HK1165094A1 - Dispensing liquid containing material to patterned surfaces using a dispensing tube - Google Patents

Dispensing liquid containing material to patterned surfaces using a dispensing tube

Info

Publication number
HK1165094A1
HK1165094A1 HK12105597.2A HK12105597A HK1165094A1 HK 1165094 A1 HK1165094 A1 HK 1165094A1 HK 12105597 A HK12105597 A HK 12105597A HK 1165094 A1 HK1165094 A1 HK 1165094A1
Authority
HK
Hong Kong
Prior art keywords
dispensing
liquid containing
containing material
patterned surfaces
tube
Prior art date
Application number
HK12105597.2A
Other languages
English (en)
Chinese (zh)
Inventor
Emanuel M Sachs
Richard L Wallace
James F Bredt
Benjamin F Polito
Ali Ersen
Original Assignee
1366 Tech Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 1366 Tech Inc filed Critical 1366 Tech Inc
Publication of HK1165094A1 publication Critical patent/HK1165094A1/xx

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0224—Electrodes
    • H01L31/022408—Electrodes for devices characterised by at least one potential jump barrier or surface barrier
    • H01L31/022425—Electrodes for devices characterised by at least one potential jump barrier or surface barrier for solar cells
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Sustainable Development (AREA)
  • Sustainable Energy (AREA)
  • Electromagnetism (AREA)
  • Coating Apparatus (AREA)
  • Photovoltaic Devices (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
HK12105597.2A 2009-01-06 2012-06-07 Dispensing liquid containing material to patterned surfaces using a dispensing tube HK1165094A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US20438209P 2009-01-06 2009-01-06
PCT/US2010/020245 WO2010080822A1 (en) 2009-01-06 2010-01-06 Dispensing liquid containing material to patterned surfaces using a dispensing tube

Publications (1)

Publication Number Publication Date
HK1165094A1 true HK1165094A1 (en) 2012-09-28

Family

ID=42316786

Family Applications (1)

Application Number Title Priority Date Filing Date
HK12105597.2A HK1165094A1 (en) 2009-01-06 2012-06-07 Dispensing liquid containing material to patterned surfaces using a dispensing tube

Country Status (9)

Country Link
US (1) US20120038031A1 (ko)
EP (1) EP2386118A4 (ko)
JP (1) JP5852444B2 (ko)
KR (1) KR20110115573A (ko)
CN (1) CN102272935B (ko)
HK (1) HK1165094A1 (ko)
SG (1) SG172149A1 (ko)
TW (1) TW201032906A (ko)
WO (1) WO2010080822A1 (ko)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102011051865A1 (de) * 2011-07-15 2013-01-17 Centrotherm Photovoltaics Ag Verfahren zur Behandlung einer Oberfläche
SG11201400622SA (en) * 2011-09-23 2014-04-28 1366 Tech Inc Techniques for improved imprinting of soft material on substrate using stamp including underfilling to leave a gap and pulsing stamp
CN104220177B (zh) * 2011-12-13 2017-03-08 3M创新有限公司 毛细管歧管涂覆设备和涂覆方法
FR2985601B1 (fr) * 2012-01-06 2016-06-03 Soitec Silicon On Insulator Procede de fabrication d'un substrat et structure semiconducteur
KR101941237B1 (ko) * 2017-09-13 2019-01-23 한국에너지기술연구원 태양 전지 셀 어레이, 태양 전지 모듈, 그리고 이의 제조 방법
US20190139789A1 (en) * 2017-11-06 2019-05-09 Canon Kabushiki Kaisha Apparatus for imprint lithography comprising a logic element configured to generate a fluid droplet pattern and a method of using such apparatus
CN108110010B (zh) 2017-12-15 2021-10-01 京东方科技集团股份有限公司 阵列基板及其制备方法、触控显示面板
DE102019206706A1 (de) * 2019-05-09 2020-11-12 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Vorrichtung und Verfahren zum Aufbringen flüssiger Medien auf eine Substratoberfläche
KR102035601B1 (ko) * 2019-06-19 2019-10-23 김규대 케이블 하네스 제조용 접착제 도포장치
CN113304971B (zh) * 2021-04-26 2022-12-13 深圳市世宗自动化设备有限公司 3d动态引导点胶补偿方法、装置、设备及其存储介质

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US2138696A (en) * 1937-02-25 1938-11-29 Francis Louis Calking unit
US3653560A (en) * 1970-03-02 1972-04-04 Armstrong Cork Co Seam sealer dispensing head
US3831759A (en) * 1972-09-29 1974-08-27 Gelman Instr Co Funnel with magnetic filter retainer
US4570286A (en) * 1982-09-30 1986-02-18 David Ross Portable vacuum cleaning device
US4485387A (en) * 1982-10-26 1984-11-27 Microscience Systems Corp. Inking system for producing circuit patterns
JPS6043894A (ja) * 1983-08-19 1985-03-08 松下電器産業株式会社 厚膜回路の形成方法
JPS6283578U (ko) * 1985-11-12 1987-05-28
US5046877A (en) * 1987-11-16 1991-09-10 Longo William J Coating dispensing cartridge and spout therefor
JPH0350155U (ko) * 1989-09-22 1991-05-16
US5501744A (en) * 1992-01-13 1996-03-26 Photon Energy, Inc. Photovoltaic cell having a p-type polycrystalline layer with large crystals
JPH05235388A (ja) * 1992-02-24 1993-09-10 Mitsubishi Electric Corp 低抵抗線状パターンの形成方法及び形成装置並びに太陽電池
JPH0611348U (ja) * 1992-07-14 1994-02-10 日本インター株式会社 コート剤塗布装置
US5605259A (en) * 1995-04-07 1997-02-25 Homax Products, Inc. Method and apparatus for covering irregularities in a wall surface
US5571538A (en) * 1995-07-17 1996-11-05 Cloud; Donald E. Grout sealant applicator
JP2966332B2 (ja) * 1995-10-17 1999-10-25 キヤノン株式会社 光起電力素子の製造方法及び装置
EP0990142A4 (en) * 1996-12-31 2000-09-27 Genometrix Genomics Inc MULTIPLEXED MOLECULAR ANALYSIS METHOD AND DEVICE
JP3051030U (ja) * 1998-01-30 1998-08-11 富双合成株式会社 接着剤用ノズル構造
GB9808806D0 (en) * 1998-04-24 1998-06-24 Cambridge Display Tech Ltd Selective deposition of polymer films
JP4721227B2 (ja) * 2006-05-22 2011-07-13 アイダエンジニアリング株式会社 マイクロ流路チップ及びその製造方法
WO2008100603A1 (en) * 2007-02-15 2008-08-21 Massachusetts Institute Of Technology Solar cells with textured surfaces
JP4994963B2 (ja) * 2007-06-14 2012-08-08 大日本スクリーン製造株式会社 基板塗布装置
WO2009145857A1 (en) * 2008-04-18 2009-12-03 1366 Technologies Inc. Methods to pattern diffusion layers in solar cells and solar cells made by such methods

Also Published As

Publication number Publication date
TW201032906A (en) 2010-09-16
EP2386118A1 (en) 2011-11-16
US20120038031A1 (en) 2012-02-16
EP2386118A4 (en) 2013-09-04
JP2012514532A (ja) 2012-06-28
JP5852444B2 (ja) 2016-02-03
WO2010080822A1 (en) 2010-07-15
CN102272935B (zh) 2015-06-24
CN102272935A (zh) 2011-12-07
SG172149A1 (en) 2011-07-28
KR20110115573A (ko) 2011-10-21

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Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20200106