HK1127796A1 - Integrally formed single piece light emitting diode light wire - Google Patents

Integrally formed single piece light emitting diode light wire

Info

Publication number
HK1127796A1
HK1127796A1 HK09105225.7A HK09105225A HK1127796A1 HK 1127796 A1 HK1127796 A1 HK 1127796A1 HK 09105225 A HK09105225 A HK 09105225A HK 1127796 A1 HK1127796 A1 HK 1127796A1
Authority
HK
Hong Kong
Prior art keywords
single piece
integrally formed
formed single
light wire
emitting diode
Prior art date
Application number
HK09105225.7A
Other languages
English (en)
Inventor
Paul Lo
Teddy Yeung Man Lo
Eddie Ping Kuen Li
Original Assignee
Paul Lo
Teddy Yeung Man Lo
United Luminous Internat Holdings Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Paul Lo, Teddy Yeung Man Lo, United Luminous Internat Holdings Ltd filed Critical Paul Lo
Publication of HK1127796A1 publication Critical patent/HK1127796A1/xx

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S4/00—Lighting devices or systems using a string or strip of light sources
    • F21S4/20—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports
    • F21S4/22—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports flexible or deformable, e.g. into a curved shape
    • F21S4/24—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports flexible or deformable, e.g. into a curved shape of ribbon or tape form, e.g. LED tapes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
    • H05B45/30—Driver circuits
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S2/00—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction
    • F21S2/005—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction of modular construction
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V31/00—Gas-tight or water-tight arrangements
    • F21V31/04—Provision of filling media
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2103/00—Elongate light sources, e.g. fluorescent tubes
    • F21Y2103/10—Elongate light sources, e.g. fluorescent tubes comprising a linear array of point-like light-generating elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00011—Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/02—Details
    • H05B33/04—Sealing arrangements, e.g. against humidity
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S362/00—Illumination
    • Y10S362/80—Light emitting diode

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Led Device Packages (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Illuminated Signs And Luminous Advertising (AREA)
  • Electroluminescent Light Sources (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Luminescent Compositions (AREA)
HK09105225.7A 2006-09-12 2009-06-10 Integrally formed single piece light emitting diode light wire HK1127796A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US84418406P 2006-09-12 2006-09-12
PCT/EP2007/007948 WO2008031580A1 (fr) 2006-09-12 2007-09-12 Fil lumineux à diodes électroluminescentes monopièce formé d'un seul tenant

Publications (1)

Publication Number Publication Date
HK1127796A1 true HK1127796A1 (en) 2009-10-09

Family

ID=38645763

Family Applications (1)

Application Number Title Priority Date Filing Date
HK09105225.7A HK1127796A1 (en) 2006-09-12 2009-06-10 Integrally formed single piece light emitting diode light wire

Country Status (13)

Country Link
US (2) US7988332B2 (fr)
EP (1) EP2061991B1 (fr)
JP (3) JP2009528685A (fr)
KR (1) KR101070066B1 (fr)
CN (1) CN101360947B (fr)
AT (1) ATE503149T1 (fr)
AU (1) AU2007296902B2 (fr)
CA (2) CA2656198C (fr)
DE (1) DE602007013419D1 (fr)
ES (1) ES2362804T3 (fr)
HK (1) HK1127796A1 (fr)
PL (1) PL2061991T3 (fr)
WO (1) WO2008031580A1 (fr)

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CA2751510C (fr) 2015-05-19
CN101360947B (zh) 2012-08-08
CA2656198C (fr) 2012-02-14
CA2751510A1 (fr) 2008-03-20
ATE503149T1 (de) 2011-04-15
US20080137332A1 (en) 2008-06-12
KR20090057115A (ko) 2009-06-03
JP2009528685A (ja) 2009-08-06
KR101070066B1 (ko) 2011-10-04
AU2007296902A1 (en) 2008-03-20
CN101360947A (zh) 2009-02-04
EP2061991A1 (fr) 2009-05-27
CA2656198A1 (fr) 2008-03-20
US8789971B2 (en) 2014-07-29
WO2008031580A1 (fr) 2008-03-20
JP5430635B2 (ja) 2014-03-05
AU2007296902B2 (en) 2011-08-25
JP2012039154A (ja) 2012-02-23
JP5599912B2 (ja) 2014-10-01
EP2061991B1 (fr) 2011-03-23
PL2061991T3 (pl) 2011-08-31
DE602007013419D1 (de) 2011-05-05
US7988332B2 (en) 2011-08-02
US20110305011A1 (en) 2011-12-15
ES2362804T3 (es) 2011-07-13

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