HK1126867A1 - Photocurable and thermosetting resin compositon and cured product thereof - Google Patents

Photocurable and thermosetting resin compositon and cured product thereof

Info

Publication number
HK1126867A1
HK1126867A1 HK09105881.2A HK09105881A HK1126867A1 HK 1126867 A1 HK1126867 A1 HK 1126867A1 HK 09105881 A HK09105881 A HK 09105881A HK 1126867 A1 HK1126867 A1 HK 1126867A1
Authority
HK
Hong Kong
Prior art keywords
photocurable
thermosetting resin
cured product
resin compositon
compositon
Prior art date
Application number
HK09105881.2A
Other languages
English (en)
Inventor
Shohei Makita
Masayuki Shimura
Original Assignee
Taiyo Holdings Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Taiyo Holdings Co Ltd filed Critical Taiyo Holdings Co Ltd
Publication of HK1126867A1 publication Critical patent/HK1126867A1/xx

Links

HK09105881.2A 2007-09-21 2009-06-30 Photocurable and thermosetting resin compositon and cured product thereof HK1126867A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007245913A JP5285257B2 (ja) 2007-09-21 2007-09-21 光硬化性・熱硬化性樹脂組成物及びその硬化物

Publications (1)

Publication Number Publication Date
HK1126867A1 true HK1126867A1 (en) 2009-09-11

Family

ID=40493732

Family Applications (1)

Application Number Title Priority Date Filing Date
HK09105881.2A HK1126867A1 (en) 2007-09-21 2009-06-30 Photocurable and thermosetting resin compositon and cured product thereof

Country Status (4)

Country Link
JP (1) JP5285257B2 (zh)
CN (1) CN101393394B (zh)
HK (1) HK1126867A1 (zh)
TW (1) TWI403839B (zh)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011122027A1 (ja) * 2010-03-31 2011-10-06 太陽ホールディングス株式会社 光硬化性熱硬化性樹脂組成物
CN110058490A (zh) * 2011-08-10 2019-07-26 日立化成株式会社 感光性树脂组合物、感光性薄膜、永久抗蚀剂以及永久抗蚀剂的制造方法
TW201435495A (zh) * 2011-09-30 2014-09-16 Taiyo Ink Mfg Co Ltd 感光性樹脂組成物、其之硬化皮膜及印刷配線板
KR102073440B1 (ko) * 2012-05-17 2020-02-04 다이요 잉키 세이조 가부시키가이샤 알칼리 현상형의 열경화성 수지 조성물, 프린트 배선판
JP6469006B2 (ja) * 2012-08-09 2019-02-13 スリーエム イノベイティブ プロパティズ カンパニー 光硬化性組成物
CN104378907B (zh) * 2013-08-12 2017-06-30 富葵精密组件(深圳)有限公司 电路板及其制作方法
CN104427742B (zh) * 2013-08-28 2017-08-22 鹏鼎控股(深圳)股份有限公司 覆盖膜及电路板
CN103616798B (zh) * 2013-11-20 2016-03-30 盐城艾肯科技有限公司 一种具有阻燃性能的感光树脂及其在生产感光油墨的应用
CN104808436B (zh) * 2014-01-27 2017-11-24 太阳油墨（苏州）有限公司 碱显影型感光性树脂组合物、干膜和固化物、以及印刷电路板
CN105467753B (zh) * 2014-07-31 2020-01-14 太阳油墨（苏州）有限公司 光固化性热固化性树脂组合物、干膜、固化物、及印刷电路板
CN107407882B (zh) * 2015-02-26 2021-01-26 太阳控股株式会社 光固化性热固化性树脂组合物、其固化物和印刷电路板
TWI595015B (zh) * 2015-03-27 2017-08-11 Ｌｇ化學股份有限公司 光硬化與熱硬化樹脂組成物及乾膜式防焊劑
JP6986340B2 (ja) * 2016-08-29 2021-12-22 株式会社タムラ製作所 プリント配線板及びプリント配線板の製造方法
CN109254498B (zh) * 2017-07-14 2023-07-14 株式会社田村制作所 感光性树脂组合物
CN108841236A (zh) * 2018-05-16 2018-11-20 江苏海田电子材料有限公司 一种uv快速固化阻焊油墨及其制备方法
CN108641469A (zh) * 2018-05-17 2018-10-12 江苏海田电子材料有限公司 一种紫外线固化阻焊油墨及其制备方法
JP6986534B2 (ja) * 2019-09-11 2021-12-22 株式会社タムラ製作所 感光性樹脂組成物、感光性樹脂組成物を有するドライフィルム及び感光性樹脂組成物の光硬化物を有するプリント配線板
JP7278600B2 (ja) 2020-04-02 2023-05-22 株式会社ユニバーサルエンターテインメント 遊技機
WO2024029543A1 (ja) * 2022-08-05 2024-02-08 Ｅｅｊａ株式会社 樹脂液及び造形物形成方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0987346A (ja) * 1995-09-19 1997-03-31 Dainippon Ink & Chem Inc エネルギ−線硬化型エポキシアクリレ−ト樹脂組成物
ATE268015T1 (de) * 2000-03-29 2004-06-15 Univ Kanagawa Durch licht und wärme aushärtbare harzzusammensetzung, aus dieser hergestellte lichtempfindliche trockenfolie und verfahren zur bildung eines musters damit
JP4623890B2 (ja) * 2000-09-11 2011-02-02 昭和電工株式会社 感光性組成物及びその硬化物並びにそれを用いたプリント配線基板

Also Published As

Publication number Publication date
CN101393394A (zh) 2009-03-25
CN101393394B (zh) 2011-09-14
TWI403839B (zh) 2013-08-01
JP2009073991A (ja) 2009-04-09
TW200933298A (en) 2009-08-01
JP5285257B2 (ja) 2013-09-11

Similar Documents

Publication Publication Date Title
HK1126867A1 (en) Photocurable and thermosetting resin compositon and cured product thereof
EP2009058A4 (en) THERMOSETTING POLYIMIDE RESIN FORMULA AND CURED PRODUCT OBTAINED THEREFROM
EP2436734A4 (en) THERMOSETTING RESIN COMPOSITE AND CURED PRODUCT THEREOF
EP2343326A4 (en) LIGHT-CURABLE COMPOSITION AND HARDENED PRODUCT
EP2253666A4 (en) HARDENABLE RESIN COMPOSITION AND CURED RESIN
HK1123816A1 (en) Curable resin composition, curable film and their cured products
EP2366742A4 (en) THERMOSETTING RESIN COMPOSITION AND PREPREGATION USING THE SAME
PL2189502T3 (pl) Płynne kompozycje żywicy oraz produkt utwardzony, w którym wykorzystuje się płynną kompozycję żywicy
EP2341106A4 (en) CURABLE COMPOSITION AND CURED PRODUCT OBTAINED THEREFROM
GB2447980B (en) Thermosetting resin composition
EP2025695A4 (en) EPOXY RESIN COMPOSITION AND CURED EPOXY RESIN
HK1121816A1 (en) Solder resist composition and cured product thereof
HK1173507A1 (zh) 感光性樹脂組合物及其固化物、以及印刷電路板
EP2357208A4 (en) CURABLE RESIN COMPOSITION, PAINT AND PLASTIC MOLDED PRODUCT PRODUCED BY ITS STRATIFICATION
HK1121815A1 (en) Black solder resist composition and cured product thereof
EP2428535A4 (en) THERMOSETTING POLYIMIDE RESIN COMPOSITION, CURED PRODUCT, AND ADHESIVE
PT2195156E (pt) Método e aparelho para moldagem por transferência de resina de peças compósitas
EP2319687A4 (en) THERMOPLASTIC RESIN LAMINATE
HK1131176A1 (en) Thermosetting resin composition and prepreg and laminate obtained with the same
EP2023346A4 (en) UV-CURABLE RESIN COMPOSITION AND CURED PRODUCT THEREOF
EP2426153A4 (en) CURABLE RESIN COMPOSITION, ADHESIVE COMPOSITION, AND CURED OBJECT OR COMPOSITE
EP2671904A4 (en) CURABLE RESIN COMPOSITION AND CURED PRODUCT BASED THEREOF
EP2270091A4 (en) THERMOPLASTIC RESIN COMPOSITION
EP2017307A4 (en) HEAT-RESISTANT RESIN COMPOSITION AND ITS USE
EP2636706A4 (en) CURABLE RESIN COMPOSITION AND CURED ARTICLE