HK1053279A1 - Gas assisted laser cutting of thin and fragile ma terials - Google Patents
Gas assisted laser cutting of thin and fragile ma terialsInfo
- Publication number
- HK1053279A1 HK1053279A1 HK03105647A HK03105647A HK1053279A1 HK 1053279 A1 HK1053279 A1 HK 1053279A1 HK 03105647 A HK03105647 A HK 03105647A HK 03105647 A HK03105647 A HK 03105647A HK 1053279 A1 HK1053279 A1 HK 1053279A1
- Authority
- HK
- Hong Kong
- Prior art keywords
- terials
- fragile
- thin
- laser cutting
- assisted laser
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/0869—Devices involving movement of the laser head in at least one axial direction
- B23K26/0876—Devices involving movement of the laser head in at least one axial direction in at least two axial directions
- B23K26/0884—Devices involving movement of the laser head in at least one axial direction in at least two axial directions in at least in three axial directions, e.g. manipulators, robots
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
- B23K26/142—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor for the removal of by-products
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
- B23K26/1435—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor involving specially adapted flow control means
- B23K26/1436—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor involving specially adapted flow control means for pressure control
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
- B23K26/1462—Nozzles; Features related to nozzles
- B23K26/1464—Supply to, or discharge from, nozzles of media, e.g. gas, powder, wire
- B23K26/1476—Features inside the nozzle for feeding the fluid stream through the nozzle
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Robotics (AREA)
- Laser Beam Processing (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/690,161 US6423928B1 (en) | 2000-10-12 | 2000-10-12 | Gas assisted laser cutting of thin and fragile materials |
PCT/US2001/040787 WO2002030612A1 (en) | 2000-10-12 | 2001-05-22 | Gas assisted laser cutting of thin and fragile materials |
Publications (1)
Publication Number | Publication Date |
---|---|
HK1053279A1 true HK1053279A1 (en) | 2003-10-17 |
Family
ID=24771337
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK03105647A HK1053279A1 (en) | 2000-10-12 | 2003-08-06 | Gas assisted laser cutting of thin and fragile ma terials |
Country Status (6)
Country | Link |
---|---|
US (1) | US6423928B1 (zh) |
EP (1) | EP1330332A4 (zh) |
JP (1) | JP2004510588A (zh) |
CN (1) | CN1222389C (zh) |
HK (1) | HK1053279A1 (zh) |
WO (1) | WO2002030612A1 (zh) |
Families Citing this family (36)
Publication number | Priority date | Publication date | Assignee | Title |
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KR100829876B1 (ko) * | 2000-10-26 | 2008-05-16 | 엑스에스아이엘 테크놀러지 리미티드 | 레이저 기계가공의 제어 |
FR2828825B1 (fr) * | 2001-08-22 | 2003-12-26 | Air Liquide | Procede et installation de coupage par faisceau laser utilisant un objectif a multifocales et une tuyere convergente/divergente |
US6706998B2 (en) * | 2002-01-11 | 2004-03-16 | Electro Scientific Industries, Inc. | Simulated laser spot enlargement |
US20030155328A1 (en) * | 2002-02-15 | 2003-08-21 | Huth Mark C. | Laser micromachining and methods and systems of same |
TW569351B (en) * | 2002-11-22 | 2004-01-01 | Au Optronics Corp | Excimer laser anneal apparatus and the application of the same |
JP2004188422A (ja) * | 2002-12-06 | 2004-07-08 | Hamamatsu Photonics Kk | レーザ加工装置及びレーザ加工方法 |
US6874510B2 (en) * | 2003-02-07 | 2005-04-05 | Lsi Logic Corporation | Method to use a laser to perform the edge clean operation on a semiconductor wafer |
US7754999B2 (en) | 2003-05-13 | 2010-07-13 | Hewlett-Packard Development Company, L.P. | Laser micromachining and methods of same |
US6969822B2 (en) | 2003-05-13 | 2005-11-29 | Hewlett-Packard Development Company, L.P. | Laser micromachining systems |
GB0328370D0 (en) | 2003-12-05 | 2004-01-14 | Southampton Photonics Ltd | Apparatus for providing optical radiation |
CN100443239C (zh) * | 2005-04-18 | 2008-12-17 | 深圳市大族激光科技股份有限公司 | 切割p/p板的方法及其工作台 |
JP4781722B2 (ja) * | 2005-06-07 | 2011-09-28 | 日酸Tanaka株式会社 | レーザピアシング方法及び加工装置 |
JP4869640B2 (ja) * | 2005-06-20 | 2012-02-08 | 三菱電機株式会社 | レーザ加工装置およびレーザ加工方法 |
CN101428370B (zh) * | 2005-06-27 | 2013-05-29 | 三菱电机株式会社 | 激光加工方法 |
JP5039050B2 (ja) * | 2005-11-25 | 2012-10-03 | トルンプフ ヴェルクツォイクマシーネン ゲゼルシャフト ミット ベシュレンクテル ハフツング ウント コンパニー コマンディートゲゼルシャフト | レーザ加工ノズル |
JP2010508227A (ja) * | 2006-10-27 | 2010-03-18 | エバーグリーン ソーラー, インコーポレイテッド | シリコンウエハを形成するための方法および装置 |
EP2195475B1 (en) * | 2007-07-27 | 2012-11-14 | Max Era, Inc. | Wafer/ribbon crystal and method for its manufacture |
CN100581707C (zh) * | 2007-08-16 | 2010-01-20 | 上海交通大学 | 用于激光切割的超音速喷嘴 |
US10016876B2 (en) | 2007-11-05 | 2018-07-10 | Baker Hughes, A Ge Company, Llc | Methods of forming polycrystalline compacts and earth-boring tools including polycrystalline compacts |
WO2009061766A2 (en) * | 2007-11-05 | 2009-05-14 | Baker Hughes Incorporated | Methods and apparatuses for forming cutting elements having a chamfered edge for earth-boring tools |
CN102089115A (zh) * | 2008-05-30 | 2011-06-08 | 三星钻石工业股份有限公司 | 激光加工装置及激光加工方法 |
DE102008030783B3 (de) * | 2008-06-28 | 2009-08-13 | Trumpf Werkzeugmaschinen Gmbh + Co. Kg | Verfahren zum Laserstrahlschrägschneiden und Laserbearbeitungsmaschine |
DE102008053729C5 (de) * | 2008-10-29 | 2013-03-07 | Trumpf Werkzeugmaschinen Gmbh + Co. Kg | Laserbearbeitungsdüse zum Bearbeiten von Blechen |
US8451598B2 (en) | 2010-06-15 | 2013-05-28 | Apple Inc. | Small form factor desk top computer |
JP5276699B2 (ja) * | 2011-07-29 | 2013-08-28 | ファナック株式会社 | ピアシングを行うレーザ加工方法及びレーザ加工装置 |
FR2982184B1 (fr) * | 2011-11-07 | 2014-08-01 | Air Liquide | Buse laser a element mobile sur couche gazeuse |
CN103212801A (zh) * | 2012-01-19 | 2013-07-24 | 昆山思拓机器有限公司 | 一种利用气流稳定焦点位置的切割嘴 |
US9931714B2 (en) | 2015-09-11 | 2018-04-03 | Baker Hughes, A Ge Company, Llc | Methods and systems for removing interstitial material from superabrasive materials of cutting elements using energy beams |
WO2017047785A1 (ja) * | 2015-09-18 | 2017-03-23 | 本田技研工業株式会社 | レーザー加工方法、及び、レーザー加工装置 |
KR101946898B1 (ko) * | 2016-02-25 | 2019-02-11 | 주식회사 에이치케이 | 레이저 가공용 노즐 |
CN109789513B (zh) * | 2016-10-13 | 2022-04-01 | 通快激光与系统工程有限公司 | 激光切割喷嘴,具有喷嘴的激光加工设备及其运行方法 |
EP3415265B1 (en) * | 2017-06-12 | 2020-12-30 | Robert Bosch GmbH | Method and device for high-throughput cutting of a ribbon-type substrate, particularly for an electrode of a battery, into separated pieces |
JP6725605B2 (ja) | 2018-08-24 | 2020-07-22 | ファナック株式会社 | レーザ加工システム、及びレーザ加工方法 |
JP6816071B2 (ja) * | 2018-08-24 | 2021-01-20 | ファナック株式会社 | レーザ加工システム、噴流観測装置、レーザ加工方法、及び噴流観測方法 |
DE102019213685B4 (de) * | 2019-09-10 | 2021-04-01 | Trumpf Laser- Und Systemtechnik Gmbh | Verfahren zum Positionieren eines Bearbeitungskopfes einer Laserbearbeitungsanlage sowie zugehörige Laserbearbeitungsanlage und Computerprogrammprodukt |
CN114908345B (zh) * | 2022-05-31 | 2024-02-02 | 浙江理工大学 | 一种冷喷涂系统 |
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DE1914876C3 (de) | 1969-03-24 | 1978-10-26 | Messer Griesheim Gmbh, 6000 Frankfurt | Einrichtung zum Schutz einer Anordnung zur kapazitiven Abstandsmessung |
US4031351A (en) * | 1972-10-25 | 1977-06-21 | Groupement Atomique Alsacienne Atlantique | High energy laser beam cutting method and apparatus |
US4158171A (en) | 1977-09-14 | 1979-06-12 | Ade Corporation | Wafer edge detection system |
US4161285A (en) | 1977-12-22 | 1979-07-17 | United Technologies Corporation | Laser nozzle construction |
JPS607593B2 (ja) * | 1980-03-28 | 1985-02-26 | 三菱電機株式会社 | レ−ザ切断ヘツド |
US4503313A (en) | 1981-04-07 | 1985-03-05 | Amada Engineering & Service Co., Inc. | Relatively adjustable laser and optic system for laser processing |
US4550241A (en) * | 1982-06-14 | 1985-10-29 | W. A. Whitney Corp. | Metal melting tool with improved stand-off means |
DE3339318C2 (de) | 1983-10-29 | 1995-05-24 | Trumpf Gmbh & Co | Laser-Bearbeitungsmaschine |
US4659900A (en) | 1985-07-06 | 1987-04-21 | Prima Industrie S.P.A. | Laser cutting machine |
US4813611A (en) * | 1987-12-15 | 1989-03-21 | Frank Fontana | Compressed air nozzle |
US4845354A (en) * | 1988-03-08 | 1989-07-04 | International Business Machines Corporation | Process control for laser wire bonding |
GB2241594B (en) | 1990-03-02 | 1993-09-01 | Rolls Royce Plc | Improvements in or relating to laser drilling of components |
DE4016199A1 (de) * | 1990-05-19 | 1991-11-21 | Linde Ag | Verfahren und vorrichtung zum laserstrahlschneiden |
EP0473287A1 (en) * | 1990-08-09 | 1992-03-04 | Cmb Foodcan Plc | Apparatus and method for monitoring laser material processing |
DE9013943U1 (de) | 1990-10-06 | 1991-01-03 | Trumpf GmbH & Co, 7257 Ditzingen | Laserdüse |
US5489888A (en) | 1990-11-07 | 1996-02-06 | Precitec Gmbh | Sensor system for contactless distance measuring |
US5375890A (en) | 1992-08-24 | 1994-12-27 | Andersen; John I. | Thermo lock-n-seal tube end for polyethylene pipe |
JP2720744B2 (ja) | 1992-12-28 | 1998-03-04 | 三菱電機株式会社 | レーザ加工機 |
TW245669B (zh) | 1993-09-27 | 1995-04-21 | Mitsubishi Electric Machine | |
JPH08242043A (ja) * | 1995-03-06 | 1996-09-17 | Ushio Inc | 希ガスエキシマを生成する方法 |
US5759428A (en) | 1996-03-15 | 1998-06-02 | International Business Machines Corporation | Method of laser cutting a metal line on an MR head |
DE19716616C2 (de) | 1997-04-21 | 2000-08-31 | Trumpf Gmbh & Co | Laserschneidmaschine und Verfahren zum Laserschneiden |
JPH10328867A (ja) * | 1997-06-05 | 1998-12-15 | Mitsubishi Electric Corp | レーザビーム加工装置およびレーザビーム加工装置用の焦点位置決め治具およびレーザビーム集光直径測定治具 |
WO2000054925A1 (en) * | 1998-09-09 | 2000-09-21 | Gsi Lumonics | Robotically operated laser head |
-
2000
- 2000-10-12 US US09/690,161 patent/US6423928B1/en not_active Expired - Lifetime
-
2001
- 2001-05-22 WO PCT/US2001/040787 patent/WO2002030612A1/en active Application Filing
- 2001-05-22 JP JP2002534036A patent/JP2004510588A/ja active Pending
- 2001-05-22 EP EP01937818A patent/EP1330332A4/en not_active Withdrawn
- 2001-05-22 CN CNB018047750A patent/CN1222389C/zh not_active Expired - Fee Related
-
2003
- 2003-08-06 HK HK03105647A patent/HK1053279A1/xx not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
US6423928B1 (en) | 2002-07-23 |
CN1398211A (zh) | 2003-02-19 |
EP1330332A1 (en) | 2003-07-30 |
WO2002030612A1 (en) | 2002-04-18 |
CN1222389C (zh) | 2005-10-12 |
EP1330332A4 (en) | 2008-01-02 |
JP2004510588A (ja) | 2004-04-08 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PC | Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee) |
Effective date: 20160522 |