HK1047190A1 - 化學機械拋光後半導體表面的清洗溶液 - Google Patents

化學機械拋光後半導體表面的清洗溶液

Info

Publication number
HK1047190A1
HK1047190A1 HK02108762.7A HK02108762A HK1047190A1 HK 1047190 A1 HK1047190 A1 HK 1047190A1 HK 02108762 A HK02108762 A HK 02108762A HK 1047190 A1 HK1047190 A1 HK 1047190A1
Authority
HK
Hong Kong
Prior art keywords
cleaning solution
mechanical polishing
following chemical
semiconductor surfaces
surfaces following
Prior art date
Application number
HK02108762.7A
Other languages
English (en)
Inventor
王淑敏
Original Assignee
卡伯特微電子公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 卡伯特微電子公司 filed Critical 卡伯特微電子公司
Publication of HK1047190A1 publication Critical patent/HK1047190A1/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/26—Organic compounds containing oxygen
    • C11D7/265—Carboxylic acids or salts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02057—Cleaning during device manufacture
    • H01L21/02068—Cleaning during device manufacture during, before or after processing of conductive layers, e.g. polysilicon or amorphous silicon layers
    • H01L21/02074—Cleaning during device manufacture during, before or after processing of conductive layers, e.g. polysilicon or amorphous silicon layers the processing being a planarization of conductive layers
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D1/00—Detergent compositions based essentially on surface-active compounds; Use of these compounds as a detergent
    • C11D1/38—Cationic compounds
    • C11D1/46—Esters of carboxylic acids with amino alcohols; Esters of amino carboxylic acids with alcohols
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/32—Organic compounds containing nitrogen
    • C11D7/3209—Amines or imines with one to four nitrogen atoms; Quaternized amines
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/32—Organic compounds containing nitrogen
    • C11D7/3218—Alkanolamines or alkanolimines
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/36—Organic compounds containing phosphorus
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D2111/00—Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
    • C11D2111/10—Objects to be cleaned
    • C11D2111/14—Hard surfaces
    • C11D2111/22—Electronic devices, e.g. PCBs or semiconductors

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Wood Science & Technology (AREA)
  • Organic Chemistry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Emergency Medicine (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Detergent Compositions (AREA)
HK02108762.7A 1999-09-27 2002-12-03 化學機械拋光後半導體表面的清洗溶液 HK1047190A1 (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/405,249 US6395693B1 (en) 1999-09-27 1999-09-27 Cleaning solution for semiconductor surfaces following chemical-mechanical polishing
PCT/US2000/025999 WO2001024242A1 (en) 1999-09-27 2000-09-22 Cleaning solution for semiconductor surfaces following chemical-mechanical polishing

Publications (1)

Publication Number Publication Date
HK1047190A1 true HK1047190A1 (zh) 2003-02-07

Family

ID=23602906

Family Applications (1)

Application Number Title Priority Date Filing Date
HK02108762.7A HK1047190A1 (zh) 1999-09-27 2002-12-03 化學機械拋光後半導體表面的清洗溶液

Country Status (8)

Country Link
US (2) US6395693B1 (zh)
EP (1) EP1218929A1 (zh)
JP (1) JP2003510840A (zh)
KR (1) KR20020035152A (zh)
CN (1) CN1211839C (zh)
AU (1) AU4025701A (zh)
HK (1) HK1047190A1 (zh)
WO (1) WO2001024242A1 (zh)

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JP5417095B2 (ja) * 2009-09-09 2014-02-12 ライオン株式会社 洗浄剤組成物、およびガラス製ハードディスク基板の洗浄方法
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Also Published As

Publication number Publication date
AU4025701A (en) 2001-04-30
CN1211839C (zh) 2005-07-20
WO2001024242A1 (en) 2001-04-05
US20020169088A1 (en) 2002-11-14
US6541434B2 (en) 2003-04-01
KR20020035152A (ko) 2002-05-09
US6395693B1 (en) 2002-05-28
JP2003510840A (ja) 2003-03-18
EP1218929A1 (en) 2002-07-03
CN1376307A (zh) 2002-10-23

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