
JP5644129B2 (ja) * | 2010-02-12 | 2014-12-24 | 日本電気硝子株式会社 | 強化板ガラス及びその製造方法 |
JP5652742B2 (ja) * | 2010-02-12 | 2015-01-14 | 日本電気硝子株式会社 | 強化板ガラス及びその製造方法 |
EP2368837B1 (de) * | 2010-03-22 | 2015-08-05 | Werner Waser | Leiterplattensensor und Verfahren zur Herstellung desselben |
US9213451B2 (en) | 2010-06-04 | 2015-12-15 | Apple Inc. | Thin glass for touch panel sensors and methods therefor |
WO2012012299A2 (en) | 2010-07-21 | 2012-01-26 | Synaptics Incorporated | Producing capacitive images comprising non-connection values |
CN101968697B (zh) * | 2010-08-13 | 2015-12-16 | 牧东光电(苏州)有限公司 | 制造网格图案型触控面板的方法 |
CN101893966A (zh) * | 2010-08-13 | 2010-11-24 | 牧东光电(苏州)有限公司 | 具有中间导电层的触控面板及其制作方法 |
US10189743B2 (en) | 2010-08-18 | 2019-01-29 | Apple Inc. | Enhanced strengthening of glass |
US8824140B2 (en) | 2010-09-17 | 2014-09-02 | Apple Inc. | Glass enclosure |
US8950215B2 (en) | 2010-10-06 | 2015-02-10 | Apple Inc. | Non-contact polishing techniques for reducing roughness on glass surfaces |
US10781135B2 (en) | 2011-03-16 | 2020-09-22 | Apple Inc. | Strengthening variable thickness glass |
US9725359B2 (en) | 2011-03-16 | 2017-08-08 | Apple Inc. | Electronic device having selectively strengthened glass |
US9128666B2 (en) | 2011-05-04 | 2015-09-08 | Apple Inc. | Housing for portable electronic device with reduced border region |
US8971572B1 (en) | 2011-08-12 | 2015-03-03 | The Research Foundation For The State University Of New York | Hand pointing estimation for human computer interaction |
US9944554B2 (en) | 2011-09-15 | 2018-04-17 | Apple Inc. | Perforated mother sheet for partial edge chemical strengthening and method therefor |
US9516149B2 (en) | 2011-09-29 | 2016-12-06 | Apple Inc. | Multi-layer transparent structures for electronic device housings |
US10144669B2 (en) | 2011-11-21 | 2018-12-04 | Apple Inc. | Self-optimizing chemical strengthening bath for glass |
US10133156B2 (en) | 2012-01-10 | 2018-11-20 | Apple Inc. | Fused opaque and clear glass for camera or display window |
US8773848B2 (en) | 2012-01-25 | 2014-07-08 | Apple Inc. | Fused glass device housings |
US9116579B2 (en) * | 2012-02-01 | 2015-08-25 | Yue-Shih Jeng | MIMO sonic touch panel and MIMO smart sound potential server |
TWI468787B (zh) * | 2012-04-25 | 2015-01-11 | Mirle Automation Corp | 暫時性貼合方法及其貼合設備 |
US9946302B2 (en) | 2012-09-19 | 2018-04-17 | Apple Inc. | Exposed glass article with inner recessed area for portable electronic device housing |
US9459661B2 (en) | 2013-06-19 | 2016-10-04 | Apple Inc. | Camouflaged openings in electronic device housings |
DE102013215060A1 (de) | 2013-07-31 | 2015-02-05 | Irlbacher Blickpunkt Glas Gmbh | Kapazitive Sensorvorrichtung mit elektrisch leitfähig beschichteter Sensorplatte aus Dünnglas |
US9886062B2 (en) | 2014-02-28 | 2018-02-06 | Apple Inc. | Exposed glass article with enhanced stiffness for portable electronic device housing |
KR20180054928A (ko) | 2014-05-12 | 2018-05-24 | 코닝 인코포레이티드 | 만곡된 유리 구조물의 광학적 품질의 개선 방법 |
US11626448B2 (en) | 2019-03-29 | 2023-04-11 | Lumileds Llc | Fan-out light-emitting diode (LED) device substrate with embedded backplane, lighting system and method of manufacture |
US11156346B2 (en) | 2019-11-19 | 2021-10-26 | Lumileds Llc | Fan out structure for light-emitting diode (LED) device and lighting system |
US11777066B2 (en) | 2019-12-27 | 2023-10-03 | Lumileds Llc | Flipchip interconnected light-emitting diode package assembly |
EP3890451A1 (en) * | 2020-03-30 | 2021-10-06 | Lumileds Holding B.V. | Ceramic carrier and build up carrier for light-emitting diode (led) array |
KR20220123451A (ko) * | 2020-01-07 | 2022-09-06 | 루미레즈 엘엘씨 | 발광 다이오드(led) 어레이를 위한 세라믹 캐리어 및 빌드업 캐리어 |
US11664347B2 (en) | 2020-01-07 | 2023-05-30 | Lumileds Llc | Ceramic carrier and build up carrier for light-emitting diode (LED) array |
US11476217B2 (en) | 2020-03-10 | 2022-10-18 | Lumileds Llc | Method of manufacturing an augmented LED array assembly |
CN113035779B (zh) * | 2021-02-26 | 2023-06-06 | 业泓科技(成都)有限公司 | 指纹识别组件及其制备方法、终端 |
CN114591002A (zh) * | 2022-04-11 | 2022-06-07 | 业泓科技(成都)有限公司 | 指纹辨识模组的减薄方法 |
CN115100698A (zh) * | 2022-06-23 | 2022-09-23 | 业泓科技(成都)有限公司 | 指纹识别装置的制造方法 |
Family Cites Families (44)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3876008A (en) | 1974-03-18 | 1975-04-08 | Andrew Scruggs | Fire extinguishing sprinkling system |
JPS5231757A (en) | 1975-09-05 | 1977-03-10 | Hitachi Ltd | Manufacturing method of liquid crystal display element |
US5483261A (en) * | 1992-02-14 | 1996-01-09 | Itu Research, Inc. | Graphical input controller and method with rear screen image detection |
JP2678325B2 (ja) | 1992-03-06 | 1997-11-17 | カシオ計算機株式会社 | 液晶表示素子の製造方法 |
US5880411A (en) * | 1992-06-08 | 1999-03-09 | Synaptics, Incorporated | Object position detector with edge motion feature and gesture recognition |
US5488204A (en) * | 1992-06-08 | 1996-01-30 | Synaptics, Incorporated | Paintbrush stylus for capacitive touch sensor pad |
KR0171092B1 (ko) * | 1995-07-06 | 1999-05-01 | 구자홍 | 기판 제조방법 |
US5825352A (en) * | 1996-01-04 | 1998-10-20 | Logitech, Inc. | Multiple fingers contact sensing method for emulating mouse buttons and mouse operations on a touch sensor pad |
US5937512A (en) * | 1996-01-11 | 1999-08-17 | Micron Communications, Inc. | Method of forming a circuit board |
DE19619454A1 (de) * | 1996-05-14 | 1997-11-20 | Gut Ges Fuer Umwelttechnik Mbh | Reaktor zur Dotierung von Treibstoffen und Brennstoffen mit zinnhaltigen Materialien |
JPH09312245A (ja) | 1996-05-21 | 1997-12-02 | Hoya Corp | 薄膜堆積基板および薄膜堆積基板の作製方法 |
US5835079A (en) * | 1996-06-13 | 1998-11-10 | International Business Machines Corporation | Virtual pointing device for touchscreens |
US6327011B2 (en) * | 1997-10-20 | 2001-12-04 | Lg Electronics, Inc. | Liquid crystal display device having thin glass substrate on which protective layer formed and method of making the same |
US6310610B1 (en) * | 1997-12-04 | 2001-10-30 | Nortel Networks Limited | Intelligent touch display |
US7663607B2 (en) * | 2004-05-06 | 2010-02-16 | Apple Inc. | Multipoint touchscreen |
IL137478A (en) * | 1998-01-26 | 2005-11-20 | Westerman Wayne | Method and apparatus for integrating manual input |
US8479122B2 (en) * | 2004-07-30 | 2013-07-02 | Apple Inc. | Gestures for touch sensitive input devices |
US6188391B1 (en) * | 1998-07-09 | 2001-02-13 | Synaptics, Inc. | Two-layer capacitive touchpad and method of making same |
CA2353506A1 (en) * | 1998-11-02 | 2000-05-11 | 3M Innovative Properties Company | Transparent conductive oxides for plastic flat panel displays |
JP4542637B2 (ja) | 1998-11-25 | 2010-09-15 | セイコーエプソン株式会社 | 携帯情報機器及び情報記憶媒体 |
US6350664B1 (en) * | 1999-09-02 | 2002-02-26 | Matsushita Electric Industrial Co., Ltd. | Semiconductor device and method of manufacturing the same |
JP3800984B2 (ja) | 2001-05-21 | 2006-07-26 | ソニー株式会社 | ユーザ入力装置 |
US8512580B2 (en) * | 2001-09-21 | 2013-08-20 | Lg Display Co., Ltd. | Method of fabricating thin liquid crystal display device |
JP2003173237A (ja) * | 2001-09-28 | 2003-06-20 | Ricoh Co Ltd | 情報入出力システム、プログラム及び記憶媒体 |
TWI237716B (en) * | 2001-12-18 | 2005-08-11 | Chi Mei Optoelectronics Corp | Liquid crystal display device and its manufacturing method |
US6690387B2 (en) * | 2001-12-28 | 2004-02-10 | Koninklijke Philips Electronics N.V. | Touch-screen image scrolling system and method |
US11275405B2 (en) | 2005-03-04 | 2022-03-15 | Apple Inc. | Multi-functional hand-held device |
FR2847077B1 (fr) * | 2002-11-12 | 2006-02-17 | Soitec Silicon On Insulator | Composants semi-conducteurs, et notamment de type soi mixtes, et procede de realisation |
JP4063082B2 (ja) | 2003-01-10 | 2008-03-19 | 日本電気株式会社 | フレキシブル電子デバイスとその製造方法 |
US20050001201A1 (en) * | 2003-07-03 | 2005-01-06 | Bocko Peter L. | Glass product for use in ultra-thin glass display applications |
US7497754B2 (en) * | 2004-04-30 | 2009-03-03 | Kabushiki Kaisha Toyota Jidoshokki | Method for thinning substrate of EL device |
TWI254234B (en) * | 2004-12-24 | 2006-05-01 | Hon Hai Prec Ind Co Ltd | System and method for auto-judging geometric shape trend of a set of dots on an image |
US7262112B2 (en) * | 2005-06-27 | 2007-08-28 | The Regents Of The University Of California | Method for producing dislocation-free strained crystalline films |
KR101285442B1 (ko) * | 2005-08-09 | 2013-07-12 | 아사히 가라스 가부시키가이샤 | 박판 유리 적층체 및 박판 유리 적층체를 이용한 표시장치의 제조 방법 |
KR100820170B1 (ko) * | 2006-08-30 | 2008-04-10 | 한국전자통신연구원 | 플렉시블 기판의 적층 방법 |
US20070196578A1 (en) * | 2006-10-10 | 2007-08-23 | Michael Karp | Method and system for coating |
JP4000178B1 (ja) | 2006-12-19 | 2007-10-31 | 株式会社テスコム | タッチパネル表示装置及びタッチパネルユニット製造方法 |
TWI444942B (zh) * | 2007-04-20 | 2014-07-11 | Via Optronics Gmbh | 無框架顯示系統以及建構其之方法 |
TWI418602B (zh) | 2007-06-25 | 2013-12-11 | Brewer Science Inc | 高溫旋塗暫時結合組成物 |
US8633915B2 (en) * | 2007-10-04 | 2014-01-21 | Apple Inc. | Single-layer touch-sensitive display |
US20090092808A1 (en) * | 2007-10-05 | 2009-04-09 | Cheng-Chieh Chang | Extreme low resistivity light attenuation anti-reflection coating structure and method for manufacturing the same |
US8673163B2 (en) * | 2008-06-27 | 2014-03-18 | Apple Inc. | Method for fabricating thin sheets of glass |
US7918019B2 (en) * | 2009-01-09 | 2011-04-05 | Apple Inc. | Method for fabricating thin touch sensor panels |
TWI439976B (zh) * | 2009-04-17 | 2014-06-01 | Ind Tech Res Inst | 可撓曲膜自載板上脫離的方法及可撓式電子裝置的製造方法 |
-
2009
- 2009-01-09 US US12/351,767 patent/US7918019B2/en active Active
-
2010
- 2010-01-08 CN CN201080007319.7A patent/CN102318054B/zh active Active
- 2010-01-08 WO PCT/US2010/020485 patent/WO2010080988A2/en active Application Filing
- 2010-10-20 US US12/908,763 patent/US8997339B2/en active Active
-
2012
- 2012-07-09 HK HK12106686.2A patent/HK1166180A1/xx not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
US20110030209A1 (en) | 2011-02-10 |
CN102318054B (zh) | 2014-04-02 |
WO2010080988A3 (en) | 2010-09-10 |
WO2010080988A2 (en) | 2010-07-15 |
US8997339B2 (en) | 2015-04-07 |
US7918019B2 (en) | 2011-04-05 |
US20100175249A1 (en) | 2010-07-15 |
CN102318054A (zh) | 2012-01-11 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
HK1166180A1 (en) | A method for fabricating thin touch sensor panels | |
HRP20181610T1 (hr) | Postupak za proizvodnju ploče i ploča proizvedena navedenim postupkom | |
HK1167032A1 (en) | A method for fabricating touch sensor panels | |
GB2484246B (en) | A touch sensor | |
GB2487962B (en) | Method for making a two-layer capacitive touch sensor panel | |
EP2479603A4 (en) | METHOD FOR PRODUCING A CURVED DISPLAY PANEL | |
IL238673B (en) | Structural tile for building | |
HK1181030A1 (zh) | 透光性硬質基板層叠體的製造方法 | |
EP2405328A4 (en) | TOUCH SCREEN SENSOR | |
GB2474922B (en) | A gas sensor | |
EP2265923A4 (en) | METHOD FOR MANUFACTURING MICROFLUIDIC SENSOR | |
PL2295675T3 (pl) | Sposób wzmacniania struktury budowlanej | |
EP2473902A4 (en) | TOUCH SCREEN AND METHOD FOR PRODUCING A TOUCH SCREEN | |
EP2521116A4 (en) | METHOD FOR PRODUCING A DISPLAY DEVICE | |
EP2715301B8 (de) | Drucksensor und verfahren zur herstellung eines drucksensors | |
GB2468755B (en) | A sensor | |
GB0904985D0 (en) | A microbiological detection method | |
GB2473668B (en) | A position reference sensor | |
GB2468856B (en) | A process | |
PL2303529T3 (pl) | Sposób wytwarzania panelu elewacyjnego | |
PL2412526T3 (pl) | Sposób wytwarzania elementów kompozytowych | |
HK1169080A1 (en) | Method for producing a visible covering | |
TWI563439B (en) | A touch panel module and a fabrication method thereof | |
GB2471348B (en) | A method for producing sucralose-6-acylate | |
GB0909162D0 (en) | A method |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PC | Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee) |
Effective date: 20240105 |