AU2001256129A1 - Laser microdissection device - Google Patents
Laser microdissection deviceInfo
- Publication number
- AU2001256129A1 AU2001256129A1 AU2001256129A AU5612901A AU2001256129A1 AU 2001256129 A1 AU2001256129 A1 AU 2001256129A1 AU 2001256129 A AU2001256129 A AU 2001256129A AU 5612901 A AU5612901 A AU 5612901A AU 2001256129 A1 AU2001256129 A1 AU 2001256129A1
- Authority
- AU
- Australia
- Prior art keywords
- laser microdissection
- microdissection device
- laser
- microdissection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/083—Devices involving movement of the workpiece in at least one axial direction
- B23K26/0853—Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/0006—Working by laser beam, e.g. welding, cutting or boring taking account of the properties of the material involved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/03—Observing, e.g. monitoring, the workpiece
- B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0643—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising mirrors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/0665—Shaping the laser beam, e.g. by masks or multi-focusing by beam condensation on the workpiece, e.g. for focusing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B21/00—Microscopes
- G02B21/32—Micromanipulators structurally combined with microscopes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/30—Organic material
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N1/00—Sampling; Preparing specimens for investigation
- G01N1/28—Preparing specimens for investigation including physical details of (bio-)chemical methods covered elsewhere, e.g. G01N33/50, C12Q
- G01N1/2813—Producing thin layers of samples on a substrate, e.g. smearing, spinning-on
- G01N2001/2833—Collecting samples on a sticky, tacky, adhesive surface
- G01N2001/284—Collecting samples on a sticky, tacky, adhesive surface using local activation of adhesive, i.e. Laser Capture Microdissection
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N1/00—Sampling; Preparing specimens for investigation
- G01N1/28—Preparing specimens for investigation including physical details of (bio-)chemical methods covered elsewhere, e.g. G01N33/50, C12Q
- G01N1/286—Preparing specimens for investigation including physical details of (bio-)chemical methods covered elsewhere, e.g. G01N33/50, C12Q involving mechanical work, e.g. chopping, disintegrating, compacting, homogenising
- G01N2001/2873—Cutting or cleaving
- G01N2001/2886—Laser cutting, e.g. tissue catapult
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE10018253 | 2000-04-13 | ||
DE10018253A DE10018253C2 (en) | 2000-04-13 | 2000-04-13 | Laser microdissection |
PCT/DE2001/001227 WO2001078937A1 (en) | 2000-04-13 | 2001-03-29 | Laser microdissection device |
Publications (1)
Publication Number | Publication Date |
---|---|
AU2001256129A1 true AU2001256129A1 (en) | 2001-10-30 |
Family
ID=7638553
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AU2001256129A Abandoned AU2001256129A1 (en) | 2000-04-13 | 2001-03-29 | Laser microdissection device |
Country Status (7)
Country | Link |
---|---|
US (1) | US7035004B2 (en) |
EP (1) | EP1276586B1 (en) |
JP (1) | JP3996773B2 (en) |
AU (1) | AU2001256129A1 (en) |
DE (2) | DE10018253C2 (en) |
TW (1) | TW486566B (en) |
WO (1) | WO2001078937A1 (en) |
Families Citing this family (45)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10157895B4 (en) * | 2001-11-26 | 2006-06-14 | Alpha Laser Gmbh | Method for relative positioning and orientation of a laser processing head and a workpiece |
DE10157893B4 (en) * | 2001-11-26 | 2006-06-29 | Alpha Laser Gmbh | Laser processing device |
TWI226280B (en) * | 2002-09-25 | 2005-01-11 | Au Optronics Corp | Precision notching device and method for cutting test piece |
DE10261663A1 (en) * | 2002-12-20 | 2004-07-01 | Carl Zeiss Jena Gmbh | microscope |
DE10300091A1 (en) * | 2003-01-04 | 2004-07-29 | Lubatschowski, Holger, Dr. | microtome |
US7471450B2 (en) * | 2004-10-06 | 2008-12-30 | Northeastern University | Confocal reflectance microscope system with dual rotating wedge scanner assembly |
DE102004057738A1 (en) * | 2004-11-26 | 2006-06-01 | Jenoptik Laser, Optik, Systeme Gmbh | Scanning device for optically scanning the surface of an object comprises a deviating unit containing an arrangement for adjusting a constant angle speed for a rotating optical wedge acting as a deflecting element |
US20070016177A1 (en) * | 2005-07-14 | 2007-01-18 | Boris Vaynberg | Laser ablation apparatus useful for hard tissue removal |
EP2166342A4 (en) * | 2007-07-17 | 2012-05-09 | Nikon Corp | Light stimulus apparatus and observation apparatus |
IT1400348B1 (en) * | 2010-05-06 | 2013-05-24 | Orotig S R L | LASER WELDING EQUIPMENT AND METHOD |
JP5518612B2 (en) | 2010-07-20 | 2014-06-11 | 株式会社ディスコ | Optical apparatus and laser processing apparatus including the same |
US8497138B2 (en) | 2010-09-30 | 2013-07-30 | Genetix Limited | Method for cell selection |
EP2594357A1 (en) * | 2011-11-16 | 2013-05-22 | Optec S.p.A. | Device for and process of laser welding with a calibration unit with refraction means |
DE102012207240A1 (en) | 2012-05-02 | 2013-11-07 | Leica Microsystems Cms Gmbh | Laser-micro dissection device for use in e.g. inverse microscope for dissection of human tissue sample for cell culture, has z-adjustment device and optical focus displacement device controlled together by optical laser-scanning device |
JP6118403B2 (en) | 2012-05-24 | 2017-04-19 | ライカ ミクロジュステムス ツェーエムエス ゲーエムベーハー | Sample collector for collecting laser micro-cutting sites |
DE102012218382B4 (en) * | 2012-10-09 | 2015-04-23 | Leica Microsystems Cms Gmbh | Method for determining a laser microdissection range and associated laser microdissection system |
DE102013209881A1 (en) | 2013-05-28 | 2014-12-04 | Leica Microsystems Cms Gmbh | Laser microdissection system with visualization device, visualization device for laser microdissection system and method for laser microdissection |
DE102013209964B4 (en) | 2013-05-28 | 2015-12-17 | Leica Microsystems Cms Gmbh | Laser microdissection system with user information unit and method for laser microdissection |
DE102013209880A1 (en) | 2013-05-28 | 2014-12-04 | Leica Microsystems Cms Gmbh | Method for laser microdissection and laser microdissection system |
DE102013212811A1 (en) | 2013-07-01 | 2015-01-08 | Leica Microsystems Cms Gmbh | Laser microdissection system and assay procedure for nucleic acid containing samples |
DE102013216938B3 (en) * | 2013-08-26 | 2015-01-08 | Leica Microsystems Cms Gmbh | Method for calibrating a laser deflector of a laser microdissection system and laser microdissection system |
DE102013109481A1 (en) | 2013-08-30 | 2015-03-05 | Firma Leica Microsystems CMS GmbH | Laser microdissection system and laser microdissection method |
DE102013224172A1 (en) | 2013-11-26 | 2015-05-28 | Leica Microsystems Cms Gmbh | Device for positioning an object or slide |
DE102013226782B4 (en) | 2013-12-19 | 2016-06-02 | Leica Microsystems Cms Gmbh | Lasermikrodissektionsvorrichtung |
DE102013227155A1 (en) | 2013-12-24 | 2015-06-25 | Leica Microsystems Cms Gmbh | Laser microdissection and laser microdissection system |
DE102014202860B4 (en) | 2014-02-17 | 2016-12-29 | Leica Microsystems Cms Gmbh | Providing sample information with a laser microdissection system |
DE102014203747A1 (en) | 2014-02-28 | 2015-09-03 | Leica Microsystems Cms Gmbh | Laser microdissection system and laser microdissection method |
DE102014203656B4 (en) | 2014-02-28 | 2015-12-24 | Leica Microsystems Cms Gmbh | Laser microdissection method and use of a laser microdissection system |
GB201423398D0 (en) * | 2014-12-31 | 2015-02-11 | Isis Innovation | Optical interrogation and control of dynamic biological functions |
US10621411B2 (en) | 2015-01-19 | 2020-04-14 | Leica Microsystems Cms Gmbh | Method for laser microdissection |
DE102015108017A1 (en) | 2015-05-20 | 2016-11-24 | Leica Microsystems Cms Gmbh | Method and examination system for examining and processing a microscopic sample |
DE102015108276B4 (en) | 2015-05-26 | 2017-03-09 | Leica Microsystems Cms Gmbh | System for laser microdissection and laser microdissection method |
GB2543273A (en) | 2015-10-12 | 2017-04-19 | Leica Microsystems Cambridge Ltd | Obtaining biological information and storing and searching biological information in a database |
DE102016105946A1 (en) | 2016-03-31 | 2017-10-05 | Leica Microsystems Cms Gmbh | Sample processing arrangement with laser microdissection system, communication device and manufacturing system |
DE102016110750A1 (en) | 2016-06-10 | 2017-12-14 | Leica Microsystems Cms Gmbh | Support membrane for the laser microdissection of a sample applied to the support membrane, laser microdissection device and laser microdissection method using such a support membrane |
DE102016111781B3 (en) | 2016-06-28 | 2017-06-29 | Leica Microsystems Cms Gmbh | Contamination protection device for a laser microdissection system and laser microdissection system |
DE102016111949B4 (en) | 2016-06-30 | 2018-03-01 | Leica Microsystems Cms Gmbh | Laser Microscope System |
CN107462438B (en) * | 2017-08-01 | 2019-06-11 | 沈阳理工大学 | A kind of rotating disc type crop breeding laser dicing automatic sampler |
DE102017121326B4 (en) | 2017-09-14 | 2021-01-14 | Leica Microsystems Cms Gmbh | Collection device and method for collecting dissected or ablated specimens and microscope with such a device |
CN108165489A (en) * | 2017-12-30 | 2018-06-15 | 宁波华仪宁创智能科技有限公司 | Laser microprobe dating device and its method of work |
DE102019102852B3 (en) | 2019-02-05 | 2020-07-02 | Leica Microsystems Cms Gmbh | Laser microdissection method, laser microdissection system and computer program |
DE102020100587A1 (en) | 2020-01-13 | 2021-07-15 | Leica Microsystems Cms Gmbh | Method for checking a dissection process in a laser microdissection system and means for carrying it out |
CN113102887A (en) * | 2021-04-21 | 2021-07-13 | 济南金威刻科技发展有限公司 | Omnibearing laser welding production line and welding method thereof |
DE102021114585A1 (en) | 2021-06-07 | 2022-12-08 | Leica Microsystems Cms Gmbh | Microtiter plate, components therefor, sample stage, microscope and related method |
EP4112742A1 (en) | 2021-06-29 | 2023-01-04 | Leica Microsystems CMS GmbH | Method for generating region-specific amplification templates |
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US3083611A (en) * | 1961-01-30 | 1963-04-02 | Adrian J Ziolkowski | Multi-lobar scan horizon sensor |
US3626141A (en) * | 1970-04-30 | 1971-12-07 | Quantronix Corp | Laser scribing apparatus |
US3704949A (en) * | 1970-06-22 | 1972-12-05 | Rms Ind Inc | Method and apparatus for personal identification |
JPS5919798B2 (en) * | 1974-11-01 | 1984-05-08 | 株式会社日立製作所 | Laser processing equipment |
GB1521931A (en) * | 1976-01-31 | 1978-08-16 | Ferranti Ltd | Optical apparatus |
US4061415A (en) * | 1976-07-02 | 1977-12-06 | Sanford Research Institute | Nutating radiation deflecting method and apparatus |
US4407464A (en) * | 1981-07-27 | 1983-10-04 | James Linick | Steering mechanism for a thermal imaging system and rangefinder therefor |
DE3214268A1 (en) * | 1982-04-17 | 1983-10-20 | Fa. Carl Zeiss, 7920 Heidenheim | OPTICAL ADJUSTMENT |
US4822974A (en) * | 1988-02-18 | 1989-04-18 | United Technologies Corporation | Laser hold drilling system with lens and two wedge prisms including axial displacement of at least one prism |
JPH02155589A (en) * | 1988-12-09 | 1990-06-14 | Hitachi Ltd | Optical path adjusting system |
JP2765022B2 (en) * | 1989-03-24 | 1998-06-11 | キヤノン販売株式会社 | 3D image forming device |
JPH03130940A (en) * | 1989-05-24 | 1991-06-04 | Kyocera Corp | Method and device for controlling light spot |
US4940881A (en) * | 1989-09-28 | 1990-07-10 | Tamarack Scientific Co., Inc. | Method and apparatus for effecting selective ablation of a coating from a substrate, and controlling the wall angle of coating edge portions |
NL9002827A (en) * | 1990-12-20 | 1992-07-16 | Opticon Sensors Europ | SCAN FOR SYMBOL CODES. |
US5638396A (en) * | 1994-09-19 | 1997-06-10 | Textron Systems Corporation | Laser ultrasonics-based material analysis system and method |
WO1997006462A1 (en) * | 1995-08-09 | 1997-02-20 | Minnesota Mining And Manufacturing Company | Rotating optical system for laser machining apparatus |
US6040139A (en) * | 1995-09-19 | 2000-03-21 | Bova; G. Steven | Laser cell purification system |
US6052223A (en) * | 1996-01-09 | 2000-04-18 | Olympus Optical Co., Ltd. | Microscope with chromatic aberration correcting function |
WO1997029354A1 (en) * | 1996-02-05 | 1997-08-14 | Bayer Aktiengesellschaft | Process and device for sorting and for extraction of biological objects arranged on planar means, such as biological cells or cell organelles, histological sections, chromosome particles etc. using laser beams |
AU4562497A (en) * | 1996-10-02 | 1998-04-24 | Cell Robotics, Inc. | Microscope with laser port |
US6469779B2 (en) * | 1997-02-07 | 2002-10-22 | Arcturus Engineering, Inc. | Laser capture microdissection method and apparatus |
DE19980326T1 (en) * | 1998-01-21 | 2000-06-15 | Renishaw Plc | Beam steering device |
DE19817851C1 (en) * | 1998-04-22 | 1999-10-28 | Lpkf Laser & Electronics Gmbh | Laser beam deflection method, e.g. for laser machining |
-
2000
- 2000-04-13 DE DE10018253A patent/DE10018253C2/en not_active Expired - Fee Related
-
2001
- 2001-03-29 WO PCT/DE2001/001227 patent/WO2001078937A1/en active IP Right Grant
- 2001-03-29 JP JP2001576225A patent/JP3996773B2/en not_active Expired - Lifetime
- 2001-03-29 EP EP01929282A patent/EP1276586B1/en not_active Expired - Lifetime
- 2001-03-29 AU AU2001256129A patent/AU2001256129A1/en not_active Abandoned
- 2001-03-29 US US10/257,673 patent/US7035004B2/en not_active Expired - Lifetime
- 2001-03-29 DE DE50107051T patent/DE50107051D1/en not_active Expired - Lifetime
- 2001-04-12 TW TW090108758A patent/TW486566B/en not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
TW486566B (en) | 2002-05-11 |
DE10018253C2 (en) | 2003-08-21 |
JP3996773B2 (en) | 2007-10-24 |
WO2001078937A1 (en) | 2001-10-25 |
US20030133190A1 (en) | 2003-07-17 |
DE50107051D1 (en) | 2005-09-15 |
DE10018253A1 (en) | 2001-10-25 |
EP1276586A1 (en) | 2003-01-22 |
EP1276586B1 (en) | 2005-08-10 |
JP2003531393A (en) | 2003-10-21 |
US7035004B2 (en) | 2006-04-25 |
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