HK1158368A1 - Electrostatic chuck, and method for manufacturing the chuck - Google Patents

Electrostatic chuck, and method for manufacturing the chuck

Info

Publication number
HK1158368A1
HK1158368A1 HK11112707.6A HK11112707A HK1158368A1 HK 1158368 A1 HK1158368 A1 HK 1158368A1 HK 11112707 A HK11112707 A HK 11112707A HK 1158368 A1 HK1158368 A1 HK 1158368A1
Authority
HK
Hong Kong
Prior art keywords
substrate
raised portions
adsorption
elastic
electrostatic chuck
Prior art date
Application number
HK11112707.6A
Inventor
Yoshiaki Tatsumi
Takahito Fujita
Yasuyuki Temma
Hiroshi Fujisawa
Original Assignee
Creative Tech Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Creative Tech Corp filed Critical Creative Tech Corp
Publication of HK1158368A1 publication Critical patent/HK1158368A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q3/00—Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine
    • B23Q3/15—Devices for holding work using magnetic or electric force acting directly on the work
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H01L21/6833—Details of electrostatic chucks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/6875—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of individual support members, e.g. support posts or protrusions
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
    • H02N13/00—Clutches or holding devices using electrostatic attraction, e.g. using Johnson-Rahbek effect

Abstract

Provided is an electrostatic chuck, which can reduce the adhesion of contaminants from a substrate adsorption face to a substrate, to thereby perform cooling via the electrostatic chuck while keeping the substrate contact area optimum.  In the electrostatic chuck, an elastic adsorption layer having a plurality of raised portions of an elastic material is made into the substrate adsorption face so that the substrate is adsorbed and held via the elastic adsorption layer.  The raised portions on the elastic adsorption layer have a height h(m); the number of the raised portions per unit area on the substrate adsorption face is n(pieces/m2); the top faces of the raised portions have an area A(m2); and the elastic material forming the raised portions has a modulus of elasticity E(Pa).  When the substrate having an overall flatness Wh(m) is adsorbed and held by an adsorption force F(Pa), the quantity d(m), in which the raised portions shrink in the acting direction of the adsorption force F, satisfies the following relation (1), and the ratio ? of the total area of the raised portion top faces per the unit area of the substrate adsorption face is 10 % or more:        5Wh = d = 0.5Wh, and d = (h/nA)·(F/E) - - - (1).
HK11112707.6A 2008-10-15 2011-11-23 Electrostatic chuck, and method for manufacturing the chuck HK1158368A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2008289260 2008-10-15
PCT/JP2009/067734 WO2010044398A1 (en) 2008-10-15 2009-10-13 Electrostatic chuck, and method for manufacturing the chuck

Publications (1)

Publication Number Publication Date
HK1158368A1 true HK1158368A1 (en) 2012-07-13

Family

ID=42106561

Family Applications (1)

Application Number Title Priority Date Filing Date
HK11112707.6A HK1158368A1 (en) 2008-10-15 2011-11-23 Electrostatic chuck, and method for manufacturing the chuck

Country Status (6)

Country Link
JP (1) JP5458323B2 (en)
KR (1) KR101559947B1 (en)
CN (1) CN102187446B (en)
HK (1) HK1158368A1 (en)
TW (1) TWI467691B (en)
WO (1) WO2010044398A1 (en)

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US9542638B2 (en) 2014-02-18 2017-01-10 Apple Inc. RFID tag and micro chip integration design
US9583533B2 (en) 2014-03-13 2017-02-28 Apple Inc. LED device with embedded nanowire LEDs
US9522468B2 (en) 2014-05-08 2016-12-20 Apple Inc. Mass transfer tool manipulator assembly with remote center of compliance
US9318475B2 (en) 2014-05-15 2016-04-19 LuxVue Technology Corporation Flexible display and method of formation with sacrificial release layer
US9741286B2 (en) 2014-06-03 2017-08-22 Apple Inc. Interactive display panel with emitting and sensing diodes
US9624100B2 (en) 2014-06-12 2017-04-18 Apple Inc. Micro pick up array pivot mount with integrated strain sensing elements
US9570002B2 (en) 2014-06-17 2017-02-14 Apple Inc. Interactive display panel with IR diodes
US9425151B2 (en) 2014-06-17 2016-08-23 Apple Inc. Compliant electrostatic transfer head with spring support layer
CN104209190A (en) * 2014-08-30 2014-12-17 常州市群星印刷有限公司 Air purifier
US9828244B2 (en) 2014-09-30 2017-11-28 Apple Inc. Compliant electrostatic transfer head with defined cavity
US9705432B2 (en) 2014-09-30 2017-07-11 Apple Inc. Micro pick up array pivot mount design for strain amplification
US9478583B2 (en) 2014-12-08 2016-10-25 Apple Inc. Wearable display having an array of LEDs on a conformable silicon substrate
KR102206687B1 (en) * 2017-06-26 2021-01-22 니뽄 도쿠슈 도교 가부시키가이샤 Substrate holding member
JP6435481B1 (en) * 2017-09-04 2018-12-12 株式会社プロセス・ラボ・ミクロン Work suction jig and work suction device
TWI642138B (en) * 2018-03-08 2018-11-21 弘塑科技股份有限公司 Wafer fixing device, wafer fixing base and wafer vacuum chuck
CN110246797A (en) * 2018-03-08 2019-09-17 弘塑科技股份有限公司 Wafer mounting apparatus, wafer fixed pedestal and wafer vacuum sucker
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KR102093991B1 (en) * 2018-08-31 2020-04-23 이지스코 주식회사 Elastomer rubber diaphragm type electro static chuck and fabrication method for the same
JP7278193B2 (en) * 2018-12-07 2023-05-19 キヤノントッキ株式会社 Deposition equipment
JP7183223B2 (en) * 2020-08-28 2022-12-05 株式会社Ｓｃｒｅｅｎホールディングス SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
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Also Published As

Publication number Publication date
CN102187446A (en) 2011-09-14
KR20110084888A (en) 2011-07-26
KR101559947B1 (en) 2015-10-13
JP5458323B2 (en) 2014-04-02
TW201026582A (en) 2010-07-16
TWI467691B (en) 2015-01-01
CN102187446B (en) 2013-07-24
WO2010044398A1 (en) 2010-04-22
JPWO2010044398A1 (en) 2012-03-15

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Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20171013