HK1056752A1 - Device and method for electrically contacting withthe product to be electrolytic treated. - Google Patents
Device and method for electrically contacting withthe product to be electrolytic treated.Info
- Publication number
- HK1056752A1 HK1056752A1 HK03109099A HK03109099A HK1056752A1 HK 1056752 A1 HK1056752 A1 HK 1056752A1 HK 03109099 A HK03109099 A HK 03109099A HK 03109099 A HK03109099 A HK 03109099A HK 1056752 A1 HK1056752 A1 HK 1056752A1
- Authority
- HK
- Hong Kong
- Prior art keywords
- contact
- electrically contacting
- electrolytic treated
- contacting withthe
- product
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/005—Contacting devices
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/06—Suspending or supporting devices for articles to be coated
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
- Push-Button Switches (AREA)
- Thermistors And Varistors (AREA)
- Treatments Of Macromolecular Shaped Articles (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE10019720A DE10019720A1 (de) | 2000-04-20 | 2000-04-20 | Verfahren und Vorrichtung zum elektrischen Kontaktieren von plattenförmigem Behandlungsgut bei elektrolytischen Prozessen |
PCT/DE2001/001355 WO2001081659A1 (de) | 2000-04-20 | 2001-03-30 | Elektrisches kontaktierelement aus elastischem werkstoff |
Publications (1)
Publication Number | Publication Date |
---|---|
HK1056752A1 true HK1056752A1 (en) | 2004-02-27 |
Family
ID=7639534
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK03109099A HK1056752A1 (en) | 2000-04-20 | 2003-12-13 | Device and method for electrically contacting withthe product to be electrolytic treated. |
Country Status (9)
Country | Link |
---|---|
US (1) | US6926813B2 (ja) |
EP (1) | EP1274885B1 (ja) |
JP (1) | JP4871480B2 (ja) |
CN (1) | CN1190524C (ja) |
AT (1) | ATE280250T1 (ja) |
CA (1) | CA2405573A1 (ja) |
DE (2) | DE10019720A1 (ja) |
HK (1) | HK1056752A1 (ja) |
WO (1) | WO2001081659A1 (ja) |
Families Citing this family (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10340888B3 (de) * | 2003-09-04 | 2005-04-21 | Atotech Deutschland Gmbh | Stromversorgungseinrichtung in einer Vorrichtung zur elektrochemischen Behandlung |
DE102007038116A1 (de) * | 2007-07-30 | 2009-02-05 | Gebr. Schmid Gmbh & Co. | Haltemittel, Vorrichtung und Verfahren zum Transport von Substraten, insbesondere Leiterplatten |
EP2400044B1 (en) * | 2009-02-17 | 2016-09-07 | Sharp Kabushiki Kaisha | Method for producing mold |
RU2480540C1 (ru) * | 2009-03-05 | 2013-04-27 | Шарп Кабусики Кайся | Способ для изготовления форм и электродная конструкция для использования в данном способе |
DE102009018393B4 (de) * | 2009-04-22 | 2017-05-24 | Atotech Deutschland Gmbh | Verfahren, Haltemittel, Vorrichtung und System zum Transportieren eines flächigen Behandlungsgutes und Be- oder Entladeeinrichtung |
CN101570876B (zh) * | 2009-06-08 | 2011-11-30 | 深圳市常兴金刚石磨具有限公司 | 用于钻头电镀的电镀设备、电镀方法 |
WO2011026696A1 (en) * | 2009-09-01 | 2011-03-10 | Imec | Method for electrochemical processing of non-flat samples |
CN102859048B (zh) * | 2010-04-28 | 2015-07-29 | 夏普株式会社 | 模具和模具的制造方法 |
NL2005480C2 (nl) * | 2010-10-07 | 2012-04-11 | Meco Equip Eng | Inrichting voor het eenzijdig elektrolytisch behandelen van een vlak substraat. |
US8535501B2 (en) * | 2011-01-28 | 2013-09-17 | Ppg Industries Ohio, Inc. | Electrical contact arrangement for a coating process |
DE102011050131B3 (de) * | 2011-05-05 | 2012-08-16 | Lpkf Laser & Electronics Ag | Verfahren zur Herstellung von Metallisierungen auf Kunststoffteilen |
DE102012206800B3 (de) * | 2012-04-25 | 2013-09-05 | Atotech Deutschland Gmbh | Verfahren und Vorrichtung zum elektrolytischen Abscheiden eines Abscheidemetalls auf einem Werkstück |
JP3176980U (ja) * | 2012-04-28 | 2012-07-12 | 丸仲工業株式会社 | 水平搬送メッキ処理装置における薄板状被処理物のクランプ治具 |
DE102012019389B4 (de) * | 2012-10-02 | 2018-03-29 | Atotech Deutschland Gmbh | Haltevorrichtung für eine Ware und Behandlungsverfahren |
CN104805490A (zh) * | 2015-04-29 | 2015-07-29 | 广汽吉奥汽车有限公司 | 一种电镀单体零件、端部电镀结构及电镀方法 |
TWI573899B (zh) * | 2016-07-19 | 2017-03-11 | 蔡涵雲 | 線桿壓持式電鍍用掛架 |
TWI706058B (zh) * | 2019-04-03 | 2020-10-01 | 聯策科技股份有限公司 | 加壓式水封導電夾 |
TWI723640B (zh) * | 2019-11-21 | 2021-04-01 | 聯策科技股份有限公司 | 水封導電夾 |
Family Cites Families (27)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE71920C (de) | O. FISCHER in Göppersdorf i. S | Schmutzfänger in Flottenzuleitungsrohren von Schleudermaschinen zum Färben, Waschen, Bleichen u. s. w | ||
US1773042A (en) * | 1929-06-13 | 1930-08-12 | William S Jones | Mold or plate hanger |
US3525681A (en) * | 1967-04-21 | 1970-08-25 | Rapid Electroplating Process I | Electrolytic device |
US3649954A (en) * | 1970-06-26 | 1972-03-14 | John O Kurtz | Clamp-type electrical terminals |
GB1512959A (en) * | 1974-10-16 | 1978-06-01 | Lucas Electrical Ltd | Electro-plating jigs |
JPS5191832A (en) * | 1975-10-06 | 1976-08-12 | Jushiseikeihinno metsukishorisochi | |
US4100054A (en) * | 1977-03-11 | 1978-07-11 | Essex Group, Inc. | Combination insulating sleeve and electrical contact member for electro-plating rack |
US4158612A (en) * | 1977-12-27 | 1979-06-19 | The International Nickel Company, Inc. | Polymeric mandrel for electroforming and method of electroforming |
US4155815A (en) | 1978-04-03 | 1979-05-22 | Francis William L | Method of continuous electroplating and continuous electroplating machine for printed circuit board terminals |
JPS5634373A (en) * | 1979-08-29 | 1981-04-06 | Daiichi Shokai Kk | Video game machine |
IT1140510B (it) * | 1980-01-16 | 1986-10-01 | Oronzio De Nora Impianti | Elettrolizzatore bipolare e procedimento di elettrolisi di elettrolisi di alogenuri |
JPS6024199B2 (ja) * | 1980-10-31 | 1985-06-11 | 信越ポリマ−株式会社 | めつき用通電体 |
JPS57101698A (en) * | 1980-12-12 | 1982-06-24 | Shin Etsu Polymer Co Ltd | Electrifying member for electroplating |
JPS5864091A (ja) * | 1981-10-14 | 1983-04-16 | 富士プラント工業株式会社 | プリント配線基板へのメツキ方法および装置 |
DE3612220A1 (de) | 1986-04-11 | 1987-10-15 | Schering Ag | Haltezange |
US4755271A (en) | 1986-07-28 | 1988-07-05 | Siemens Aktiengesellschaft | Electroplating apparatus for plate-shaped workpieces, particularly printed circuit boards |
FR2617869B1 (fr) * | 1987-07-07 | 1989-12-15 | Laminage Continu Ste | Rouleau conducteur rotatif pour le depot electrolytique en continu sur des feuillards metalliques ou autres feuillards electroconducteurs |
SU1650790A1 (ru) * | 1988-05-27 | 1991-05-23 | Всесоюзный Научно-Исследовательский Институт Электромашиностроения | Устройство дл закреплени деталей, преимущественно, в гальванической ванне |
JPH089774B2 (ja) * | 1990-06-25 | 1996-01-31 | 三菱電機株式会社 | 薄膜形成装置 |
JPH083158B2 (ja) * | 1990-07-09 | 1996-01-17 | ワイケイケイ株式会社 | スライドファスナーチェーンの務歯に表面処理を施すための給電ドラム |
US5324565A (en) * | 1992-12-17 | 1994-06-28 | United Technologies Corporation | Conductive elastomeric compression pad for use in electrolysis cells |
FI953971A0 (fi) * | 1995-08-24 | 1995-08-24 | Galvatek Oy Ab | Apparatur foer faestande av en kropp pao sin plats foer elektrolytisk behandling |
JP3669797B2 (ja) * | 1996-12-10 | 2005-07-13 | 株式会社フジクラ | エレクトロケミカルエッチング用ウエハジグ |
JPH11200096A (ja) * | 1997-11-06 | 1999-07-27 | Ebara Corp | ウエハのメッキ用治具 |
ATE299537T1 (de) * | 1998-08-19 | 2005-07-15 | Atotech Deutschland Gmbh | Elektrochemische behandlungsanlage und verfahren zur zuführung von strom zu elektrolytisch behandelndem leiterplattenmaterial |
DE10019713C2 (de) * | 2000-04-20 | 2003-11-13 | Atotech Deutschland Gmbh | Vorrichtung und Verfahren zur elektrischen Kontaktierung von elektrolytisch zu behandelndem Gut in Durchlaufanlagen |
US6627052B2 (en) * | 2000-12-12 | 2003-09-30 | International Business Machines Corporation | Electroplating apparatus with vertical electrical contact |
-
2000
- 2000-04-20 DE DE10019720A patent/DE10019720A1/de not_active Withdrawn
-
2001
- 2001-03-30 DE DE50104217T patent/DE50104217D1/de not_active Expired - Lifetime
- 2001-03-30 CN CNB018083838A patent/CN1190524C/zh not_active Expired - Fee Related
- 2001-03-30 JP JP2001578725A patent/JP4871480B2/ja not_active Expired - Fee Related
- 2001-03-30 AT AT01937971T patent/ATE280250T1/de not_active IP Right Cessation
- 2001-03-30 WO PCT/DE2001/001355 patent/WO2001081659A1/de active IP Right Grant
- 2001-03-30 EP EP01937971A patent/EP1274885B1/de not_active Expired - Lifetime
- 2001-03-30 US US10/257,106 patent/US6926813B2/en not_active Expired - Lifetime
- 2001-03-30 CA CA002405573A patent/CA2405573A1/en not_active Abandoned
-
2003
- 2003-12-13 HK HK03109099A patent/HK1056752A1/xx not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
WO2001081659A1 (de) | 2001-11-01 |
ATE280250T1 (de) | 2004-11-15 |
DE50104217D1 (de) | 2004-11-25 |
CN1427902A (zh) | 2003-07-02 |
US20030121790A1 (en) | 2003-07-03 |
JP4871480B2 (ja) | 2012-02-08 |
EP1274885B1 (de) | 2004-10-20 |
EP1274885A1 (de) | 2003-01-15 |
DE10019720A1 (de) | 2001-10-31 |
JP2003533590A (ja) | 2003-11-11 |
US6926813B2 (en) | 2005-08-09 |
CA2405573A1 (en) | 2001-11-01 |
CN1190524C (zh) | 2005-02-23 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PC | Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee) |
Effective date: 20150330 |