HK1070401A1 - Conveyorized plating line and method for electrolytically metal plating a workpiece - Google Patents

Conveyorized plating line and method for electrolytically metal plating a workpiece

Info

Publication number
HK1070401A1
HK1070401A1 HK05102137A HK05102137A HK1070401A1 HK 1070401 A1 HK1070401 A1 HK 1070401A1 HK 05102137 A HK05102137 A HK 05102137A HK 05102137 A HK05102137 A HK 05102137A HK 1070401 A1 HK1070401 A1 HK 1070401A1
Authority
HK
Hong Kong
Prior art keywords
plating
workpiece
conveyorized
line
electrolytically metal
Prior art date
Application number
HK05102137A
Other languages
English (en)
Inventor
Egon Huebel
Original Assignee
Atotech Deutschland Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Atotech Deutschland Gmbh filed Critical Atotech Deutschland Gmbh
Publication of HK1070401A1 publication Critical patent/HK1070401A1/xx

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/16—Apparatus for electrolytic coating of small objects in bulk
    • C25D17/18—Apparatus for electrolytic coating of small objects in bulk having closed containers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/10—Electrodes, e.g. composition, counter electrode
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/16—Apparatus for electrolytic coating of small objects in bulk
    • C25D17/28—Apparatus for electrolytic coating of small objects in bulk with means for moving the objects individually through the apparatus during treatment
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/12—Process control or regulation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/004—Sealing devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Automation & Control Theory (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
HK05102137A 2002-03-28 2005-04-13 Conveyorized plating line and method for electrolytically metal plating a workpiece HK1070401A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10215463A DE10215463C1 (de) 2002-03-28 2002-03-28 Durchlaufanlage und Verfahren zum elektrolytischen Metallisieren von Werkstück
PCT/EP2003/002763 WO2003083185A1 (en) 2002-03-28 2003-03-17 Conveyorized plating line and method for electrolytically metal plating a workpiece

Publications (1)

Publication Number Publication Date
HK1070401A1 true HK1070401A1 (en) 2005-06-17

Family

ID=7714307

Family Applications (1)

Application Number Title Priority Date Filing Date
HK05102137A HK1070401A1 (en) 2002-03-28 2005-04-13 Conveyorized plating line and method for electrolytically metal plating a workpiece

Country Status (15)

Country Link
US (1) US7449089B2 (xx)
EP (1) EP1488025B1 (xx)
JP (1) JP4225919B2 (xx)
KR (1) KR100976745B1 (xx)
CN (1) CN100439570C (xx)
AT (1) ATE311485T1 (xx)
AU (1) AU2003218782A1 (xx)
BR (1) BR0306729B1 (xx)
CA (1) CA2469880A1 (xx)
DE (2) DE10215463C1 (xx)
ES (1) ES2252661T3 (xx)
HK (1) HK1070401A1 (xx)
MX (1) MXPA04009447A (xx)
TW (1) TWI244511B (xx)
WO (1) WO2003083185A1 (xx)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2027292B1 (en) * 2006-05-12 2010-05-12 Cepheid Dna recombination junction detection
US9303316B1 (en) * 2010-01-15 2016-04-05 Apollo Precision Kunming Yuanhong Limited Continuous web apparatus and method using an air to vacuum seal and accumulator
WO2012092301A2 (en) * 2010-12-29 2012-07-05 Intevac, Inc. Method and apparatus for masking substrates for deposition
CN110791786B (zh) * 2019-11-22 2020-11-17 深圳市金辉展电子有限公司 一种pcb电路板电镀用电镀液添加喷射装置

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3643670A (en) * 1970-08-20 1972-02-22 Finishing Equipment And Supply Apparatus for liquid treatment of flat materials
US4385967A (en) * 1981-10-07 1983-05-31 Chemcut Corporation Electroplating apparatus and method
JPS60100693A (ja) * 1983-11-02 1985-06-04 Nippon Steel Corp 電気メツキにおけるエツヂマスクの位置制御方法
DE3624481A1 (de) * 1986-07-19 1988-01-28 Schering Ag Anordnung zur elektrolytischen behandlung von plattenfoermigen gegenstaenden
DE3732476A1 (de) * 1987-09-24 1989-04-13 Schering Ag Verfahren zur angleichung der teilstroeme in einem elektrolytischen bad
EP0357326A3 (en) * 1988-08-26 1990-10-24 M & T Chemicals, Inc. Inhibiting corrosion of lead or lead-alloy anodes in a chromium electroplating bath
JP2718736B2 (ja) * 1989-01-24 1998-02-25 本田技研工業株式会社 多段通電電着塗装装置
DE3939681A1 (de) * 1989-12-01 1991-06-06 Schering Ag Verfahren zur steuerung des ablaufes von galvanischen anlagen, sowie zur durchfuehrung des verfahrens dienender anordnung
DE19736352C1 (de) * 1997-08-21 1998-12-10 Atotech Deutschland Gmbh Vorrichtung zur Kontaktierung von flachem Behandlungsgut in Durchlaufgalvanisieranlagen
US6913680B1 (en) * 2000-05-02 2005-07-05 Applied Materials, Inc. Method of application of electrical biasing to enhance metal deposition

Also Published As

Publication number Publication date
JP4225919B2 (ja) 2009-02-18
CA2469880A1 (en) 2003-10-09
AU2003218782A1 (en) 2003-10-13
ATE311485T1 (de) 2005-12-15
EP1488025A1 (en) 2004-12-22
EP1488025B1 (en) 2005-11-30
ES2252661T3 (es) 2006-05-16
BR0306729B1 (pt) 2012-07-24
CN100439570C (zh) 2008-12-03
DE60302560T2 (de) 2006-08-17
MXPA04009447A (es) 2005-01-25
BR0306729A (pt) 2004-12-21
DE60302560D1 (de) 2006-01-05
TW200306363A (en) 2003-11-16
KR20040111406A (ko) 2004-12-31
WO2003083185A1 (en) 2003-10-09
CN1643186A (zh) 2005-07-20
DE10215463C1 (de) 2003-07-24
JP2005521795A (ja) 2005-07-21
TWI244511B (en) 2005-12-01
US7449089B2 (en) 2008-11-11
US20050077185A1 (en) 2005-04-14
KR100976745B1 (ko) 2010-08-18

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Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20160317