DE60302560D1 - Durchlaufmetallisierungsanlage und verfahren zum elektrolytischen metallisieren von werkstücken - Google Patents

Durchlaufmetallisierungsanlage und verfahren zum elektrolytischen metallisieren von werkstücken

Info

Publication number
DE60302560D1
DE60302560D1 DE60302560T DE60302560T DE60302560D1 DE 60302560 D1 DE60302560 D1 DE 60302560D1 DE 60302560 T DE60302560 T DE 60302560T DE 60302560 T DE60302560 T DE 60302560T DE 60302560 D1 DE60302560 D1 DE 60302560D1
Authority
DE
Germany
Prior art keywords
workpieces
continuous metallization
plant
metallization plant
electrolytic metallizing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60302560T
Other languages
English (en)
Other versions
DE60302560T2 (de
Inventor
Egon Huebel
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Atotech Deutschland GmbH and Co KG
Original Assignee
Atotech Deutschland GmbH and Co KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Atotech Deutschland GmbH and Co KG filed Critical Atotech Deutschland GmbH and Co KG
Priority to DE60302560T priority Critical patent/DE60302560T2/de
Publication of DE60302560D1 publication Critical patent/DE60302560D1/de
Application granted granted Critical
Publication of DE60302560T2 publication Critical patent/DE60302560T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/16—Apparatus for electrolytic coating of small objects in bulk
    • C25D17/18—Apparatus for electrolytic coating of small objects in bulk having closed containers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/10—Electrodes, e.g. composition, counter electrode
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/16—Apparatus for electrolytic coating of small objects in bulk
    • C25D17/28—Apparatus for electrolytic coating of small objects in bulk with means for moving the objects individually through the apparatus during treatment
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/12—Process control or regulation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/004—Sealing devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Automation & Control Theory (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
DE60302560T 2002-03-28 2003-03-17 Durchlaufmetallisierungsanlage und verfahren zum elektrolytischen metallisieren von werkstücken Expired - Lifetime DE60302560T2 (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE60302560T DE60302560T2 (de) 2002-03-28 2003-03-17 Durchlaufmetallisierungsanlage und verfahren zum elektrolytischen metallisieren von werkstücken

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
DE10215463 2002-03-28
DE10215463A DE10215463C1 (de) 2002-03-28 2002-03-28 Durchlaufanlage und Verfahren zum elektrolytischen Metallisieren von Werkstück
DE60302560T DE60302560T2 (de) 2002-03-28 2003-03-17 Durchlaufmetallisierungsanlage und verfahren zum elektrolytischen metallisieren von werkstücken
PCT/EP2003/002763 WO2003083185A1 (en) 2002-03-28 2003-03-17 Conveyorized plating line and method for electrolytically metal plating a workpiece

Publications (2)

Publication Number Publication Date
DE60302560D1 true DE60302560D1 (de) 2006-01-05
DE60302560T2 DE60302560T2 (de) 2006-08-17

Family

ID=7714307

Family Applications (2)

Application Number Title Priority Date Filing Date
DE10215463A Expired - Fee Related DE10215463C1 (de) 2002-03-28 2002-03-28 Durchlaufanlage und Verfahren zum elektrolytischen Metallisieren von Werkstück
DE60302560T Expired - Lifetime DE60302560T2 (de) 2002-03-28 2003-03-17 Durchlaufmetallisierungsanlage und verfahren zum elektrolytischen metallisieren von werkstücken

Family Applications Before (1)

Application Number Title Priority Date Filing Date
DE10215463A Expired - Fee Related DE10215463C1 (de) 2002-03-28 2002-03-28 Durchlaufanlage und Verfahren zum elektrolytischen Metallisieren von Werkstück

Country Status (15)

Country Link
US (1) US7449089B2 (de)
EP (1) EP1488025B1 (de)
JP (1) JP4225919B2 (de)
KR (1) KR100976745B1 (de)
CN (1) CN100439570C (de)
AT (1) ATE311485T1 (de)
AU (1) AU2003218782A1 (de)
BR (1) BR0306729B1 (de)
CA (1) CA2469880A1 (de)
DE (2) DE10215463C1 (de)
ES (1) ES2252661T3 (de)
HK (1) HK1070401A1 (de)
MX (1) MXPA04009447A (de)
TW (1) TWI244511B (de)
WO (1) WO2003083185A1 (de)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007133732A2 (en) * 2006-05-12 2007-11-22 Cepheid Dna recombination junction detection
US9303316B1 (en) * 2010-01-15 2016-04-05 Apollo Precision Kunming Yuanhong Limited Continuous web apparatus and method using an air to vacuum seal and accumulator
WO2012092301A2 (en) * 2010-12-29 2012-07-05 Intevac, Inc. Method and apparatus for masking substrates for deposition
CN110791786B (zh) * 2019-11-22 2020-11-17 深圳市金辉展电子有限公司 一种pcb电路板电镀用电镀液添加喷射装置

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3643670A (en) * 1970-08-20 1972-02-22 Finishing Equipment And Supply Apparatus for liquid treatment of flat materials
US4385967A (en) * 1981-10-07 1983-05-31 Chemcut Corporation Electroplating apparatus and method
JPS60100693A (ja) * 1983-11-02 1985-06-04 Nippon Steel Corp 電気メツキにおけるエツヂマスクの位置制御方法
DE3624481A1 (de) * 1986-07-19 1988-01-28 Schering Ag Anordnung zur elektrolytischen behandlung von plattenfoermigen gegenstaenden
DE3732476A1 (de) * 1987-09-24 1989-04-13 Schering Ag Verfahren zur angleichung der teilstroeme in einem elektrolytischen bad
EP0357326A3 (de) * 1988-08-26 1990-10-24 M & T Chemicals, Inc. Korrosionsschutz von Anoden aus Blei oder Bleilegierung in einem Chrom-Elektroplattierungsbad
JP2718736B2 (ja) * 1989-01-24 1998-02-25 本田技研工業株式会社 多段通電電着塗装装置
DE3939681A1 (de) * 1989-12-01 1991-06-06 Schering Ag Verfahren zur steuerung des ablaufes von galvanischen anlagen, sowie zur durchfuehrung des verfahrens dienender anordnung
DE19736352C1 (de) * 1997-08-21 1998-12-10 Atotech Deutschland Gmbh Vorrichtung zur Kontaktierung von flachem Behandlungsgut in Durchlaufgalvanisieranlagen
US6913680B1 (en) * 2000-05-02 2005-07-05 Applied Materials, Inc. Method of application of electrical biasing to enhance metal deposition

Also Published As

Publication number Publication date
JP2005521795A (ja) 2005-07-21
TWI244511B (en) 2005-12-01
WO2003083185A1 (en) 2003-10-09
BR0306729B1 (pt) 2012-07-24
TW200306363A (en) 2003-11-16
CA2469880A1 (en) 2003-10-09
JP4225919B2 (ja) 2009-02-18
EP1488025A1 (de) 2004-12-22
ATE311485T1 (de) 2005-12-15
US7449089B2 (en) 2008-11-11
DE10215463C1 (de) 2003-07-24
AU2003218782A1 (en) 2003-10-13
MXPA04009447A (es) 2005-01-25
ES2252661T3 (es) 2006-05-16
DE60302560T2 (de) 2006-08-17
KR100976745B1 (ko) 2010-08-18
BR0306729A (pt) 2004-12-21
KR20040111406A (ko) 2004-12-31
CN1643186A (zh) 2005-07-20
HK1070401A1 (en) 2005-06-17
US20050077185A1 (en) 2005-04-14
CN100439570C (zh) 2008-12-03
EP1488025B1 (de) 2005-11-30

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