HK1152352A1 - Modified copper-tin electrolyte and process for the deposition of bronze layers - Google Patents

Modified copper-tin electrolyte and process for the deposition of bronze layers

Info

Publication number
HK1152352A1
HK1152352A1 HK11106316.1A HK11106316A HK1152352A1 HK 1152352 A1 HK1152352 A1 HK 1152352A1 HK 11106316 A HK11106316 A HK 11106316A HK 1152352 A1 HK1152352 A1 HK 1152352A1
Authority
HK
Hong Kong
Prior art keywords
electrolyte
deposition
bronze layers
modified copper
carbonate ions
Prior art date
Application number
HK11106316.1A
Other languages
English (en)
Inventor
Weyhmueller Bernd
Bronder Klaus
Oberst Frank
Berger Sascha
Manz Uwe
Original Assignee
Umicore Galvanotechnik Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Umicore Galvanotechnik Gmbh filed Critical Umicore Galvanotechnik Gmbh
Publication of HK1152352A1 publication Critical patent/HK1152352A1/xx

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/58—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/002—Cell separation, e.g. membranes, diaphragms
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/60—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of tin

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Chemically Coating (AREA)
  • Electrolytic Production Of Metals (AREA)
HK11106316.1A 2008-05-08 2011-06-21 Modified copper-tin electrolyte and process for the deposition of bronze layers HK1152352A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP08008637A EP2116634B1 (de) 2008-05-08 2008-05-08 Modifizierter Kupfer-Zinn-Elektrolyt und Verfahren zur Abscheidung von Bronzeschichten
PCT/EP2009/002323 WO2009135572A2 (en) 2008-05-08 2009-03-31 Modified copper-tin electrolyte and process for the deposition of bronze layers

Publications (1)

Publication Number Publication Date
HK1152352A1 true HK1152352A1 (en) 2012-02-24

Family

ID=39639007

Family Applications (1)

Application Number Title Priority Date Filing Date
HK11106316.1A HK1152352A1 (en) 2008-05-08 2011-06-21 Modified copper-tin electrolyte and process for the deposition of bronze layers

Country Status (12)

Country Link
US (1) US20110089043A1 (de)
EP (1) EP2116634B1 (de)
JP (1) JP2011520037A (de)
KR (1) KR20110011613A (de)
CN (1) CN102016130B (de)
AT (1) ATE486157T1 (de)
DE (1) DE502008001647D1 (de)
HK (1) HK1152352A1 (de)
MX (1) MX2010012041A (de)
PL (1) PL2116634T3 (de)
TW (1) TW201005129A (de)
WO (1) WO2009135572A2 (de)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5569718B2 (ja) * 2009-08-21 2014-08-13 キザイ株式会社 シアンフリー光沢銅−スズ合金めっき浴
KR101236165B1 (ko) * 2011-02-15 2013-02-22 (주)지오데코 친환경 3원 합금 도금액 및 이를 이용한 금속 표면 처리방법
DE102011121798B4 (de) * 2011-12-21 2013-08-29 Umicore Galvanotechnik Gmbh Elektrolyt und Verfahren zur elektrolytischen Abscheidung von Cu-Zn-Sn-Legierungsschichten und Verfahren zur Herstellung einer Dünnschichtsolarzelle
DE102011121799B4 (de) 2011-12-21 2013-08-29 Umicore Galvanotechnik Gmbh Elektrolyt und Verfahren zur elektrolytischen Abscheidung von Cu-Zn-Sn-Legierungsschichten und Verfahren zur Herstellung einer Dünnschichtsolarzelle
JP5952093B2 (ja) * 2012-05-31 2016-07-13 ローム・アンド・ハース電子材料株式会社 電解銅めっき液及び電解銅めっき方法
JP6093143B2 (ja) * 2012-10-19 2017-03-08 株式会社シミズ 非シアン銅‐錫合金めっき浴
US20160024683A1 (en) * 2013-03-21 2016-01-28 Atotech Deutschland Gmbh Apparatus and method for electrolytic deposition of metal layers on workpieces
AR100422A1 (es) * 2014-05-15 2016-10-05 Nippon Steel & Sumitomo Metal Corp Solución para deposición para conexión roscada para un caño o tubo y método de producción de la conexión roscada para un caño o tubo
CN104152955A (zh) * 2014-07-17 2014-11-19 广东致卓精密金属科技有限公司 碱性溶液电镀光亮白铜锡电镀液及工艺
CN107910575B (zh) * 2017-11-19 2020-03-27 湖南辰砾新材料有限公司 一种基于六亚甲基四胺盐阴离子交换膜及其制备方法
BE1027099B1 (nl) * 2019-03-08 2020-10-05 Umicore Nv Werkwijze voor elektrolytische koperwinning
DE102021117095A1 (de) 2021-07-02 2023-01-05 Umicore Galvanotechnik Gmbh Bronzeschichten als Edelmetallersatz
DE202021004169U1 (de) 2021-07-02 2022-12-07 Umicore Galvanotechnik Gmbh Bronzeschicht als Edelmetallersatz in Smart Cards

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2198365A (en) * 1938-06-29 1940-04-23 Special Chemicals Corp Electroplating
US3227638A (en) * 1961-06-16 1966-01-04 Robert H Burnson Alkali cyanide bath and process for electroplating therewith
DE3346721A1 (de) * 1983-12-23 1985-06-27 Fa. Karl-Wilh. Hen, 5820 Gevelsberg Alkalisches bad zum aufbringen eines hochglaenzenden galvanischen ueberzugs auf einen traeger
JPH02175894A (ja) * 1988-12-28 1990-07-09 Kosaku:Kk スズ、スズ合金電気めっき方法及び同電気めっき装置
US5194140A (en) * 1991-11-27 1993-03-16 Macdermid, Incorporated Electroplating composition and process
DE4324995C2 (de) * 1993-07-26 1995-12-21 Demetron Gmbh Cyanidisch-alkalische Bäder zur galvanischen Abscheidung von Kupfer-Zinn-Legierungsüberzügen
JP3674887B2 (ja) * 1996-09-30 2005-07-27 日本ニュークローム株式会社 銅−スズ合金メッキ用ピロリン酸浴
US6176996B1 (en) * 1997-10-30 2001-01-23 Sungsoo Moon Tin alloy plating compositions
US6508927B2 (en) * 1998-11-05 2003-01-21 C. Uyemura & Co., Ltd. Tin-copper alloy electroplating bath
JP2001181889A (ja) * 1999-12-22 2001-07-03 Nippon Macdermid Kk 光沢錫−銅合金電気めっき浴
JP3455712B2 (ja) * 2000-04-14 2003-10-14 日本ニュークローム株式会社 銅−スズ合金めっき用ピロリン酸浴
DE10046600C2 (de) 2000-09-20 2003-02-20 Schloetter Fa Dr Ing Max Elektrolyt und Verfahren zur Abscheidung von Zinn-Kupfer-Legierungsschichten und Verwendung des Elektrolyten
JP4249438B2 (ja) * 2002-07-05 2009-04-02 日本ニュークローム株式会社 銅―錫合金めっき用ピロリン酸浴
ES2531163T3 (es) 2002-10-11 2015-03-11 Enthone Procedimiento y electrolito para la deposición galvánica de bronces

Also Published As

Publication number Publication date
CN102016130A (zh) 2011-04-13
JP2011520037A (ja) 2011-07-14
WO2009135572A2 (en) 2009-11-12
EP2116634B1 (de) 2010-10-27
DE502008001647D1 (de) 2010-12-09
EP2116634A1 (de) 2009-11-11
PL2116634T3 (pl) 2011-04-29
WO2009135572A3 (en) 2009-12-30
KR20110011613A (ko) 2011-02-08
CN102016130B (zh) 2013-03-13
US20110089043A1 (en) 2011-04-21
ATE486157T1 (de) 2010-11-15
TW201005129A (en) 2010-02-01
MX2010012041A (es) 2011-03-04

Similar Documents

Publication Publication Date Title
HK1152352A1 (en) Modified copper-tin electrolyte and process for the deposition of bronze layers
PL2310558T3 (pl) Ulepszony elektrolit miedziowo-cynowy i sposób osadzania warstw cyny i brązu
MY161119A (en) Steel sheet for container and method of manufacturing the same
MY162826A (en) Hot-pressed member and process for producing the same
BRPI0907497A2 (pt) Banho baseado em pirofosfatos para revestimento de camadas de ligas de estanho
HK1137785A1 (en) Copper-tin electrolyte and method for depositing bronze layers
EP2025778A3 (de) Kupferabscheidungsverfahren
WO2007147605A3 (de) Tripyridinium-verbindungen als zusätze in wässrigen alkalischen, cyanidfreien bädern zur galvanischen abscheidung von zink- und zinklegierungsüberzügen
MY162588A (en) Manufacturing method for steel sheets for containers
TW200736415A (en) Electroform, methods of making electroforms, and products made from electroforms
RU2015123743A (ru) Покрытия хром-оксид хрома, нанесенные на стальные подложки для упаковочных применений, и способ получения таких покрытий
TW200710287A (en) Composite metal layer formed using metal nanocrystalline particles in an electroplating bath
WO2007021327A3 (en) Pretreatment of magnesium substrates for electroplating
MX347701B (es) Procedimiento para decapar piezas de trabajo y solucion de decapado.
MX344320B (es) Método para manufacturar lámina de acero chapada con aleación de zinc sumergida en caliente.
WO2009125143A3 (fr) Procede de formation d'une couche d'amorcage de depot d'un metal sur un substrat
WO2013113810A3 (en) Electroless nickel plating bath
WO2009077146A3 (de) Galvanisches bad, verfahren zur galvanischen abscheidung und verwendung einer bipolaren membran zur separation in einem galvanischen bad
MY155420A (en) Method for producing tinned steel sheet, tinned steel sheet, and chemical conversion solution
WO2011064276A3 (en) Electroless ni-composite plated substrate and method
MX2016001847A (es) Metodo de formacion de pelicula de recubrimiento de capas multiples.
CN101487133A (zh) 表面印刷电镀的方法
MX2018007193A (es) Deposicion electroquimica de elementos en medios acuosos.
CN206266709U (zh) 一种高强度耐腐蚀电镀锌钢带
MY160159A (en) Method for production of hard disk substrate and hard disk substrate

Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20170331