HK1038837A1 - Surface acoustic wave device - Google Patents

Surface acoustic wave device

Info

Publication number
HK1038837A1
HK1038837A1 HK01109169A HK01109169A HK1038837A1 HK 1038837 A1 HK1038837 A1 HK 1038837A1 HK 01109169 A HK01109169 A HK 01109169A HK 01109169 A HK01109169 A HK 01109169A HK 1038837 A1 HK1038837 A1 HK 1038837A1
Authority
HK
Hong Kong
Prior art keywords
acoustic wave
surface acoustic
wave device
wave
acoustic
Prior art date
Application number
HK01109169A
Other languages
English (en)
Inventor
Noritoshi Kimura
Masahiro Nakano
Katsuo Sato
Original Assignee
Tdk Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tdk Corp filed Critical Tdk Corp
Publication of HK1038837A1 publication Critical patent/HK1038837A1/xx

Links

Classifications

    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
    • H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
    • H03H3/08—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of resonators or networks using surface acoustic waves
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02535—Details of surface acoustic wave devices
    • H03H9/02543—Characteristics of substrate, e.g. cutting angles
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02535—Details of surface acoustic wave devices
    • H03H9/02543—Characteristics of substrate, e.g. cutting angles
    • H03H9/02559—Characteristics of substrate, e.g. cutting angles of lithium niobate or lithium-tantalate substrates
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/125—Driving means, e.g. electrodes, coils
    • H03H9/145—Driving means, e.g. electrodes, coils for networks using surface acoustic waves

Landscapes

  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
HK01109169A 1999-05-31 2001-12-28 Surface acoustic wave device HK1038837A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP15279599 1999-05-31
PCT/JP1999/005608 WO2000074235A1 (fr) 1999-05-31 1999-10-12 Dispositif a ondes acoustiques de surface

Publications (1)

Publication Number Publication Date
HK1038837A1 true HK1038837A1 (en) 2002-03-28

Family

ID=15548324

Family Applications (1)

Application Number Title Priority Date Filing Date
HK01109169A HK1038837A1 (en) 1999-05-31 2001-12-28 Surface acoustic wave device

Country Status (7)

Country Link
US (1) US6407486B1 (fr)
EP (1) EP1111779B1 (fr)
JP (1) JP3387060B2 (fr)
CN (1) CN1109402C (fr)
DE (1) DE69905734T2 (fr)
HK (1) HK1038837A1 (fr)
WO (1) WO2000074235A1 (fr)

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* Cited by examiner, † Cited by third party
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JP3735550B2 (ja) * 2001-09-21 2006-01-18 Ｔｄｋ株式会社 弾性表面波装置およびその製造方法
TWI282660B (en) 2001-12-27 2007-06-11 Murata Manufacturing Co Surface acoustic wave device and manufacturing method therefor
JP2004165879A (ja) * 2002-11-12 2004-06-10 Alps Electric Co Ltd 弾性表面波素子
TWI232991B (en) * 2002-11-15 2005-05-21 Nec Lcd Technologies Ltd Method for manufacturing an LCD device
JP3646116B2 (ja) 2003-07-17 2005-05-11 Ｔｄｋ株式会社 表面弾性波素子、表面弾性波装置、表面弾性波デュプレクサ、及び表面弾性波素子の製造方法
JP3764450B2 (ja) 2003-07-28 2006-04-05 Ｔｄｋ株式会社 表面弾性波素子、表面弾性波装置、表面弾性波デュプレクサ、及び表面弾性波素子の製造方法
US7795788B2 (en) 2004-10-26 2010-09-14 Kyocera Corporation Surface acoustic wave element and communication device
JP4809042B2 (ja) * 2005-11-10 2011-11-02 日本電波工業株式会社 弾性表面波素子及びその製造方法
JP3961012B1 (ja) * 2006-03-22 2007-08-15 Ｔｄｋ株式会社 弾性表面波装置
US8143681B2 (en) * 2006-04-20 2012-03-27 The George Washington University Saw devices, processes for making them, and methods of use
US20100007444A1 (en) * 2006-04-20 2010-01-14 Anis Nurashikin Nordin GHz Surface Acoustic Resonators in RF-CMOS
US7728697B2 (en) * 2006-09-26 2010-06-01 Mg Materials Corporation Systems and methods for electrically reducing ferroelectric materials to increase bulk conductivity
US20090124513A1 (en) * 2007-04-20 2009-05-14 Patricia Berg Multiplex Biosensor
CA2967107C (fr) 2009-02-27 2020-04-21 Heiner Ophardt Distributeur manuel de liquide avec generateur d'electricite
DE102009056663B4 (de) 2009-12-02 2022-08-11 Tdk Electronics Ag Metallisierung mit hoher Leistungsverträglichkeit und hoher elektrischer Leitfähigkeit und Verfahren zur Herstellung
JP5341006B2 (ja) * 2010-03-30 2013-11-13 新科實業有限公司 弾性表面波装置
US8960004B2 (en) 2010-09-29 2015-02-24 The George Washington University Synchronous one-pole surface acoustic wave resonator
CA2776684C (fr) 2012-05-11 2019-07-23 Gotohti.Com Inc. Distributeur de mousse ozonee
US9050775B2 (en) * 2012-10-12 2015-06-09 Nano And Advanced Materials Institute Limited Methods of fabricating transparent and nanomaterial-based conductive film
CN106596604B (zh) * 2016-11-29 2019-05-21 国网辽宁省电力有限公司沈阳供电公司 一种反射电子衍射技术对高压电缆的无损检测装置
CN106603035A (zh) * 2016-12-23 2017-04-26 北京中科飞鸿科技有限公司 一种提高声表面波滤波器耐受功率的方法
JP6986376B2 (ja) * 2017-06-27 2021-12-22 ＮＤＫ ＳＡＷ ｄｅｖｉｃｅｓ株式会社 弾性表面波素子およびその製造方法
JP2020092321A (ja) * 2018-12-05 2020-06-11 太陽誘電株式会社 弾性波デバイスおよびその製造方法、フィルタ並びにマルチプレクサ

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JPS57159113A (en) * 1981-03-27 1982-10-01 Toshiba Corp Surface acoustic wave resonator
JPS5955615A (ja) * 1982-09-24 1984-03-30 Hitachi Ltd 弾性表面波装置およびその製造方法
JPS62168411A (ja) * 1986-01-20 1987-07-24 Victor Co Of Japan Ltd 弾性表面波共振子
JP2545983B2 (ja) * 1989-04-14 1996-10-23 株式会社村田製作所 弾性表面波装置
US5162690A (en) 1989-04-14 1992-11-10 Murata Manufacturing Co., Ltd. Surface acoustic wave device
JPH0314305A (ja) 1989-06-13 1991-01-23 Murata Mfg Co Ltd 弾性表面波装置の製造方法
JP2937613B2 (ja) 1991-07-16 1999-08-23 日本電気株式会社 薄膜配線およびその製造方法
JPH05199062A (ja) * 1991-09-24 1993-08-06 Seiko Epson Corp 弾性表面波素子とその製造方法および弾性表面波素子用基板
JPH05183373A (ja) * 1991-12-30 1993-07-23 Murata Mfg Co Ltd 弾性表面波素子の電極材料
JP3033331B2 (ja) 1992-02-10 2000-04-17 日本電気株式会社 薄膜配線の製造方法
JP2818535B2 (ja) * 1993-11-11 1998-10-30 日本電気株式会社 弾性表面波装置
JP3208977B2 (ja) 1993-12-02 2001-09-17 株式会社村田製作所 弾性表面波素子の電極形成方法
JP3438360B2 (ja) 1994-11-14 2003-08-18 株式会社村田製作所 弾性表面波素子の電極形成方法
JPH08154030A (ja) * 1994-11-25 1996-06-11 Murata Mfg Co Ltd 弾性表面波素子
JP2888158B2 (ja) * 1995-01-18 1999-05-10 日本電気株式会社 弾性表面波装置の製造方法
JPH08340233A (ja) 1995-06-13 1996-12-24 Nec Corp 弾性表面波装置
CN1110132C (zh) 1995-09-21 2003-05-28 Tdk株式会社 弹性表面波器件及其制造方法
JPH09167936A (ja) * 1995-10-13 1997-06-24 Fujitsu Ltd 弾性表面波装置
DE19641662B4 (de) * 1995-10-13 2004-07-01 Fujitsu Ltd., Kawasaki Oberflächenakustikwellenvorrichtung mit einem optimierten Schnittwinkel eines piezoelektrischen Substrats
JPH09199969A (ja) * 1996-01-19 1997-07-31 Murata Mfg Co Ltd 薄膜体
CN1205744C (zh) * 1997-09-22 2005-06-08 Tdk株式会社 声表面波器件及其制造工艺
US6259185B1 (en) * 1998-12-02 2001-07-10 Cts Corporation Metallization for high power handling in a surface acoustic wave device and method for providing same

Also Published As

Publication number Publication date
EP1111779A1 (fr) 2001-06-27
WO2000074235A1 (fr) 2000-12-07
JP3387060B2 (ja) 2003-03-17
CN1303538A (zh) 2001-07-11
US6407486B1 (en) 2002-06-18
EP1111779A4 (fr) 2002-01-02
DE69905734D1 (de) 2003-04-10
CN1109402C (zh) 2003-05-21
DE69905734T2 (de) 2003-07-10
EP1111779B1 (fr) 2003-03-05

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Legal Events

Date Code Title Description
PF Patent in force
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20091012