HK1113707A1 - Method and device for treating substrates and corresponding nozzle unit - Google Patents

Method and device for treating substrates and corresponding nozzle unit

Info

Publication number
HK1113707A1
HK1113707A1 HK08102952.4A HK08102952A HK1113707A1 HK 1113707 A1 HK1113707 A1 HK 1113707A1 HK 08102952 A HK08102952 A HK 08102952A HK 1113707 A1 HK1113707 A1 HK 1113707A1
Authority
HK
Hong Kong
Prior art keywords
nozzle unit
corresponding nozzle
treating substrates
substrates
treating
Prior art date
Application number
HK08102952.4A
Other languages
English (en)
Inventor
Karsten Branz
Peter Dress
Michael Sowa
Thomas Gairing
Original Assignee
Steag Hamatech Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Steag Hamatech Ag filed Critical Steag Hamatech Ag
Publication of HK1113707A1 publication Critical patent/HK1113707A1/xx

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Cleaning By Liquid Or Steam (AREA)
HK08102952.4A 2004-11-04 2008-03-13 Method and device for treating substrates and corresponding nozzle unit HK1113707A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102004053337A DE102004053337A1 (de) 2004-11-04 2004-11-04 Verfahren und Vorrichtung zum Behandeln von Substraten und Düseneinheit hierfür
PCT/EP2005/011533 WO2006048185A1 (fr) 2004-11-04 2005-10-28 Procede et dispositif pour traiter des substrats et unite a buses utilisee a cet effet

Publications (1)

Publication Number Publication Date
HK1113707A1 true HK1113707A1 (en) 2008-10-10

Family

ID=35686552

Family Applications (1)

Application Number Title Priority Date Filing Date
HK08102952.4A HK1113707A1 (en) 2004-11-04 2008-03-13 Method and device for treating substrates and corresponding nozzle unit

Country Status (11)

Country Link
US (1) US20090071503A1 (fr)
EP (1) EP1815502B1 (fr)
JP (1) JP4801086B2 (fr)
KR (1) KR101256972B1 (fr)
CN (1) CN100539004C (fr)
CA (1) CA2583838A1 (fr)
DE (1) DE102004053337A1 (fr)
HK (1) HK1113707A1 (fr)
SG (1) SG174037A1 (fr)
TW (1) TW200631679A (fr)
WO (1) WO2006048185A1 (fr)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100852396B1 (ko) * 2006-10-20 2008-08-14 한국기계연구원 초음파를 이용한 세정장치
TWI421933B (zh) * 2007-05-16 2014-01-01 Lam Res Corp 板狀物件之超音波濕式處理的裝置與方法
US9595457B2 (en) * 2008-12-12 2017-03-14 Acm Research (Shanghai) Inc. Methods and apparatus for cleaning semiconductor wafers
TW201033760A (en) * 2009-03-05 2010-09-16 Nanya Technology Corp Apparatus for reducing cost of developer and the method thereof
SG174616A1 (en) * 2009-03-31 2011-11-28 Acm Res Shanghai Inc Methods and apparatus for cleaning semiconductor wafers
US20120160264A1 (en) * 2010-12-23 2012-06-28 Richard Endo Wet Processing Tool with Site Isolation
US20130206163A1 (en) * 2011-08-18 2013-08-15 Memc Electronic Materials, Spa Methods and Systems For Removing Contaminants From A Wire Of A Saw
US9005366B2 (en) 2011-10-06 2015-04-14 Intermolecular, Inc. In-situ reactor cleaning in high productivity combinatorial system
KR200466102Y1 (ko) 2012-12-14 2013-04-03 최호성 세정수의 소모량이 적은 유리기판의 메가 초음파 세정장치
DE102013100473A1 (de) * 2013-01-17 2014-07-17 Seho Systemtechnik Gmbh Verfahren und Vorrichtung zum Reinigen einer Lötdüse
JP2015185813A (ja) * 2014-03-26 2015-10-22 株式会社Ｓｃｒｅｅｎホールディングス 基板洗浄方法および基板洗浄装置
US20170271145A1 (en) 2016-03-21 2017-09-21 Suss Microtec Photomask Equipment Gmbh & Co. Kg Method and an apparatus for cleaning substrates

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4736760A (en) * 1986-02-21 1988-04-12 Robert A. Coberly Apparatus for cleaning, rinsing and drying substrates
DE8703114U1 (fr) * 1987-02-25 1987-04-09 Schering Ag, 1000 Berlin Und 4709 Bergkamen, De
DE19654903C2 (de) * 1996-04-24 1998-09-24 Steag Micro Tech Gmbh Vorrichtung zum Behandeln von Substraten in einem Fluid-Behälter
JP3511442B2 (ja) * 1996-12-18 2004-03-29 忠弘 大見 洗浄やエッチング、現像、剥離等を含むウエット処理に用いる省液型の液体供給ノズル、省液型の液体供給ノズル装置及びウエット処理装置
JPH1133506A (ja) * 1997-07-24 1999-02-09 Tadahiro Omi 流体処理装置及び洗浄処理システム
JP3558484B2 (ja) * 1997-04-23 2004-08-25 株式会社リコー 基板洗浄装置
US5980647A (en) * 1997-07-15 1999-11-09 International Business Machines Corporation Metal removal cleaning process and apparatus
DE19758267A1 (de) 1997-12-31 1999-07-08 Steag Micro Tech Gmbh Verfahren und Vorrichtung zum Behandeln von Substraten
GB9808182D0 (en) * 1998-04-17 1998-06-17 The Technology Partnership Plc Liquid projection apparatus
JP3806537B2 (ja) * 1999-03-10 2006-08-09 株式会社カイジョー 超音波洗浄機及びそれを具備するウエット処理ノズル
US6276370B1 (en) * 1999-06-30 2001-08-21 International Business Machines Corporation Sonic cleaning with an interference signal
JP4215900B2 (ja) * 1999-08-13 2009-01-28 アルプス電気株式会社 ウェット処理用ノズル装置およびウェット処理装置
US6554003B1 (en) * 1999-10-30 2003-04-29 Applied Materials, Inc. Method and apparatus for cleaning a thin disc
US7451774B2 (en) * 2000-06-26 2008-11-18 Applied Materials, Inc. Method and apparatus for wafer cleaning
JP2002280343A (ja) * 2001-03-15 2002-09-27 Nec Corp 洗浄処理装置、切削加工装置
JP2003077886A (ja) * 2001-06-14 2003-03-14 Alps Electric Co Ltd ウエット処理装置
DE10200525A1 (de) * 2002-01-09 2003-10-23 Mattson Wet Products Gmbh Vorrichtung und Verfahren zum Behandeln von scheibenförmigen Substraten
JP3948960B2 (ja) * 2002-01-16 2007-07-25 東京エレクトロン株式会社 超音波洗浄装置
DE10232984A1 (de) 2002-07-19 2004-02-05 Steag Hamatech Ag Düsenanordnung zum Aufbringen einer Flüssigkeit auf ein Substrat
US7524771B2 (en) * 2002-10-29 2009-04-28 Dainippon Screen Mfg. Co., Ltd. Substrate processing method using alkaline solution and acid solution
CN101084586B (zh) * 2003-11-05 2010-04-28 顶峰集团有限公司 采用多个频率的换能器的超声波处理方法和设备

Also Published As

Publication number Publication date
TWI357361B (fr) 2012-02-01
SG174037A1 (en) 2011-09-29
KR20070073810A (ko) 2007-07-10
US20090071503A1 (en) 2009-03-19
CN100539004C (zh) 2009-09-09
JP4801086B2 (ja) 2011-10-26
DE102004053337A1 (de) 2006-05-11
EP1815502B1 (fr) 2011-11-16
KR101256972B1 (ko) 2013-04-19
CA2583838A1 (fr) 2006-05-11
EP1815502A1 (fr) 2007-08-08
CN101073140A (zh) 2007-11-14
JP2008519446A (ja) 2008-06-05
TW200631679A (en) 2006-09-16
WO2006048185A1 (fr) 2006-05-11

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Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20151028