HK1087538A1 - Anisotropic conductive film and manufacturing method thereof - Google Patents

Anisotropic conductive film and manufacturing method thereof

Info

Publication number
HK1087538A1
HK1087538A1 HK06107734A HK06107734A HK1087538A1 HK 1087538 A1 HK1087538 A1 HK 1087538A1 HK 06107734 A HK06107734 A HK 06107734A HK 06107734 A HK06107734 A HK 06107734A HK 1087538 A1 HK1087538 A1 HK 1087538A1
Authority
HK
Hong Kong
Prior art keywords
manufacturing
conductive film
anisotropic conductive
anisotropic
film
Prior art date
Application number
HK06107734A
Other languages
English (en)
Original Assignee
Sumitomo Electricindustries Lt
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2003096173A external-priority patent/JP4039293B2/ja
Application filed by Sumitomo Electricindustries Lt filed Critical Sumitomo Electricindustries Lt
Publication of HK1087538A1 publication Critical patent/HK1087538A1/xx

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
    • H01R11/01—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/482—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body
    • H01L23/4827—Materials
    • H01L23/4828—Conductive organic material or pastes, e.g. conductive adhesives, inks
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
    • H01L21/486—Via connections through the substrate with or without pins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/52—Mounting semiconductor bodies in containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49827—Via connections through the substrates, e.g. pins going through the substrate, coaxial cables
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/007—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for elastomeric connecting elements
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2863—Contacting devices, e.g. sockets, burn-in boards or mounting fixtures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
    • H05K3/4069—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in organic insulating substrates
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Non-Insulated Conductors (AREA)
  • Laminated Bodies (AREA)
  • Chemically Coating (AREA)
  • Measuring Leads Or Probes (AREA)
HK06107734A 2003-03-31 2006-07-11 Anisotropic conductive film and manufacturing method thereof HK1087538A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2003096173A JP4039293B2 (ja) 2002-12-03 2003-03-31 異方性導電膜の製造方法
PCT/JP2004/003356 WO2004088795A1 (ja) 2003-03-31 2004-03-12 異方性導電膜及びその製造方法

Publications (1)

Publication Number Publication Date
HK1087538A1 true HK1087538A1 (en) 2006-10-13

Family

ID=33127465

Family Applications (1)

Application Number Title Priority Date Filing Date
HK06107734A HK1087538A1 (en) 2003-03-31 2006-07-11 Anisotropic conductive film and manufacturing method thereof

Country Status (8)

Country Link
US (1) US7563487B2 (ja)
EP (1) EP1612891B1 (ja)
KR (1) KR101011923B1 (ja)
CN (1) CN100369329C (ja)
CA (1) CA2522239C (ja)
HK (1) HK1087538A1 (ja)
TW (1) TWI342054B (ja)
WO (1) WO2004088795A1 (ja)

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US8518304B1 (en) 2003-03-31 2013-08-27 The Research Foundation Of State University Of New York Nano-structure enhancements for anisotropic conductive material and thermal interposers
WO2005070611A1 (ja) * 2004-01-23 2005-08-04 Sumitomo Electric Industries, Ltd. 微細孔が形成された延伸ポリテトラフルオロエチレン多孔質体及びその製造方法並びにアブレーション加工方法
JP2005298554A (ja) * 2004-04-07 2005-10-27 Sumitomo Electric Ind Ltd 膜厚方向に弾性回復性を有する延伸ポリテトラフルオロエチレン多孔質膜、その製造方法、及び該多孔質膜の使用
KR20080039830A (ko) * 2005-08-25 2008-05-07 스미토모덴키고교가부시키가이샤 이방성 도전시트, 그 제조방법, 접속방법 및 검사방법
US7834274B2 (en) * 2005-12-30 2010-11-16 Industrial Technology Research Institute Multi-layer printed circuit board and method for fabricating the same
EP1976007B1 (en) 2007-03-27 2017-11-29 Fujifilm Corporation Method of manufacture of anisotropically conductive member
KR101345084B1 (ko) * 2007-07-21 2014-01-22 이형곤 이방성도전필름과 그 제조용 도전입자 및 제조방법
JP2009283431A (ja) * 2007-12-27 2009-12-03 Fujifilm Corp 微細構造体およびその製造方法
JP4814277B2 (ja) * 2008-04-18 2011-11-16 ソニーケミカル＆インフォメーションデバイス株式会社 接合体、該接合体の製造方法、及び該接合体に用いられる異方性導電膜
KR101697951B1 (ko) * 2009-03-10 2017-01-19 에이케이이노텍주식회사 도전성 인터커넥터
US9573163B2 (en) * 2011-07-01 2017-02-21 Cam Holding Corporation Anisotropy reduction in coating of conductive films
KR101339166B1 (ko) * 2012-06-18 2013-12-09 주식회사 아이에스시 관통공이 형성된 도전성 입자를 가지는 검사용 소켓 및 그 제조방법
KR20210146455A (ko) * 2012-08-01 2021-12-03 데쿠세리아루즈 가부시키가이샤 이방성 도전 필름의 제조 방법, 이방성 도전 필름, 및 접속 구조체
CN103151113B (zh) * 2013-01-31 2015-07-08 中国科学院化学研究所 一种压敏导电膜的制备方法
KR102545904B1 (ko) * 2017-05-18 2023-06-20 신에츠 폴리머 가부시키가이샤 전기 커넥터 및 그 제조 방법
KR102629350B1 (ko) * 2018-12-12 2024-01-25 삼성디스플레이 주식회사 표시 장치 및 그 제조 방법
US20220282096A1 (en) 2021-03-05 2022-09-08 Xerox Corporation Printed textured surfaces with antimicrobial properties and methods thereof
CN113966086B (zh) * 2021-11-13 2022-05-06 江西中络电子有限公司 一种绿色制造系统集成的印制电路板加工方法

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Also Published As

Publication number Publication date
EP1612891B1 (en) 2011-11-30
EP1612891A1 (en) 2006-01-04
US7563487B2 (en) 2009-07-21
TWI342054B (en) 2011-05-11
KR101011923B1 (ko) 2011-02-01
CA2522239A1 (en) 2004-10-14
KR20050123118A (ko) 2005-12-29
CN100369329C (zh) 2008-02-13
TW200501288A (en) 2005-01-01
US20060251871A1 (en) 2006-11-09
CA2522239C (en) 2011-01-04
EP1612891A4 (en) 2007-11-21
CN1768454A (zh) 2006-05-03
WO2004088795A1 (ja) 2004-10-14

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Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20130312