HK1042626A1 - 放電燈的電子鎮流器 - Google Patents

放電燈的電子鎮流器

Info

Publication number
HK1042626A1
HK1042626A1 HK02104315.8A HK02104315A HK1042626A1 HK 1042626 A1 HK1042626 A1 HK 1042626A1 HK 02104315 A HK02104315 A HK 02104315A HK 1042626 A1 HK1042626 A1 HK 1042626A1
Authority
HK
Hong Kong
Prior art keywords
discharge lamp
electronic ballast
ballast
electronic
lamp
Prior art date
Application number
HK02104315.8A
Other languages
English (en)
Inventor
山中幸男
三木伸和
河野忠博
西田聡彥
角佳和
Original Assignee
松下電工株式會社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 松下電工株式會社 filed Critical 松下電工株式會社
Publication of HK1042626A1 publication Critical patent/HK1042626A1/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B41/00—Circuit arrangements or apparatus for igniting or operating discharge lamps
    • H05B41/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B41/00—Circuit arrangements or apparatus for igniting or operating discharge lamps
    • H05B41/14—Circuit arrangements
    • H05B41/26—Circuit arrangements in which the lamp is fed by power derived from dc by means of a converter, e.g. by high-voltage dc
    • H05B41/28—Circuit arrangements in which the lamp is fed by power derived from dc by means of a converter, e.g. by high-voltage dc using static converters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B41/00—Circuit arrangements or apparatus for igniting or operating discharge lamps
    • H05B41/14—Circuit arrangements
    • H05B41/26—Circuit arrangements in which the lamp is fed by power derived from dc by means of a converter, e.g. by high-voltage dc
    • H05B41/28—Circuit arrangements in which the lamp is fed by power derived from dc by means of a converter, e.g. by high-voltage dc using static converters
    • H05B41/282—Circuit arrangements in which the lamp is fed by power derived from dc by means of a converter, e.g. by high-voltage dc using static converters with semiconductor devices
    • H05B41/2825—Circuit arrangements in which the lamp is fed by power derived from dc by means of a converter, e.g. by high-voltage dc using static converters with semiconductor devices by means of a bridge converter in the final stage
    • H05B41/2827—Circuit arrangements in which the lamp is fed by power derived from dc by means of a converter, e.g. by high-voltage dc using static converters with semiconductor devices by means of a bridge converter in the final stage using specially adapted components in the load circuit, e.g. feed-back transformers, piezoelectric transformers; using specially adapted load circuit configurations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B41/00—Circuit arrangements or apparatus for igniting or operating discharge lamps
    • H05B41/14—Circuit arrangements
    • H05B41/26—Circuit arrangements in which the lamp is fed by power derived from dc by means of a converter, e.g. by high-voltage dc
    • H05B41/28—Circuit arrangements in which the lamp is fed by power derived from dc by means of a converter, e.g. by high-voltage dc using static converters
    • H05B41/295—Circuit arrangements in which the lamp is fed by power derived from dc by means of a converter, e.g. by high-voltage dc using static converters with semiconductor devices and specially adapted for lamps with preheating electrodes, e.g. for fluorescent lamps
    • H05B41/298—Arrangements for protecting lamps or circuits against abnormal operating conditions
    • H05B41/2981—Arrangements for protecting lamps or circuits against abnormal operating conditions for protecting the circuit against abnormal operating conditions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B41/00—Circuit arrangements or apparatus for igniting or operating discharge lamps
    • H05B41/14—Circuit arrangements
    • H05B41/26—Circuit arrangements in which the lamp is fed by power derived from dc by means of a converter, e.g. by high-voltage dc
    • H05B41/28—Circuit arrangements in which the lamp is fed by power derived from dc by means of a converter, e.g. by high-voltage dc using static converters
    • H05B41/295—Circuit arrangements in which the lamp is fed by power derived from dc by means of a converter, e.g. by high-voltage dc using static converters with semiconductor devices and specially adapted for lamps with preheating electrodes, e.g. for fluorescent lamps
    • H05B41/298—Arrangements for protecting lamps or circuits against abnormal operating conditions
    • H05B41/2981—Arrangements for protecting lamps or circuits against abnormal operating conditions for protecting the circuit against abnormal operating conditions
    • H05B41/2985—Arrangements for protecting lamps or circuits against abnormal operating conditions for protecting the circuit against abnormal operating conditions against abnormal lamp operating conditions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10015—Non-printed capacitor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10022—Non-printed resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/1003—Non-printed inductor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10507—Involving several components
    • H05K2201/10545—Related components mounted on both sides of the PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3415—Surface mounted components on both sides of the substrate or combined with lead-in-hole components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Circuit Arrangements For Discharge Lamps (AREA)
  • Inverter Devices (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
HK02104315.8A 2000-06-12 2002-06-07 放電燈的電子鎮流器 HK1042626A1 (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000175841A JP3975653B2 (ja) 2000-06-12 2000-06-12 放電灯点灯装置

Publications (1)

Publication Number Publication Date
HK1042626A1 true HK1042626A1 (zh) 2002-08-16

Family

ID=18677651

Family Applications (1)

Application Number Title Priority Date Filing Date
HK02104315.8A HK1042626A1 (zh) 2000-06-12 2002-06-07 放電燈的電子鎮流器

Country Status (11)

Country Link
US (1) US6943502B2 (zh)
EP (1) EP1293110B1 (zh)
JP (1) JP3975653B2 (zh)
CN (1) CN100379320C (zh)
AU (2) AU2001244739B2 (zh)
DE (1) DE60119927T2 (zh)
HK (1) HK1042626A1 (zh)
ID (1) ID30467A (zh)
SG (1) SG96563A1 (zh)
TW (1) TW525412B (zh)
WO (1) WO2001097572A1 (zh)

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WO2004030420A1 (en) * 2002-09-25 2004-04-08 Matsushita Electric Works, Ltd. Electronic ballast for a discharge lamp
JP3866213B2 (ja) * 2003-03-31 2007-01-10 富士通株式会社 電源モジュール及びこれを使用した電子装置
JP2005063821A (ja) * 2003-08-13 2005-03-10 Koito Mfg Co Ltd 放電灯点灯回路及び放電灯点灯方法
JP2005063819A (ja) * 2003-08-13 2005-03-10 Koito Mfg Co Ltd 放電灯点灯回路
JP2005063823A (ja) * 2003-08-13 2005-03-10 Koito Mfg Co Ltd 放電灯点灯回路
JP4360899B2 (ja) 2003-12-22 2009-11-11 パナソニック電工株式会社 放電灯点灯装置及び照明器具
JP4293004B2 (ja) * 2004-02-04 2009-07-08 株式会社デンソー 放電灯点灯装置
JP2005353403A (ja) * 2004-06-10 2005-12-22 Asahi Matsushita Electric Works Ltd 照明器具
JP2006324216A (ja) * 2005-05-20 2006-11-30 Matsushita Electric Ind Co Ltd 電球形放電ランプ
US7379291B2 (en) * 2005-09-29 2008-05-27 Energy Conservation Technologies, Inc. Enclosed electronic ballast housing
US7492044B2 (en) * 2005-10-06 2009-02-17 Lenovo (Singapore) Pte. Ltd. System and method for decreasing stress on solder holding BGA module to computer motherboard
DE102005049583A1 (de) * 2005-10-17 2007-04-19 Patent-Treuhand-Gesellschaft für elektrische Glühlampen mbH Elektronisches Vorschaltgerät und Verfahren zum Betreiben einer elektrischen Lampe
JP3981698B1 (ja) * 2006-12-18 2007-09-26 株式会社モモ・アライアンス 照明装置
FR2912279B1 (fr) * 2007-02-07 2010-08-13 Valeo Vision Carte electronique notamment de ballast electronique pour lampe a decharge
JP2009032471A (ja) * 2007-07-26 2009-02-12 Panasonic Electric Works Co Ltd 放電灯点灯装置及び照明器具
JP4800283B2 (ja) * 2007-10-04 2011-10-26 池田電機株式会社 配線ブロックの収納構造
US20090256481A1 (en) * 2008-04-11 2009-10-15 Osram Sylvania Inc. Stand alone lamp filament preheat circuit for ballast
JP2010073159A (ja) * 2008-09-22 2010-04-02 Fujitsu Ltd 電子機器
CN102362561B (zh) * 2009-03-30 2015-08-19 赤多尼科两合股份有限公司 具有集成散热板的驱动装置
US7956548B2 (en) * 2009-04-08 2011-06-07 Kanghong Zhang Electronic ballast protection
CN102036457B (zh) * 2010-09-29 2013-07-24 北京工业大学 基于电子镇流器的可编程vco电路
JP5728965B2 (ja) * 2011-01-20 2015-06-03 株式会社明電舎 導体およびインバータ装置
CN103175160A (zh) * 2011-12-20 2013-06-26 西安智海电力科技有限公司 功率空置快装型led电源
CN103175046A (zh) * 2011-12-20 2013-06-26 西安智海电力科技有限公司 一种带安装板的匀光散热led吊灯
CN104080259A (zh) * 2013-03-27 2014-10-01 台达电子工业股份有限公司 薄型化电子安定器及其制造方法
TW201438522A (zh) * 2013-03-27 2014-10-01 Delta Electronics Inc 薄型化電子安定器及其製造方法
CN106688170B (zh) * 2014-09-11 2020-03-13 飞利浦照明控股有限公司 用于照明装置电源中的高频隔离变压器的电荷泵效应补偿
NO341008B1 (no) * 2014-09-17 2017-08-07 Chao Wen Hsin LED-driverstruktur
JP2016091738A (ja) * 2014-10-31 2016-05-23 パナソニックＩｐマネジメント株式会社 回路ユニット、及び、照明器具
KR102327339B1 (ko) 2015-05-06 2021-11-16 삼성전자주식회사 집적 회로와 이를 포함하는 컴퓨팅 장치
TWI550391B (zh) * 2015-10-23 2016-09-21 台達電子工業股份有限公司 整合功率模組封裝結構
JP6384689B2 (ja) * 2017-05-11 2018-09-05 東芝ライテック株式会社 照明装置
JP6885280B2 (ja) * 2017-09-25 2021-06-09 東芝ライテック株式会社 電源装置及び照明器具
JP2020013834A (ja) * 2018-07-13 2020-01-23 株式会社デンソー コンデンサ装置
KR102257471B1 (ko) * 2020-08-31 2021-05-31 주식회사 에스피파워 평판형 엣지 조명등용 조립식 컨버터

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Also Published As

Publication number Publication date
TW525412B (en) 2003-03-21
WO2001097572A1 (en) 2001-12-20
US20040222752A1 (en) 2004-11-11
DE60119927T2 (de) 2007-01-11
AU4473901A (en) 2001-12-24
EP1293110A1 (en) 2003-03-19
US6943502B2 (en) 2005-09-13
DE60119927D1 (de) 2006-06-29
SG96563A1 (en) 2003-06-16
JP3975653B2 (ja) 2007-09-12
ID30467A (id) 2001-12-13
EP1293110B1 (en) 2006-05-24
AU2001244739B2 (en) 2004-05-27
CN1328413A (zh) 2001-12-26
JP2001357986A (ja) 2001-12-26
CN100379320C (zh) 2008-04-02

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