HK1049915A1 - Circuit board, method for manufacturing same, and high-output module. - Google Patents

Circuit board, method for manufacturing same, and high-output module.

Info

Publication number
HK1049915A1
HK1049915A1 HK03102069A HK03102069A HK1049915A1 HK 1049915 A1 HK1049915 A1 HK 1049915A1 HK 03102069 A HK03102069 A HK 03102069A HK 03102069 A HK03102069 A HK 03102069A HK 1049915 A1 HK1049915 A1 HK 1049915A1
Authority
HK
Hong Kong
Prior art keywords
circuit board
output module
manufacturing same
manufacturing
same
Prior art date
Application number
HK03102069A
Other languages
English (en)
Inventor
Nobuyoshi Tatoh
Hidenori Nakanishi
Original Assignee
Sumitomo Electric Industries
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Electric Industries filed Critical Sumitomo Electric Industries
Publication of HK1049915A1 publication Critical patent/HK1049915A1/xx

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
    • H01L23/15—Ceramic or glass substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49866—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H05K3/062—Etching masks consisting of metals or alloys or metallic inorganic compounds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304—Transistor
    • H01L2924/1305—Bipolar Junction Transistor [BJT]
    • H01L2924/13055—Insulated gate bipolar transistor [IGBT]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/167—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed resistors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/098—Special shape of the cross-section of conductors, e.g. very thick plated conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1184—Underetching, e.g. etching of substrate under conductors or etching of conductor under dielectrics; Means for allowing or controlling underetching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/388—Improvement of the adhesion between the insulating substrate and the metal by the use of a metallic or inorganic thin film adhesion layer

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Ceramic Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Metallurgy (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Semiconductor Lasers (AREA)
  • Structure Of Printed Boards (AREA)
HK03102069A 2001-07-05 2003-03-21 Circuit board, method for manufacturing same, and high-output module. HK1049915A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001204458A JP2003023224A (ja) 2001-07-05 2001-07-05 回路基板とその製造方法及び高出力モジュール

Publications (1)

Publication Number Publication Date
HK1049915A1 true HK1049915A1 (en) 2003-05-30

Family

ID=19040921

Family Applications (1)

Application Number Title Priority Date Filing Date
HK03102069A HK1049915A1 (en) 2001-07-05 2003-03-21 Circuit board, method for manufacturing same, and high-output module.

Country Status (8)

Country Link
US (1) US20030006500A1 (de)
EP (1) EP1274125A3 (de)
JP (1) JP2003023224A (de)
KR (1) KR20030005008A (de)
CN (1) CN1198333C (de)
CA (1) CA2391223A1 (de)
HK (1) HK1049915A1 (de)
TW (1) TW544773B (de)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070037333A1 (en) * 2005-08-15 2007-02-15 Texas Instruments Incorporated Work function separation for fully silicided gates
US7470577B2 (en) * 2005-08-15 2008-12-30 Texas Instruments Incorporated Dual work function CMOS devices utilizing carbide based electrodes
DE102009038674B4 (de) * 2009-08-24 2012-02-09 Epcos Ag Trägervorrichtung, Anordnung mit einer solchen Trägervorrichtung sowie Verfahren zur Herstellung eines mindestens eine keramische Schicht umfassenden struktururierten Schichtstapels
JP6030419B2 (ja) * 2012-11-22 2016-11-24 京セラ株式会社 配線基板および電子装置
TW201446087A (zh) * 2013-05-16 2014-12-01 Kinsus Interconnect Tech Corp 用於高頻信號的電路板結構
JP6210818B2 (ja) * 2013-09-30 2017-10-11 三菱電機株式会社 半導体装置およびその製造方法
CN109320255A (zh) * 2018-11-09 2019-02-12 厦门钜瓷科技有限公司 芯片用高导热陶瓷散热器的制备方法
US11342256B2 (en) 2019-01-24 2022-05-24 Applied Materials, Inc. Method of fine redistribution interconnect formation for advanced packaging applications
CN111020559B (zh) * 2019-10-18 2022-04-05 山东农业工程学院 钛合金表面耐高温自润滑涂层及其制备方法
CN111417256A (zh) * 2020-03-18 2020-07-14 浙江万正电子科技有限公司 一种埋平面电阻线路板的平面电阻膜的蚀刻工艺

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3775838A (en) * 1972-04-24 1973-12-04 Olivetti & Co Spa Integrated circuit package and construction technique
FR2201542B1 (de) * 1972-10-02 1977-09-09 Bendix Corp
US4699871A (en) * 1986-02-10 1987-10-13 General Microelectronics Corp. Methods for developing high speed chip carriers with impedance matching packaging
JPH02292893A (ja) * 1989-05-08 1990-12-04 Hitachi Ltd プリント基板の製造方法
JPH0314286A (ja) * 1989-06-13 1991-01-22 Ibiden Co Ltd プリント配線板における導体回路の形成方法
US5011580A (en) * 1989-10-24 1991-04-30 Microelectronics And Computer Technology Corporation Method of reworking an electrical multilayer interconnect
JPH04185693A (ja) * 1990-11-21 1992-07-02 Hitachi Ltd 抵抗膜のエッチング液組成物及びそれを使用したエッチング方法
JPH0575258A (ja) * 1991-09-11 1993-03-26 Fujitsu Ltd プリント配線板の製造方法
US5221639A (en) * 1991-10-20 1993-06-22 Motorola, Inc. Method of fabricating resistive conductive patterns on aluminum nitride substrates
JPH05160545A (ja) * 1991-12-06 1993-06-25 Hitachi Ltd プリント配線板の製法
JP2726804B2 (ja) * 1994-07-20 1998-03-11 エイ・ティ・アンド・ティ・コーポレーション 銅含有デバイスのエッチング方法
JPH08153949A (ja) * 1994-11-28 1996-06-11 Matsushita Electric Works Ltd セラミック配線板の製造方法
US5545927A (en) * 1995-05-12 1996-08-13 International Business Machines Corporation Capped copper electrical interconnects
US6010966A (en) * 1998-08-07 2000-01-04 Applied Materials, Inc. Hydrocarbon gases for anisotropic etching of metal-containing layers

Also Published As

Publication number Publication date
CN1396654A (zh) 2003-02-12
EP1274125A2 (de) 2003-01-08
CN1198333C (zh) 2005-04-20
KR20030005008A (ko) 2003-01-15
US20030006500A1 (en) 2003-01-09
EP1274125A3 (de) 2004-12-15
JP2003023224A (ja) 2003-01-24
CA2391223A1 (en) 2003-01-05
TW544773B (en) 2003-08-01

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Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20090705