HK1040214A1 - 半導體基版之表面處理 - Google Patents

半導體基版之表面處理

Info

Publication number
HK1040214A1
HK1040214A1 HK02100719.8A HK02100719A HK1040214A1 HK 1040214 A1 HK1040214 A1 HK 1040214A1 HK 02100719 A HK02100719 A HK 02100719A HK 1040214 A1 HK1040214 A1 HK 1040214A1
Authority
HK
Hong Kong
Prior art keywords
surface treatment
semiconductor substrates
substrates
semiconductor
treatment
Prior art date
Application number
HK02100719.8A
Other languages
English (en)
Inventor
A Kittle Paul
Original Assignee
A Kittle Paul
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by A Kittle Paul filed Critical A Kittle Paul
Publication of HK1040214A1 publication Critical patent/HK1040214A1/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S134/00—Cleaning and liquid contact with solids
    • Y10S134/902—Semiconductor wafer

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
HK02100719.8A 1998-12-09 2002-01-30 半導體基版之表面處理 HK1040214A1 (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/208,112 US6090217A (en) 1998-12-09 1998-12-09 Surface treatment of semiconductor substrates
PCT/US1999/028610 WO2000033980A1 (en) 1998-12-09 1999-12-03 Surface treatment of semiconductor substrates

Publications (1)

Publication Number Publication Date
HK1040214A1 true HK1040214A1 (zh) 2002-05-31

Family

ID=22773225

Family Applications (1)

Application Number Title Priority Date Filing Date
HK02100719.8A HK1040214A1 (zh) 1998-12-09 2002-01-30 半導體基版之表面處理

Country Status (5)

Country Link
US (4) US6090217A (zh)
EP (1) EP1173293A1 (zh)
HK (1) HK1040214A1 (zh)
TW (1) TW429171B (zh)
WO (1) WO2000033980A1 (zh)

Families Citing this family (64)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6090217A (en) 1998-12-09 2000-07-18 Kittle; Paul A. Surface treatment of semiconductor substrates
US6602349B2 (en) 1999-08-05 2003-08-05 S.C. Fluids, Inc. Supercritical fluid cleaning process for precision surfaces
DE10050636A1 (de) * 1999-10-13 2001-04-19 Decker Gmbh & Co Kg Geb Verfahren und Vorrichtung zur Oberflächen-Behandlung von Gegenständen
US6286231B1 (en) * 2000-01-12 2001-09-11 Semitool, Inc. Method and apparatus for high-pressure wafer processing and drying
WO2001087505A1 (en) * 2000-05-18 2001-11-22 S. C. Fluids, Inc. Supercritical fluid cleaning process for precision surfaces
US6613695B2 (en) * 2000-11-24 2003-09-02 Asm America, Inc. Surface preparation prior to deposition
US6519869B2 (en) * 2001-05-15 2003-02-18 United Microelectronics, Corp. Method and apparatus for drying semiconductor wafers
US6398875B1 (en) * 2001-06-27 2002-06-04 International Business Machines Corporation Process of drying semiconductor wafers using liquid or supercritical carbon dioxide
US8051861B2 (en) 2001-07-30 2011-11-08 Tennant Company Cleaning system utilizing purified water
US6671925B2 (en) * 2001-07-30 2004-01-06 Tennant Company Chemical dispenser for a hard floor surface cleaner
US6735811B2 (en) 2001-07-30 2004-05-18 Tennant Company Cleaning liquid dispensing system for a hard floor surface cleaner
US6662600B1 (en) * 2002-08-07 2003-12-16 Tennant Company Foamed cleaning liquid dispensing system
US6585827B2 (en) 2001-07-30 2003-07-01 Tennant Company Apparatus and method of use for cleaning a hard floor surface utilizing an aerated cleaning liquid
US20050217062A1 (en) * 2001-07-30 2005-10-06 Tennant Company Air purging of a liquid dispensing system of a surface cleaner
US6960537B2 (en) * 2001-10-02 2005-11-01 Asm America, Inc. Incorporation of nitrogen into high k dielectric film
US20030171239A1 (en) * 2002-01-28 2003-09-11 Patel Bakul P. Methods and compositions for chemically treating a substrate using foam technology
WO2003064581A1 (en) * 2002-01-28 2003-08-07 Ekc Technology, Inc. Methods and compositions for chemically treating a substrate using foam technology
JP3949504B2 (ja) * 2002-04-25 2007-07-25 英夫 吉田 母材表面の活性化処理方法および活性化処理装置
US6875286B2 (en) * 2002-12-16 2005-04-05 International Business Machines Corporation Solid CO2 cleaning
DE10260175B3 (de) * 2002-12-20 2004-04-08 Kempf, Klaus, Dr. Verschraubungswerkzeug
US6703317B1 (en) * 2003-01-30 2004-03-09 Taiwan Semiconductor Manufacturing Co., Ltd Method to neutralize charge imbalance following a wafer cleaning process
US7799141B2 (en) * 2003-06-27 2010-09-21 Lam Research Corporation Method and system for using a two-phases substrate cleaning compound
US8522801B2 (en) * 2003-06-27 2013-09-03 Lam Research Corporation Method and apparatus for cleaning a semiconductor substrate
US7913703B1 (en) 2003-06-27 2011-03-29 Lam Research Corporation Method and apparatus for uniformly applying a multi-phase cleaning solution to a substrate
US8316866B2 (en) 2003-06-27 2012-11-27 Lam Research Corporation Method and apparatus for cleaning a semiconductor substrate
US20040261823A1 (en) * 2003-06-27 2004-12-30 Lam Research Corporation Method and apparatus for removing a target layer from a substrate using reactive gases
US7648584B2 (en) * 2003-06-27 2010-01-19 Lam Research Corporation Method and apparatus for removing contamination from substrate
US7737097B2 (en) * 2003-06-27 2010-06-15 Lam Research Corporation Method for removing contamination from a substrate and for making a cleaning solution
US8028365B2 (en) 2003-09-02 2011-10-04 Tennant Company Hard and soft floor cleaning tool and machine
US7416370B2 (en) * 2005-06-15 2008-08-26 Lam Research Corporation Method and apparatus for transporting a substrate using non-Newtonian fluid
US8323420B2 (en) * 2005-06-30 2012-12-04 Lam Research Corporation Method for removing material from semiconductor wafer and apparatus for performing the same
TWI254988B (en) * 2003-12-23 2006-05-11 Lam Res Corp Apparatuses and methods for cleaning a substrate
US8522799B2 (en) * 2005-12-30 2013-09-03 Lam Research Corporation Apparatus and system for cleaning a substrate
US8043441B2 (en) * 2005-06-15 2011-10-25 Lam Research Corporation Method and apparatus for cleaning a substrate using non-Newtonian fluids
US7568490B2 (en) 2003-12-23 2009-08-04 Lam Research Corporation Method and apparatus for cleaning semiconductor wafers using compressed and/or pressurized foams, bubbles, and/or liquids
US7862662B2 (en) * 2005-12-30 2011-01-04 Lam Research Corporation Method and material for cleaning a substrate
JP2006173378A (ja) * 2004-12-16 2006-06-29 Dainippon Screen Mfg Co Ltd 基板処理装置及び基板処理方法
WO2006121783A1 (en) 2005-05-05 2006-11-16 Tennant Company Floor sweeping and scrubbing machine
US8584294B2 (en) 2005-10-21 2013-11-19 Tennant Company Floor cleaner scrub head having a movable disc scrub member
SG154438A1 (en) * 2005-12-30 2009-08-28 Lam Res Corp Cleaning compound and method and system for using the cleaning compound
US8480810B2 (en) * 2005-12-30 2013-07-09 Lam Research Corporation Method and apparatus for particle removal
US20080148595A1 (en) * 2006-12-20 2008-06-26 Lam Research Corporation Method and apparatus for drying substrates using a surface tensions reducing gas
US7897213B2 (en) * 2007-02-08 2011-03-01 Lam Research Corporation Methods for contained chemical surface treatment
US8388762B2 (en) * 2007-05-02 2013-03-05 Lam Research Corporation Substrate cleaning technique employing multi-phase solution
US8084406B2 (en) 2007-12-14 2011-12-27 Lam Research Corporation Apparatus for particle removal by single-phase and two-phase media
US20090217950A1 (en) * 2008-03-03 2009-09-03 Multimetrixs, Llc Method and apparatus for foam-assisted wafer cleaning
US20090241998A1 (en) * 2008-03-26 2009-10-01 Multimetrixs, Llc Apparatus for foam-assisted wafer cleaning with use of universal fluid supply unit
US8557702B2 (en) 2009-02-02 2013-10-15 Asm America, Inc. Plasma-enhanced atomic layers deposition of conductive material over dielectric layers
US8845812B2 (en) * 2009-06-12 2014-09-30 Micron Technology, Inc. Method for contamination removal using magnetic particles
DE102009053574A1 (de) * 2009-11-06 2011-05-12 Gebr. Schmid Gmbh & Co. Verfahren und Anlage zur Fertigung von Leiterplatten und Halbleiterprodukten
US9508211B2 (en) 2010-07-01 2016-11-29 The Coca-Cola Company Merchandiser
US9576419B2 (en) 2010-07-01 2017-02-21 The Coca-Cola Company Merchandiser
JP2012151398A (ja) * 2011-01-21 2012-08-09 Toshiba Corp 超臨界乾燥装置及び方法
JP6090837B2 (ja) * 2012-06-13 2017-03-08 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
JP6232212B2 (ja) * 2012-08-09 2017-11-15 芝浦メカトロニクス株式会社 洗浄液生成装置及び基板洗浄装置
TWI689004B (zh) 2012-11-26 2020-03-21 美商應用材料股份有限公司 用於高深寬比半導體元件結構具有污染物去除之無黏附乾燥處理
US9744642B2 (en) * 2013-10-29 2017-08-29 Taiwan Semiconductor Manufacturing Co., Ltd. Slurry feed system and method of providing slurry to chemical mechanical planarization station
WO2016007874A1 (en) 2014-07-11 2016-01-14 Applied Materials, Inc. Supercritical carbon dioxide process for low-k thin films
CN106033711A (zh) * 2015-03-18 2016-10-19 联华电子股份有限公司 基底的清洁方法
US9687885B2 (en) * 2015-07-17 2017-06-27 Taiwan Semiconductor Manufacturing Co., Ltd. Multi-cycle wafer cleaning method
WO2017062135A1 (en) 2015-10-04 2017-04-13 Applied Materials, Inc. Drying process for high aspect ratio features
JP6556945B2 (ja) 2015-10-04 2019-08-07 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 基板支持とバッフルの装置
CN108140549B (zh) 2015-10-04 2022-12-20 应用材料公司 缩减空间的处理腔室
KR102314667B1 (ko) 2015-10-04 2021-10-20 어플라이드 머티어리얼스, 인코포레이티드 작은 열 질량의 가압 챔버

Family Cites Families (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL251243A (zh) * 1959-05-04
US3212762A (en) * 1960-05-23 1965-10-19 Dow Chemical Co Foam generator
US3436262A (en) * 1964-09-25 1969-04-01 Dow Chemical Co Cleaning by foam contact,and foam regeneration method
US4133773A (en) * 1977-07-28 1979-01-09 The Dow Chemical Company Apparatus for making foamed cleaning solutions and method of operation
US4238244A (en) * 1978-10-10 1980-12-09 Halliburton Company Method of removing deposits from surfaces with a gas agitated cleaning liquid
US4417601A (en) 1980-12-19 1983-11-29 National Foam Systems, Inc. Variable proportioning valve for balanced pressure proportioning systems, and system containing the valve
US4911761A (en) 1984-05-21 1990-03-27 Cfm Technologies Research Associates Process and apparatus for drying surfaces
NL8601939A (nl) 1986-07-28 1988-02-16 Philips Nv Werkwijze voor het verwijderen van ongewenste deeltjes van een oppervlak van een substraat.
US4962776A (en) * 1987-03-26 1990-10-16 Regents Of The University Of Minnesota Process for surface and fluid cleaning
US4817652A (en) * 1987-03-26 1989-04-04 Regents Of The University Of Minnesota System for surface and fluid cleaning
US4849027A (en) * 1987-04-16 1989-07-18 Simmons Bobby G Method for recycling foamed solvents
US5000795A (en) 1989-06-16 1991-03-19 At&T Bell Laboratories Semiconductor wafer cleaning method and apparatus
JPH0330329A (ja) 1989-06-27 1991-02-08 Mitsubishi Electric Corp 半導体ウェハ洗浄装置
JPH0394428A (ja) 1989-09-06 1991-04-19 Mitsubishi Electric Corp 半導体ウエハの洗浄方法
US5271774A (en) 1990-03-01 1993-12-21 U.S. Philips Corporation Method for removing in a centrifuge a liquid from a surface of a substrate
JPH04171724A (ja) 1990-11-05 1992-06-18 Hitachi Ltd 半導体基板の洗浄方法及び装置
US5306350A (en) * 1990-12-21 1994-04-26 Union Carbide Chemicals & Plastics Technology Corporation Methods for cleaning apparatus using compressed fluids
US5261966A (en) 1991-01-28 1993-11-16 Kabushiki Kaisha Toshiba Method of cleaning semiconductor wafers using mixer containing a bundle of gas permeable hollow yarns
US5911837A (en) * 1993-07-16 1999-06-15 Legacy Systems, Inc. Process for treatment of semiconductor wafers in a fluid
US5950645A (en) * 1993-10-20 1999-09-14 Verteq, Inc. Semiconductor wafer cleaning system
US5656097A (en) * 1993-10-20 1997-08-12 Verteq, Inc. Semiconductor wafer cleaning system
US5417768A (en) * 1993-12-14 1995-05-23 Autoclave Engineers, Inc. Method of cleaning workpiece with solvent and then with liquid carbon dioxide
DE69523208T2 (de) * 1994-04-08 2002-06-27 Texas Instruments Inc Verfahren zur Reinigung von Halbleiterscheiben mittels verflüssigter Gase
US5571337A (en) 1994-11-14 1996-11-05 Yieldup International Method for cleaning and drying a semiconductor wafer
JP3504023B2 (ja) 1995-05-26 2004-03-08 株式会社ルネサステクノロジ 洗浄装置および洗浄方法
US5964958A (en) 1995-06-07 1999-10-12 Gary W. Ferrell Methods for drying and cleaning objects using aerosols
US5968202A (en) * 1995-07-13 1999-10-19 The Procter & Gamble Company Method of cleaning textile fabrics
JPH1126423A (ja) 1997-07-09 1999-01-29 Sugai:Kk 半導体ウエハ等の処理方法並びにその処理装置
US5904156A (en) 1997-09-24 1999-05-18 International Business Machines Corporation Dry film resist removal in the presence of electroplated C4's
US6090217A (en) 1998-12-09 2000-07-18 Kittle; Paul A. Surface treatment of semiconductor substrates
US6576066B1 (en) * 1999-12-06 2003-06-10 Nippon Telegraph And Telephone Corporation Supercritical drying method and supercritical drying apparatus
US6286231B1 (en) * 2000-01-12 2001-09-11 Semitool, Inc. Method and apparatus for high-pressure wafer processing and drying

Also Published As

Publication number Publication date
US20020195121A1 (en) 2002-12-26
US6296715B1 (en) 2001-10-02
TW429171B (en) 2001-04-11
US20020029794A1 (en) 2002-03-14
US6439247B1 (en) 2002-08-27
EP1173293A1 (en) 2002-01-23
US6090217A (en) 2000-07-18
US6797071B2 (en) 2004-09-28
WO2000033980A1 (en) 2000-06-15

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