HK1061042A1 - Adhesive and electric device - Google Patents

Adhesive and electric device

Info

Publication number
HK1061042A1
HK1061042A1 HK04104061A HK04104061A HK1061042A1 HK 1061042 A1 HK1061042 A1 HK 1061042A1 HK 04104061 A HK04104061 A HK 04104061A HK 04104061 A HK04104061 A HK 04104061A HK 1061042 A1 HK1061042 A1 HK 1061042A1
Authority
HK
Hong Kong
Prior art keywords
adhesive
electric device
peak
improved
rigidity
Prior art date
Application number
HK04104061A
Other languages
English (en)
Inventor
Yasushi Akutsu
Original Assignee
Sony Chemicals Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Chemicals Corp filed Critical Sony Chemicals Corp
Publication of HK1061042A1 publication Critical patent/HK1061042A1/xx

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/563—Encapsulation of active face of flip-chip device, e.g. underfilling or underencapsulation of flip-chip, encapsulation preform on chip or mounting substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
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    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
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    • H01L2224/161—Disposition
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    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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    • H01L2224/732—Location after the connecting process
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    • H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
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    • H01L2224/831—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus
    • H01L2224/83101—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus as prepeg comprising a layer connector, e.g. provided in an insulating plate member
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    • H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
    • H01L2224/83855—Hardening the adhesive by curing, i.e. thermosetting
    • H01L2224/83856—Pre-cured adhesive, i.e. B-stage adhesive
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    • H01L2924/351—Thermal stress

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Die Bonding (AREA)
  • Adhesive Tapes (AREA)
HK04104061A 2001-04-27 2004-06-07 Adhesive and electric device HK1061042A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2001132181A JP4037619B2 (ja) 2001-04-27 2001-04-27 接着剤及び電気装置
PCT/JP2002/004134 WO2002088270A1 (fr) 2001-04-27 2002-04-25 Adhesif et dispositif electrique

Publications (1)

Publication Number Publication Date
HK1061042A1 true HK1061042A1 (en) 2004-09-03

Family

ID=18980227

Family Applications (1)

Application Number Title Priority Date Filing Date
HK04104061A HK1061042A1 (en) 2001-04-27 2004-06-07 Adhesive and electric device

Country Status (7)

Country Link
US (1) US7041237B2 (xx)
JP (1) JP4037619B2 (xx)
KR (1) KR100859304B1 (xx)
CN (1) CN1247724C (xx)
HK (1) HK1061042A1 (xx)
TW (1) TWI256967B (xx)
WO (1) WO2002088270A1 (xx)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5200386B2 (ja) * 2006-02-16 2013-06-05 東レ株式会社 電子材料用接着剤シート
CN102177212A (zh) * 2008-10-22 2011-09-07 日立化成工业株式会社 粘接剂膜

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62143986A (ja) * 1985-12-19 1987-06-27 Sumitomo Bakelite Co Ltd 絶縁樹脂ペ−スト
JP2658749B2 (ja) * 1992-06-25 1997-09-30 信越化学工業株式会社 半導体封止用樹脂組成物及び半導体装置
JP2000239627A (ja) * 1999-02-25 2000-09-05 Sumitomo Bakelite Co Ltd ダイアタッチペースト
CN1213442C (zh) * 1999-04-01 2005-08-03 三井化学株式会社 各向异性导电性糊
JP2001019936A (ja) * 1999-07-08 2001-01-23 Dow Corning Toray Silicone Co Ltd 接着剤、および半導体装置
JP2001019928A (ja) * 1999-07-08 2001-01-23 Dow Corning Toray Silicone Co Ltd 接着剤、および半導体装置
JP4642173B2 (ja) * 1999-08-05 2011-03-02 新日鐵化学株式会社 フィルム状接着剤用組成物
JP3371894B2 (ja) 1999-09-17 2003-01-27 ソニーケミカル株式会社 接続材料

Also Published As

Publication number Publication date
US20030155556A1 (en) 2003-08-21
WO2002088270A1 (fr) 2002-11-07
CN1247724C (zh) 2006-03-29
KR20040030174A (ko) 2004-04-09
JP2002327166A (ja) 2002-11-15
KR100859304B1 (ko) 2008-09-19
TWI256967B (en) 2006-06-21
CN1462302A (zh) 2003-12-17
JP4037619B2 (ja) 2008-01-23
US7041237B2 (en) 2006-05-09

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