HK1118895A1 - 表面位置檢測設備、曝光設備和曝光方法 - Google Patents

表面位置檢測設備、曝光設備和曝光方法

Info

Publication number
HK1118895A1
HK1118895A1 HK08110767.2A HK08110767A HK1118895A1 HK 1118895 A1 HK1118895 A1 HK 1118895A1 HK 08110767 A HK08110767 A HK 08110767A HK 1118895 A1 HK1118895 A1 HK 1118895A1
Authority
HK
Hong Kong
Prior art keywords
exposure
position detection
surface position
detection apparatus
exposure method
Prior art date
Application number
HK08110767.2A
Other languages
English (en)
Inventor
Yasuhiro Hidaka
Tadashi Nagayama
Original Assignee
Nikon Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nikon Corp filed Critical Nikon Corp
Publication of HK1118895A1 publication Critical patent/HK1118895A1/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H01L21/0274—Photolithographic processes
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70058—Mask illumination systems
    • G03F7/70191—Optical correction elements, filters or phase plates for controlling intensity, wavelength, polarisation, phase or the like
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70775—Position control, e.g. interferometers or encoders for determining the stage position
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/7085—Detection arrangement, e.g. detectors of apparatus alignment possibly mounted on wafers, exposure dose, photo-cleaning flux, stray light, thermal load
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
    • G03F9/7023—Aligning or positioning in direction perpendicular to substrate surface
    • G03F9/7026—Focusing
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
    • G03F9/7023—Aligning or positioning in direction perpendicular to substrate surface
    • G03F9/7034—Leveling
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7065—Production of alignment light, e.g. light source, control of coherence, polarization, pulse length, wavelength
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7088—Alignment mark detection, e.g. TTR, TTL, off-axis detection, array detector, video detection
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Epidemiology (AREA)
  • Environmental & Geological Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Public Health (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Mounting And Adjusting Of Optical Elements (AREA)
  • Automatic Focus Adjustment (AREA)
  • Optical Elements Other Than Lenses (AREA)
HK08110767.2A 2005-07-08 2008-09-26 表面位置檢測設備、曝光設備和曝光方法 HK1118895A1 (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005200178 2005-07-08
PCT/JP2006/312852 WO2007007549A1 (ja) 2005-07-08 2006-06-28 面位置検出装置、露光装置、および露光方法

Publications (1)

Publication Number Publication Date
HK1118895A1 true HK1118895A1 (zh) 2009-02-20

Family

ID=37636945

Family Applications (7)

Application Number Title Priority Date Filing Date
HK08108984.3A HK1121229A1 (zh) 2005-07-08 2008-08-13 面位置檢測裝置、曝光裝置及曝光方法
HK08110767.2A HK1118895A1 (zh) 2005-07-08 2008-09-26 表面位置檢測設備、曝光設備和曝光方法
HK13101034.1A HK1174103A1 (zh) 2005-07-08 2008-09-26 表面位置檢測設備、曝光設備和曝光方法
HK16103184.2A HK1215306A1 (zh) 2005-07-08 2016-03-18 面位置檢測裝置、曝光裝置及曝光方法
HK16103183.3A HK1215305A1 (zh) 2005-07-08 2016-03-18 面位置檢測裝置、曝光裝置及曝光方法
HK16108559.8A HK1220516A1 (zh) 2005-07-08 2016-07-19 曝光裝置與曝光方法
HK18111918.6A HK1252618A1 (zh) 2005-07-08 2018-09-17 表面位置檢測裝置、曝光裝置和曝光方法

Family Applications Before (1)

Application Number Title Priority Date Filing Date
HK08108984.3A HK1121229A1 (zh) 2005-07-08 2008-08-13 面位置檢測裝置、曝光裝置及曝光方法

Family Applications After (5)

Application Number Title Priority Date Filing Date
HK13101034.1A HK1174103A1 (zh) 2005-07-08 2008-09-26 表面位置檢測設備、曝光設備和曝光方法
HK16103184.2A HK1215306A1 (zh) 2005-07-08 2016-03-18 面位置檢測裝置、曝光裝置及曝光方法
HK16103183.3A HK1215305A1 (zh) 2005-07-08 2016-03-18 面位置檢測裝置、曝光裝置及曝光方法
HK16108559.8A HK1220516A1 (zh) 2005-07-08 2016-07-19 曝光裝置與曝光方法
HK18111918.6A HK1252618A1 (zh) 2005-07-08 2018-09-17 表面位置檢測裝置、曝光裝置和曝光方法

Country Status (7)

Country Link
US (5) US8149382B2 (zh)
EP (7) EP2463716B8 (zh)
JP (10) JP4883006B2 (zh)
KR (7) KR101484436B1 (zh)
CN (5) CN103728848B (zh)
HK (7) HK1121229A1 (zh)
WO (1) WO2007007549A1 (zh)

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US8111406B2 (en) 2007-11-14 2012-02-07 Nikon Corporation Surface position detecting apparatus, surface position detecting method, exposure apparatus, and device manufacturing method
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CN103365103B (zh) * 2012-04-10 2015-09-30 上海微电子装备有限公司 一种调焦调平装置及调焦调平方法
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JP6066627B2 (ja) * 2012-08-23 2017-01-25 キヤノン株式会社 位置検出装置、およびそれを用いたリソグラフィー装置並びにデバイスの製造方法
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JP6682263B2 (ja) * 2015-12-25 2020-04-15 キヤノン株式会社 検出装置、露光装置および物品の製造方法
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JP6774714B2 (ja) * 2016-07-25 2020-10-28 株式会社アドテックエンジニアリング ワークステージ及び露光装置
CN108121179A (zh) * 2016-11-30 2018-06-05 上海微电子装备（集团）股份有限公司 一种调焦调平装置
JP6706354B2 (ja) 2017-02-08 2020-06-03 日本電信電話株式会社 通信装置及び通信方法
JP6969164B2 (ja) * 2017-05-31 2021-11-24 株式会社リコー 評価装置、評価プログラム及び評価方法
WO2019082315A1 (ja) * 2017-10-25 2019-05-02 株式会社ニコン 加工装置、及び、移動体の製造方法
CN108008541B (zh) * 2017-10-25 2020-07-10 中国航空工业集团公司洛阳电光设备研究所 一种装调双光楔的方法
WO2019192865A1 (en) * 2018-04-06 2019-10-10 Asml Netherlands B.V. Inspection apparatus having non-linear optics
JP7180745B2 (ja) * 2019-02-21 2022-11-30 株式会社ニコン 面位置検出装置、露光装置、基板処理システム、およびデバイス製造方法
JP2020148463A (ja) * 2019-03-11 2020-09-17 株式会社日立ハイテク 高さ測定装置及びビーム照射装置
JP7496367B2 (ja) * 2019-03-13 2024-06-06 エーエスエムエル ホールディング エヌ．ブイ． リソグラフィ装置、計測装置、光学システムおよび方法
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Also Published As

Publication number Publication date
KR101447407B1 (ko) 2014-10-06
US9519223B2 (en) 2016-12-13
EP1909062A4 (en) 2009-10-21
EP2520978B1 (en) 2015-04-29
US20180188657A1 (en) 2018-07-05
JP5673772B2 (ja) 2015-02-18
EP2993525B1 (en) 2017-10-04
EP1909062B1 (en) 2014-03-05
KR20080026121A (ko) 2008-03-24
JPWO2007007549A1 (ja) 2009-01-29
EP2733535A3 (en) 2014-08-13
KR101447391B1 (ko) 2014-10-06
KR20180067714A (ko) 2018-06-20
HK1174103A1 (zh) 2013-05-31
US20150248064A1 (en) 2015-09-03
EP2463716A2 (en) 2012-06-13
KR20150142063A (ko) 2015-12-21
JP2013070075A (ja) 2013-04-18
CN103728848B (zh) 2017-06-30
CN105204303B (zh) 2018-03-20
US9069261B2 (en) 2015-06-30
JP2012053048A (ja) 2012-03-15
KR101484436B1 (ko) 2015-01-19
EP2993525A1 (en) 2016-03-09
JP4883056B2 (ja) 2012-02-22
JP6128178B2 (ja) 2017-05-17
KR101269298B1 (ko) 2013-05-29
JP5854106B2 (ja) 2016-02-09
HK1215306A1 (zh) 2016-08-19
US9927713B2 (en) 2018-03-27
EP3321741A2 (en) 2018-05-16
CN101218482A (zh) 2008-07-09
EP2463715A2 (en) 2012-06-13
KR20130019028A (ko) 2013-02-25
JP2018081314A (ja) 2018-05-24
JP5464191B2 (ja) 2014-04-09
EP2733535A2 (en) 2014-05-21
HK1252618A1 (zh) 2019-05-31
CN101218482B (zh) 2015-10-21
HK1121229A1 (zh) 2009-04-17
CN103728849B (zh) 2017-08-01
KR20140018336A (ko) 2014-02-12
CN105204303A (zh) 2015-12-30
JP6555222B2 (ja) 2019-08-07
HK1215305A1 (zh) 2016-08-19
JP5565449B2 (ja) 2014-08-06
HK1220516A1 (zh) 2017-05-05
EP2463716A3 (en) 2012-09-05
EP2463716B1 (en) 2015-03-18
EP2463715A3 (en) 2012-09-05
WO2007007549A1 (ja) 2007-01-18
KR101574918B1 (ko) 2015-12-04
EP1909062A1 (en) 2008-04-09
JP2017021382A (ja) 2017-01-26
JP2014057078A (ja) 2014-03-27
CN103728848A (zh) 2014-04-16
JP2015057837A (ja) 2015-03-26
EP3321741A3 (en) 2018-08-01
EP2463716B8 (en) 2015-05-20
JP4883006B2 (ja) 2012-02-22
US8149382B2 (en) 2012-04-03
US20120162623A1 (en) 2012-06-28
JP4883055B2 (ja) 2012-02-22
JP2016029483A (ja) 2016-03-03
KR101868218B1 (ko) 2018-06-15
EP2520978A3 (en) 2013-09-25
JP2008258655A (ja) 2008-10-23
CN105204302A (zh) 2015-12-30
EP2520978A2 (en) 2012-11-07
CN103728849A (zh) 2014-04-16
US20170075227A1 (en) 2017-03-16
KR20140084306A (ko) 2014-07-04
JP2008258654A (ja) 2008-10-23
EP2733535B1 (en) 2015-08-05
US20100129739A1 (en) 2010-05-27
KR20130130094A (ko) 2013-11-29
EP2463715B1 (en) 2015-06-10

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