HK1051441A1 - Semiconductor joining substrate-use tape with adhesive and copper-clad laminate sheet using it - Google Patents

Semiconductor joining substrate-use tape with adhesive and copper-clad laminate sheet using it

Info

Publication number
HK1051441A1
HK1051441A1 HK03103570A HK03103570A HK1051441A1 HK 1051441 A1 HK1051441 A1 HK 1051441A1 HK 03103570 A HK03103570 A HK 03103570A HK 03103570 A HK03103570 A HK 03103570A HK 1051441 A1 HK1051441 A1 HK 1051441A1
Authority
HK
Hong Kong
Prior art keywords
adhesive
copper
clad laminate
use tape
laminate sheet
Prior art date
Application number
HK03103570A
Other languages
English (en)
Inventor
Mikihiro Ogura
Syouji Kigoshi
Masami Tokunaga
Yasuaki Tsutsumi
Ryuichi Kamei
Ken Shimizu
Original Assignee
Toray Industries
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toray Industries filed Critical Toray Industries
Publication of HK1051441A1 publication Critical patent/HK1051441A1/xx

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49572—Lead-frames or other flat leads consisting of thin flexible metallic tape with or without a film carrier
    • H—ELECTRICITY
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    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
    • H—ELECTRICITY
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    • H01L23/00—Details of semiconductor or other solid state devices
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    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3114—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed the device being a chip scale package, e.g. CSP
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    • H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
    • H01L23/3128—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation the substrate having spherical bumps for external connection
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    • H01L23/3157—Partial encapsulation or coating
    • H01L23/3185—Partial encapsulation or coating the coating covering also the sidewalls of the semiconductor body
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    • H01L24/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
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    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
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    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16245—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
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    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
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    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/86—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using tape automated bonding [TAB]
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    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12042—LASER
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    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
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    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24843—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] with heat sealable or heat releasable adhesive layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2852—Adhesive compositions
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2852—Adhesive compositions
    • Y10T428/287—Adhesive compositions including epoxy group or epoxy polymer

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Adhesive Tapes (AREA)
  • Laminated Bodies (AREA)
  • Wire Bonding (AREA)
  • Adhesives Or Adhesive Processes (AREA)
HK03103570A 2000-08-25 2003-05-20 Semiconductor joining substrate-use tape with adhesive and copper-clad laminate sheet using it HK1051441A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2000255352A JP4665298B2 (ja) 2000-08-25 2000-08-25 半導体装置用接着剤付きテープおよびそれを用いた銅張り積層板、半導体接続用基板ならびに半導体装置
PCT/JP2001/007183 WO2002017379A1 (fr) 2000-08-25 2001-08-22 Bande adhesive destinee a etre utilisee pour un substrat de connexion de semi-conducteurs et feuille stratifiee revetue de cuivre utilisant ladite bande

Publications (1)

Publication Number Publication Date
HK1051441A1 true HK1051441A1 (en) 2003-08-01

Family

ID=18744154

Family Applications (1)

Application Number Title Priority Date Filing Date
HK03103570A HK1051441A1 (en) 2000-08-25 2003-05-20 Semiconductor joining substrate-use tape with adhesive and copper-clad laminate sheet using it

Country Status (10)

Country Link
US (1) US6982484B2 (nl)
EP (1) EP1249863B1 (nl)
JP (1) JP4665298B2 (nl)
KR (1) KR100602537B1 (nl)
CN (1) CN1204611C (nl)
AT (1) ATE380393T1 (nl)
DE (1) DE60131725T2 (nl)
HK (1) HK1051441A1 (nl)
TW (1) TW594891B (nl)
WO (1) WO2002017379A1 (nl)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100633849B1 (ko) * 2002-04-03 2006-10-13 가부시키가이샤 도모에가와 세이시쇼 반도체 장치 제조용 접착 시트
US7005729B2 (en) * 2002-04-24 2006-02-28 Intel Corporation Device packaging using tape automated bonding (TAB) strip bonded to strip carrier frame
JP4082242B2 (ja) * 2003-03-06 2008-04-30 ソニー株式会社 素子転写方法
JP3952196B2 (ja) * 2003-06-25 2007-08-01 信越化学工業株式会社 フレキシブル金属箔ポリイミド積層板の製造方法
JP4397653B2 (ja) * 2003-08-26 2010-01-13 日東電工株式会社 半導体装置製造用接着シート
US7132158B2 (en) * 2003-10-22 2006-11-07 Olin Corporation Support layer for thin copper foil
JP4785340B2 (ja) * 2003-11-13 2011-10-05 三井化学株式会社 ポリイミド金属積層板
KR100674907B1 (ko) * 2003-11-26 2007-01-26 삼성전자주식회사 고신뢰성을 갖는 스택형 반도체 패키지
JP4576270B2 (ja) 2005-03-29 2010-11-04 昭和電工株式会社 ハンダ回路基板の製造方法
WO2007007865A1 (en) 2005-07-11 2007-01-18 Showa Denko K.K. Method for attachment of solder powder to electronic circuit board and solder-attached electronic circuit board
US20090041990A1 (en) * 2005-09-09 2009-02-12 Showa Denko K.K. Method for attachment of solder powder to electronic circuit board and soldered electronic circuit board
KR100728748B1 (ko) * 2005-12-14 2007-06-19 삼성전기주식회사 임베디드 인쇄회로기판 제조방법
JP5029057B2 (ja) * 2007-02-19 2012-09-19 旭硝子株式会社 燃料電池製造プロセス用キャリアフィルム
US7923373B2 (en) 2007-06-04 2011-04-12 Micron Technology, Inc. Pitch multiplication using self-assembling materials
JP5467720B2 (ja) * 2007-12-28 2014-04-09 リンテック株式会社 粘接着剤組成物、粘接着シートおよび半導体装置の製造方法
JP5792924B2 (ja) * 2009-04-30 2015-10-14 住友電気工業株式会社 接着性樹脂組成物並びにこれを用いた積層体及びフレキシブル印刷配線板
JP5384443B2 (ja) 2010-07-28 2014-01-08 日東電工株式会社 フリップチップ型半導体裏面用フィルム、ダイシングテープ一体型半導体裏面用フィルム、半導体装置の製造方法、及び、フリップチップ型半導体装置
CN104244586A (zh) * 2013-07-04 2014-12-24 漳州市福世通电子有限公司 一种卷式ic卡线路板铜箔与基材的固化方法
JP6238121B2 (ja) * 2013-10-01 2017-11-29 ローム株式会社 半導体装置
CN105739138A (zh) * 2016-04-28 2016-07-06 京东方科技集团股份有限公司 一种面板、封框胶固化方法及超薄基板加工方法
TWI800534B (zh) * 2017-09-29 2023-05-01 南韓商Ｌｇ化學股份有限公司 用於封裝有機電子元件之方法
JP6909171B2 (ja) * 2018-02-12 2021-07-28 株式会社巴川製紙所 半導体装置製造用接着シート及びそれを用いた半導体装置の製造方法
KR102607691B1 (ko) * 2018-12-17 2023-11-30 닛폰세이테츠 가부시키가이샤 스테이터용 접착 적층 코어 및 회전 전기 기계
CN116209237B (zh) * 2022-12-29 2023-10-27 东莞市富颖电子材料有限公司 一种元器件点胶贴及其制备工艺

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4868050A (en) * 1987-02-27 1989-09-19 Ube Industries, Ltd. Interleaf-containing, fiber-reinforced epoxy resin prepreg
US5365113A (en) * 1987-06-30 1994-11-15 Hitachi, Ltd. Semiconductor device
WO1993024583A1 (en) * 1992-06-04 1993-12-09 Sumitomo Bakelite Company Limited Film adhesive and production thereof
US5406124A (en) * 1992-12-04 1995-04-11 Mitsui Toatsu Chemicals, Inc. Insulating adhesive tape, and lead frame and semiconductor device employing the tape
JP2923170B2 (ja) * 1993-05-26 1999-07-26 日立電線株式会社 打抜き性に優れたフィルム及びこれを用いたリードフレーム
JPH07278258A (ja) 1994-04-11 1995-10-24 Hitachi Chem Co Ltd 熱硬化性樹脂組成物、接着剤シート、接着剤付き金属はく、ポリイミドフィルム及び金属はく張りポリイミドフィルム
JPH08174659A (ja) * 1994-12-22 1996-07-09 Kanegafuchi Chem Ind Co Ltd Ｔａｂ用テープの製造方法
JP2968704B2 (ja) * 1995-06-08 1999-11-02 日本電気株式会社 半導体装置
TW340967B (en) * 1996-02-19 1998-09-21 Toray Industries An adhesive sheet for a semiconductor to connect with a substrate, and adhesive sticking tape for tab, an adhesive sticking tape for wire bonding connection, a substrate for connecting with a semiconductor and a semiconductor device
JP3555381B2 (ja) * 1996-04-02 2004-08-18 東レ株式会社 半導体装置用接着剤付きテープおよびそれを用いた銅張り積層板、半導体接続用基板ならびに半導体装置
JPH10138318A (ja) * 1996-09-13 1998-05-26 Ube Ind Ltd 多層押出しポリイミドフィルムの製法
JPH10178054A (ja) * 1996-10-15 1998-06-30 Toray Ind Inc 半導体集積回路接続用基板およびそれを構成する部品ならびに半導体装置
US6335571B1 (en) * 1997-07-21 2002-01-01 Miguel Albert Capote Semiconductor flip-chip package and method for the fabrication thereof
JP3347651B2 (ja) * 1997-09-17 2002-11-20 株式会社巴川製紙所 電子部品用接着テープ
US6031068A (en) * 1997-10-23 2000-02-29 Kanegafuchi Kagaku Kogyo Kabushiki Kaisha Polyimide composition and base tape for TAB carrier tape and flexible printed circuit board made from said composition
JPH11233567A (ja) * 1998-02-12 1999-08-27 Toray Ind Inc 半導体装置用接着剤付きテープおよびそれを用いた銅張り積層板、半導体接続用基板ならびに半導体装置
JP3346265B2 (ja) * 1998-02-27 2002-11-18 宇部興産株式会社 芳香族ポリイミドフィルムおよびその積層体
JP3580128B2 (ja) * 1998-04-17 2004-10-20 宇部興産株式会社 金属箔積層フィルムの製法
JP3531719B2 (ja) * 1998-10-21 2004-05-31 宇部興産株式会社 ポリイミド樹脂成形体の製造法
JP3587291B2 (ja) * 1998-12-01 2004-11-10 株式会社カネカ Ｔａｂ用テープ
JP3815911B2 (ja) 1999-01-11 2006-08-30 宇部興産株式会社 フィルムキャリアテ−プ
JP3815912B2 (ja) * 1999-01-11 2006-08-30 宇部興産株式会社 Ｌｏｃ用テ−プ
JP2002050718A (ja) * 2000-08-04 2002-02-15 Hitachi Ltd 半導体装置

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TW594891B (en) 2004-06-21
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EP1249863A4 (en) 2005-03-16
EP1249863A8 (en) 2003-01-15
WO2002017379A1 (fr) 2002-02-28
US6982484B2 (en) 2006-01-03
JP4665298B2 (ja) 2011-04-06
ATE380393T1 (de) 2007-12-15
KR100602537B1 (ko) 2006-07-20
DE60131725D1 (de) 2008-01-17
EP1249863A1 (en) 2002-10-16
DE60131725T2 (de) 2008-11-06
CN1393033A (zh) 2003-01-22
JP2002076062A (ja) 2002-03-15
KR20020044569A (ko) 2002-06-15
EP1249863B1 (en) 2007-12-05

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