HK1145192A1 - Process for manufacturing multi-layered thin film by dry vacuum vapor deposition - Google Patents

Process for manufacturing multi-layered thin film by dry vacuum vapor deposition

Info

Publication number
HK1145192A1
HK1145192A1 HK10111725.7A HK10111725A HK1145192A1 HK 1145192 A1 HK1145192 A1 HK 1145192A1 HK 10111725 A HK10111725 A HK 10111725A HK 1145192 A1 HK1145192 A1 HK 1145192A1
Authority
HK
Hong Kong
Prior art keywords
thin film
vapor deposition
vacuum vapor
dry vacuum
layered thin
Prior art date
Application number
HK10111725.7A
Other languages
English (en)
Inventor
Hyun Joong Kim
Hong Chul Kim
Jeong Rae Kim
Original Assignee
Ceko Corp Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ceko Corp Ltd filed Critical Ceko Corp Ltd
Publication of HK1145192A1 publication Critical patent/HK1145192A1/xx

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C23C28/30—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer
    • C23C28/32—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one pure metallic layer
    • C23C28/322—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one pure metallic layer only coatings of metal elements only
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C23C28/30—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer
    • C23C28/34—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one inorganic non-metallic material layer, e.g. metal carbide, nitride, boride, silicide layer and their mixtures, enamels, phosphates and sulphates
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C23C28/30—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer
    • C23C28/34—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one inorganic non-metallic material layer, e.g. metal carbide, nitride, boride, silicide layer and their mixtures, enamels, phosphates and sulphates
    • C23C28/345—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one inorganic non-metallic material layer, e.g. metal carbide, nitride, boride, silicide layer and their mixtures, enamels, phosphates and sulphates with at least one oxide layer
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C23C28/30—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer
    • C23C28/34—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one inorganic non-metallic material layer, e.g. metal carbide, nitride, boride, silicide layer and their mixtures, enamels, phosphates and sulphates
    • C23C28/345—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one inorganic non-metallic material layer, e.g. metal carbide, nitride, boride, silicide layer and their mixtures, enamels, phosphates and sulphates with at least one oxide layer
    • C23C28/3455—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one inorganic non-metallic material layer, e.g. metal carbide, nitride, boride, silicide layer and their mixtures, enamels, phosphates and sulphates with at least one oxide layer with a refractory ceramic layer, e.g. refractory metal oxide, ZrO2, rare earth oxides or a thermal barrier system comprising at least one refractory oxide layer
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C23C28/40—Coatings including alternating layers following a pattern, a periodic or defined repetition
    • C23C28/42—Coatings including alternating layers following a pattern, a periodic or defined repetition characterized by the composition of the alternating layers

Landscapes

  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Ceramic Engineering (AREA)
  • Physical Vapour Deposition (AREA)
  • Laminated Bodies (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Surface Treatment Of Optical Elements (AREA)
HK10111725.7A 2007-08-02 2010-12-15 Process for manufacturing multi-layered thin film by dry vacuum vapor deposition HK1145192A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR20070077906 2007-08-02
PCT/KR2008/004470 WO2009017376A2 (en) 2007-08-02 2008-07-31 Process for manufacturing multi-layered thin film by dry vacuum vapor deposition

Publications (1)

Publication Number Publication Date
HK1145192A1 true HK1145192A1 (en) 2011-04-08

Family

ID=40305064

Family Applications (1)

Application Number Title Priority Date Filing Date
HK10111725.7A HK1145192A1 (en) 2007-08-02 2010-12-15 Process for manufacturing multi-layered thin film by dry vacuum vapor deposition

Country Status (5)

Country Link
JP (1) JP2010535286A (ko)
KR (2) KR101824017B1 (ko)
CN (1) CN101784692B (ko)
HK (1) HK1145192A1 (ko)
WO (1) WO2009017376A2 (ko)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101246022B1 (ko) * 2010-08-19 2013-04-02 (주)에스아이티 반사 방지용 윈도우 패널의 제조 방법 및 이에 의해 제조된 반사 방지용 윈도우 패널
EP2616404B1 (en) 2010-09-14 2019-07-10 Corning Incorporated Appliance fascia and mounting therefore
KR101690091B1 (ko) * 2015-04-16 2016-12-27 주식회사 쎄코 진공증착용 항균성 프라이머 코팅제 및 이를 이용한 다중코팅 방법
KR102468988B1 (ko) 2020-07-14 2022-11-22 주식회사 동남티에스 금속증착층에 의한 장식패턴의 형성 방법 및 그 방법에 의한 장식패턴을 포함한 플라스틱 장식부재

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03273201A (ja) * 1990-03-23 1991-12-04 Asahi Optical Co Ltd 表面高反射鏡
JP2748066B2 (ja) * 1992-04-23 1998-05-06 富士写真光機株式会社 反射鏡
JP3352172B2 (ja) * 1993-08-30 2002-12-03 キヤノン株式会社 プラスチック製光学部品の光学薄膜およびその成膜方法
JP2000108262A (ja) * 1998-10-09 2000-04-18 Toray Ind Inc 金属蒸着用ポリプロピレンフィルム及び金属蒸着ポリプロピレンフィルム
US6958748B1 (en) * 1999-04-20 2005-10-25 Matsushita Electric Industrial Co., Ltd. Transparent board with conductive multi-layer antireflection films, transparent touch panel using this transparent board with multi-layer antireflection films, and electronic equipment with this transparent touch panel
JP2000328231A (ja) * 1999-05-20 2000-11-28 Toray Ind Inc 有機系蒸着物質による成膜方法
JP4482971B2 (ja) * 1999-09-08 2010-06-16 株式会社ニコン 反射鏡
JP3415801B2 (ja) * 2000-02-21 2003-06-09 三容真空工業株式会社 有機系被膜の蒸着方法とその装置
JP4023065B2 (ja) * 2000-03-23 2007-12-19 凸版印刷株式会社 反射防止部材
JP2003201596A (ja) * 2002-01-10 2003-07-18 Nitto Denko Corp 金属層の形成方法および金属箔積層体
JP2003255133A (ja) * 2002-03-05 2003-09-10 Yazaki Corp コンバイナおよびその製造方法並びに車両用表示装置
KR20030073733A (ko) * 2002-03-13 2003-09-19 주식회사 뮤렉스테크놀로지 플라스틱 모재의 금속박막 형성 장치 및 방법
KR100514953B1 (ko) * 2003-03-05 2005-09-14 주식회사 피앤아이 전자기기용 플라스틱 하우징 제조방법
JP2005169995A (ja) * 2003-12-15 2005-06-30 Dainippon Printing Co Ltd ガスバリア性シートおよび接着性改善シート
JP4888990B2 (ja) * 2004-10-26 2012-02-29 尾池工業株式会社 バックライト装置用反射体
JP3756171B1 (ja) * 2004-10-28 2006-03-15 尾池工業株式会社 酸化防止層を備えた金属蒸着フィルムの製造方法及び酸化防止層を備えた金属蒸着フィルム

Also Published As

Publication number Publication date
WO2009017376A2 (en) 2009-02-05
KR20160064051A (ko) 2016-06-07
KR101824017B1 (ko) 2018-02-01
WO2009017376A3 (en) 2009-04-16
JP2010535286A (ja) 2010-11-18
CN101784692B (zh) 2013-03-20
KR20090013719A (ko) 2009-02-05
CN101784692A (zh) 2010-07-21

Similar Documents

Publication Publication Date Title
HK1145192A1 (en) Process for manufacturing multi-layered thin film by dry vacuum vapor deposition
CA2819030A1 (en) Deposition of a silver layer on a nonconducting substrate
WO2006115718A3 (en) Associating information with an electronic document
WO2008060573A3 (en) System and method for providing a search portal with enhanced results
WO2009051665A8 (en) Fast and smooth scrolling of user interfaces operating on thin clients
SG125244A1 (en) Multimedia device integration system
PH12015500539B1 (en) Plasma source and methods for depositing thin film coatings using plasma enhanced chemical vapor deposition
WO2008058259A3 (en) An apparatus and method for dynamically providing web-based multimedia to a mobile phone
WO2007075787A3 (en) Techniques to improve location accuracy for a map
WO2005106876A3 (en) Portable music player and transmitter
AU5739100A (en) Internet radio receiver and interface
EP1861799B8 (en) Method and system for content search with mobile computing devices
WO2006126055A3 (en) Improved pocket computer and associated methods
GB0517585D0 (en) Intuitive search which delivers fast results on the mobile phone
MX355952B (es) Indice de termino compuesto para datos graficos.
WO2006049603A8 (en) Mobile telephone location application
TW200707102A (en) Improved articles
TW200712227A (en) Atomic layer deposition of metal-containing films using surface-activating agents
TW200611990A (en) Atomic layer deposition of copper using surface-activating agents
WO2007089492A3 (en) Systems and methods for navigating a mobile communication device menu
WO2011146183A3 (en) Method and system for audio routing in a vehicle mounted communication system
TW200737589A (en) Electronic device and antenna structure thereof
EP2478786A3 (en) Communications system for a helmet
TW200916312A (en) Plastic laminates and methods for making the same
TW200622024A (en) Copper(I) complexes for deposition of copper films by atomic layer deposition