HK1047190A1 - 化學機械拋光後半導體表面的清洗溶液 - Google Patents

化學機械拋光後半導體表面的清洗溶液

Info

Publication number
HK1047190A1
HK1047190A1 HK02108762.7A HK02108762A HK1047190A1 HK 1047190 A1 HK1047190 A1 HK 1047190A1 HK 02108762 A HK02108762 A HK 02108762A HK 1047190 A1 HK1047190 A1 HK 1047190A1
Authority
HK
Hong Kong
Prior art keywords
cleaning solution
mechanical polishing
following chemical
semiconductor surfaces
surfaces following
Prior art date
Application number
HK02108762.7A
Other languages
English (en)
Inventor
王淑敏
Original Assignee
卡伯特微電子公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 卡伯特微電子公司 filed Critical 卡伯特微電子公司
Publication of HK1047190A1 publication Critical patent/HK1047190A1/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/26—Organic compounds containing oxygen
    • C11D7/265—Carboxylic acids or salts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02057—Cleaning during device manufacture
    • H01L21/02068—Cleaning during device manufacture during, before or after processing of conductive layers, e.g. polysilicon or amorphous silicon layers
    • H01L21/02074—Cleaning during device manufacture during, before or after processing of conductive layers, e.g. polysilicon or amorphous silicon layers the processing being a planarization of conductive layers
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D1/00—Detergent compositions based essentially on surface-active compounds; Use of these compounds as a detergent
    • C11D1/38—Cationic compounds
    • C11D1/46—Esters of carboxylic acids with amino alcohols; Esters of amino carboxylic acids with alcohols
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/32—Organic compounds containing nitrogen
    • C11D7/3209—Amines or imines with one to four nitrogen atoms; Quaternized amines
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/32—Organic compounds containing nitrogen
    • C11D7/3218—Alkanolamines or alkanolimines
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/36—Organic compounds containing phosphorus
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D2111/00—Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
    • C11D2111/10—Objects to be cleaned
    • C11D2111/14—Hard surfaces
    • C11D2111/22—Electronic devices, e.g. PCBs or semiconductors

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Wood Science & Technology (AREA)
  • Organic Chemistry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Emergency Medicine (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Detergent Compositions (AREA)
HK02108762.7A 1999-09-27 2002-12-03 化學機械拋光後半導體表面的清洗溶液 HK1047190A1 (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/405,249 US6395693B1 (en) 1999-09-27 1999-09-27 Cleaning solution for semiconductor surfaces following chemical-mechanical polishing
PCT/US2000/025999 WO2001024242A1 (en) 1999-09-27 2000-09-22 Cleaning solution for semiconductor surfaces following chemical-mechanical polishing

Publications (1)

Publication Number Publication Date
HK1047190A1 true HK1047190A1 (zh) 2003-02-07

Family

ID=23602906

Family Applications (1)

Application Number Title Priority Date Filing Date
HK02108762.7A HK1047190A1 (zh) 1999-09-27 2002-12-03 化學機械拋光後半導體表面的清洗溶液

Country Status (8)

Country Link
US (2) US6395693B1 (zh)
EP (1) EP1218929A1 (zh)
JP (1) JP2003510840A (zh)
KR (1) KR20020035152A (zh)
CN (1) CN1211839C (zh)
AU (1) AU4025701A (zh)
HK (1) HK1047190A1 (zh)
WO (1) WO2001024242A1 (zh)

Families Citing this family (52)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1310989B1 (en) * 2000-06-16 2005-12-14 Kao Corporation Detergent composition
US6627546B2 (en) * 2001-06-29 2003-09-30 Ashland Inc. Process for removing contaminant from a surface and composition useful therefor
TWI339680B (en) * 2002-02-19 2011-04-01 Kanto Kagaku Washing liquid composition for semiconductor substrate
TWI231523B (en) * 2003-06-18 2005-04-21 Hon Hai Prec Ind Co Ltd Method of cleaning surface of semiconductor wafer
US20050049162A1 (en) * 2003-08-29 2005-03-03 Schlosser Ted M. Petroleum-free, ammonia-free cleaner for firearms and ordnance
TWI362415B (en) 2003-10-27 2012-04-21 Wako Pure Chem Ind Ltd Novel detergent and method for cleaning
US20050126588A1 (en) * 2003-11-04 2005-06-16 Carter Melvin K. Chemical mechanical polishing slurries and cleaners containing salicylic acid as a corrosion inhibitor
US20050247675A1 (en) * 2004-05-04 2005-11-10 Texas Instruments Incorporated Treatment of dies prior to nickel silicide formation
US7300876B2 (en) * 2004-12-14 2007-11-27 Sandisk 3D Llc Method for cleaning slurry particles from a surface polished by chemical mechanical polishing
JP5600376B2 (ja) * 2005-01-27 2014-10-01 アドバンスド テクノロジー マテリアルズ，インコーポレイテッド 半導体基材の処理のための組成物
US7923423B2 (en) * 2005-01-27 2011-04-12 Advanced Technology Materials, Inc. Compositions for processing of semiconductor substrates
US20100256034A1 (en) * 2005-09-22 2010-10-07 Pantheon Chemical, Inc. Copper chelating agent, composition including the agent, and methods of forming and using the agent and composition
US8480810B2 (en) * 2005-12-30 2013-07-09 Lam Research Corporation Method and apparatus for particle removal
TW200734448A (en) * 2006-02-03 2007-09-16 Advanced Tech Materials Low pH post-CMP residue removal composition and method of use
US20070225186A1 (en) * 2006-03-27 2007-09-27 Matthew Fisher Alkaline solutions for post CMP cleaning processes
US20070232511A1 (en) * 2006-03-28 2007-10-04 Matthew Fisher Cleaning solutions including preservative compounds for post CMP cleaning processes
KR100807024B1 (ko) * 2006-08-24 2008-02-25 동부일렉트로닉스 주식회사 반도체 세정 방법
CN101130876B (zh) * 2006-08-25 2012-02-29 安集微电子（上海）有限公司 用于半导体制程中的金属防腐蚀清洗液
CN101130877B (zh) * 2006-08-25 2011-12-07 安集微电子（上海）有限公司 用于半导体制程中的金属防腐蚀保护液
US20080076688A1 (en) * 2006-09-21 2008-03-27 Barnes Jeffrey A Copper passivating post-chemical mechanical polishing cleaning composition and method of use
US8685909B2 (en) 2006-09-21 2014-04-01 Advanced Technology Materials, Inc. Antioxidants for post-CMP cleaning formulations
SG175559A1 (en) * 2006-09-25 2011-11-28 Advanced Tech Materials Compositions and methods for the removal of photoresist for a wafer rework application
KR20100051839A (ko) * 2007-08-02 2010-05-18 어드밴스드 테크놀러지 머티리얼즈, 인코포레이티드 마이크로전자 장치로부터 잔사를 제거하기 위한 플루오라이드 비-함유 조성물
KR100906043B1 (ko) * 2007-12-04 2009-07-03 주식회사 동부하이텍 반도체 소자의 세정 방법
ES2526651T3 (es) 2008-07-03 2015-01-14 Monsanto Technology Llc Combinaciones de tensioactivos de sacáridos derivatizados y tensioactivos de óxido de eteramina como adyuvantes de herbicidas
JP5278434B2 (ja) * 2008-08-25 2013-09-04 ダイキン工業株式会社 半導体ドライプロセス後の残渣除去液及びそれを用いた残渣除去方法
JP5873718B2 (ja) 2008-10-21 2016-03-01 アドバンスド テクノロジー マテリアルズ，インコーポレイテッド 銅の洗浄及び保護配合物
CN101431021B (zh) * 2008-12-11 2010-09-08 上海合晶硅材料有限公司 一种薄型硅单晶抛光片加工方法
JP5417095B2 (ja) * 2009-09-09 2014-02-12 ライオン株式会社 洗浄剤組成物、およびガラス製ハードディスク基板の洗浄方法
US8148310B2 (en) * 2009-10-24 2012-04-03 Wai Mun Lee Composition and method for cleaning semiconductor substrates comprising an alkyl diphosphonic acid
US7947130B2 (en) * 2009-10-24 2011-05-24 Wai Mun Lee Troika acid semiconductor cleaning compositions and methods of use
US8148311B2 (en) 2009-10-24 2012-04-03 Wai Mun Lee Composition and method for cleaning semiconductor substrates comprising an alkyl diphosphonic acid
US8431516B2 (en) 2009-10-24 2013-04-30 Wai Mun Lee Composition and method for cleaning semiconductor substrates comprising an alkyl diphosphonic acid
TWI427695B (zh) * 2009-12-17 2014-02-21 羅門哈斯電子材料有限公司 紋理化半導體基板之改良方法
CN101908502B (zh) * 2010-07-21 2012-07-04 河北工业大学 极大规模集成电路钨插塞cmp后表面洁净方法
CN101901782B (zh) * 2010-07-21 2011-12-14 河北工业大学 极大规模集成电路多层布线碱性抛光后防氧化方法
CN101901783B (zh) * 2010-07-21 2012-05-30 河北工业大学 超大规模集成电路铝布线抛光后晶片表面洁净处理方法
CN102528646A (zh) * 2010-12-31 2012-07-04 中芯国际集成电路制造(上海)有限公司 一种半导体研磨方法
JP5623318B2 (ja) * 2011-03-24 2014-11-12 第一工業製薬株式会社 精密部品用洗浄剤組成物
US20130053291A1 (en) * 2011-08-22 2013-02-28 Atsushi Otake Composition for cleaning substrates post-chemical mechanical polishing
JP6066552B2 (ja) * 2011-12-06 2017-01-25 関東化學株式会社 電子デバイス用洗浄液組成物
SG10201608964TA (en) * 2012-04-27 2016-12-29 Wako Pure Chem Ind Ltd Cleaning agent for semiconductor substrates and method for processing semiconductor substrate surface
CN103882443A (zh) * 2012-12-19 2014-06-25 安集微电子（上海）有限公司 一种用于金属抛光后的清洗液及其使用方法
US9790456B2 (en) 2012-12-20 2017-10-17 Ecolab Usa Inc. Citrate salt bathroom cleaners
US9534190B2 (en) 2012-12-20 2017-01-03 Ecolab Usa Inc. Citrate salt bathroom cleaners
JP6203525B2 (ja) 2013-04-19 2017-09-27 関東化學株式会社 洗浄液組成物
EP3169765B1 (en) * 2014-07-18 2020-08-19 Cabot Microelectronics Corporation Cleaning composition following cmp and methods related thereto
CN104388956A (zh) * 2014-10-14 2015-03-04 东莞市四辉表面处理科技有限公司 一种平面研磨清洗剂
US9828574B2 (en) 2015-01-13 2017-11-28 Cabot Microelectronics Corporation Cleaning composition and method for cleaning semiconductor wafers after CMP
EP3502322B1 (en) * 2017-05-26 2024-01-24 Sumitomo Electric Industries, Ltd. Gaas substrate and production method therefor
WO2021026410A1 (en) 2019-08-07 2021-02-11 Ecolab Usa Inc. Polymeric and solid-supported chelators for stabilization of peracid-containing compositions
CN114761628B (zh) * 2019-12-02 2024-04-12 住友电气工业株式会社 碳化硅衬底和碳化硅衬底的制造方法

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3072502A (en) 1961-02-14 1963-01-08 Pfizer & Co C Process for removing copper-containing iron oxide scale from metal surfaces
NL149551B (nl) 1964-08-04 1976-05-17 Dow Chemical Co Werkwijze voor het reinigen en passiveren van ijzerhoudende metaaloppervlakken, waarop metallisch koper is afgezet.
SE400575B (sv) 1974-12-13 1978-04-03 Nordnero Ab Bad for betning av koppar och dess legeringar
US4174290A (en) 1976-12-16 1979-11-13 Custom Research And Development Metal oxide remover containing a strong mineral acid, citric acid and a basic ammonia derivative
US4250048A (en) 1979-07-03 1981-02-10 Custom Research And Development Metal oxide remover containing a strong mineral acid, chelating agent and a basic ammonia derivative
ATE33267T1 (de) * 1981-09-25 1988-04-15 Procter & Gamble Aminosilanen enthaltende koernige reinigungsmittelgemische.
SU1210053A1 (ru) 1984-07-05 1986-02-07 Московский Ордена Ленина И Ордена Октябрьской Революции Энергетический Институт Композици дл очистки теплообменной поверхности от отложений
ATE49608T1 (de) * 1985-05-04 1990-02-15 Henkel Kgaa Geruestsalzfreie fluessigwaschmittel mit textilweichmachenden eigenschaften.
US5192460A (en) 1988-02-10 1993-03-09 Colgate-Palmolive Company Safe acidic hard surface cleaner
US5981454A (en) * 1993-06-21 1999-11-09 Ekc Technology, Inc. Post clean treatment composition comprising an organic acid and hydroxylamine
US6121217A (en) 1990-11-05 2000-09-19 Ekc Technology, Inc. Alkanolamine semiconductor process residue removal composition and process
EP0496605B1 (en) * 1991-01-24 2001-08-01 Wako Pure Chemical Industries Ltd Surface treating solutions for semiconductors
US5451335A (en) 1991-05-16 1995-09-19 H.E.R.C. Products Incorporated 1:1 soap compositions of acids and amines or ammonia useful in removal and prevention of scale
US5322635A (en) 1991-05-16 1994-06-21 H.E.R.C. Incorporated Soap compositions of carboxylic acids and amines useful in removal and prevention of scale
TW263531B (zh) * 1992-03-11 1995-11-21 Mitsubishi Gas Chemical Co
EP0583536B1 (en) * 1992-08-14 1997-03-05 The Procter & Gamble Company Liquid detergents containing an alpha-amino boronic acid
DE4338626A1 (de) 1993-11-12 1995-05-18 Henkel Kgaa Additiv für die Glasflaschenreinigung und seine Verwendung zur Verringerung der Glaskorrosion
US5645737A (en) 1996-02-21 1997-07-08 Micron Technology, Inc. Wet clean for a surface having an exposed silicon/silica interface
TW416987B (en) 1996-06-05 2001-01-01 Wako Pure Chem Ind Ltd A composition for cleaning the semiconductor substrate surface
US5935869A (en) * 1997-07-10 1999-08-10 International Business Machines Corporation Method of planarizing semiconductor wafers

Also Published As

Publication number Publication date
US6395693B1 (en) 2002-05-28
CN1376307A (zh) 2002-10-23
US20020169088A1 (en) 2002-11-14
CN1211839C (zh) 2005-07-20
EP1218929A1 (en) 2002-07-03
WO2001024242A1 (en) 2001-04-05
KR20020035152A (ko) 2002-05-09
AU4025701A (en) 2001-04-30
US6541434B2 (en) 2003-04-01
JP2003510840A (ja) 2003-03-18

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