HK1037424A1 - Laminated piezoelectric body and method fo producing the same. - Google Patents

Laminated piezoelectric body and method fo producing the same.

Info

Publication number
HK1037424A1
HK1037424A1 HK01107949A HK01107949A HK1037424A1 HK 1037424 A1 HK1037424 A1 HK 1037424A1 HK 01107949 A HK01107949 A HK 01107949A HK 01107949 A HK01107949 A HK 01107949A HK 1037424 A1 HK1037424 A1 HK 1037424A1
Authority
HK
Hong Kong
Prior art keywords
producing
same
piezoelectric body
laminated piezoelectric
laminated
Prior art date
Application number
HK01107949A
Other languages
English (en)
Inventor
Masahito Furukawa
Makoto Morita
Syuuzi Itoh
Minami Kudoh
Kenji Horino
Original Assignee
Tdk Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP34873299A external-priority patent/JP4802353B2/ja
Priority claimed from JP2000007904A external-priority patent/JP3412090B2/ja
Application filed by Tdk Corp filed Critical Tdk Corp
Publication of HK1037424A1 publication Critical patent/HK1037424A1/xx

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/88—Mounts; Supports; Enclosures; Casings
    • H10N30/883—Additional insulation means preventing electrical, physical or chemical damage, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/02—Forming enclosures or casings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/05—Manufacture of multilayered piezoelectric or electrostrictive devices, or parts thereof, e.g. by stacking piezoelectric bodies and electrodes
    • H10N30/053—Manufacture of multilayered piezoelectric or electrostrictive devices, or parts thereof, e.g. by stacking piezoelectric bodies and electrodes by integrally sintering piezoelectric or electrostrictive bodies and electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/50—Piezoelectric or electrostrictive devices having a stacked or multilayer structure

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • General Electrical Machinery Utilizing Piezoelectricity, Electrostriction Or Magnetostriction (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
HK01107949A 1999-12-08 2001-11-12 Laminated piezoelectric body and method fo producing the same. HK1037424A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP34873299A JP4802353B2 (ja) 1999-12-08 1999-12-08 積層型圧電セラミック電子部品及びその製造方法
JP2000007904A JP3412090B2 (ja) 2000-01-17 2000-01-17 積層型圧電体の製造方法およびその製造物

Publications (1)

Publication Number Publication Date
HK1037424A1 true HK1037424A1 (en) 2002-02-08

Family

ID=26578814

Family Applications (1)

Application Number Title Priority Date Filing Date
HK01107949A HK1037424A1 (en) 1999-12-08 2001-11-12 Laminated piezoelectric body and method fo producing the same.

Country Status (5)

Country Link
US (1) US6411012B2 (de)
EP (1) EP1107325B1 (de)
CN (1) CN1197179C (de)
DE (1) DE60038276T2 (de)
HK (1) HK1037424A1 (de)

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US6653762B2 (en) * 2000-04-19 2003-11-25 Murata Manufacturing Co., Ltd. Piezoelectric type electric acoustic converter
JP4000835B2 (ja) * 2001-11-22 2007-10-31 株式会社デンソー セラミック積層体の製造方法
DE10329028A1 (de) * 2002-07-11 2004-01-29 Ceram Tec Ag Innovative Ceramic Engineering Isolierung für piezokeramische Vielschichtaktoren
DE10258255A1 (de) * 2002-12-13 2004-06-24 Robert Bosch Gmbh Piezoaktor und ein Verfahren zu dessen Herstellung
DE10260853A1 (de) * 2002-12-23 2004-07-08 Robert Bosch Gmbh Piezoaktor und ein Verfahren zu dessen Herstellung
WO2005024966A1 (ja) 2003-09-04 2005-03-17 Nec Corporation 圧電セラミックス素子および携帯機器
DE10353171A1 (de) * 2003-11-14 2005-06-16 Robert Bosch Gmbh Piezoaktor
JP3958739B2 (ja) * 2003-12-12 2007-08-15 Ｎｅｃトーキン株式会社 音響振動発生素子
DE102004002204A1 (de) * 2004-01-15 2005-08-11 Epcos Ag Keramikmaterial
EP1753039B1 (de) * 2004-03-29 2012-10-24 Kyocera Corporation Mehrschichtiges piezoelektrisches element
JP3837139B2 (ja) * 2004-03-29 2006-10-25 Ｔｄｋ株式会社 薄膜圧電体素子及びその製造方法
JP4817610B2 (ja) * 2004-03-29 2011-11-16 京セラ株式会社 積層型圧電素子およびその製造方法ならびにこれを用いた噴射装置
JP4707667B2 (ja) * 2004-09-01 2011-06-22 株式会社アドバンテスト バイモルフ素子、バイモルフスイッチ、ミラー素子及びこれらの製造方法
EP1793657A1 (de) * 2004-09-24 2007-06-06 Nihon University Verfahren zur herstellung einer keramischen, elektronischen komponente
EP1858092B1 (de) * 2005-11-02 2013-01-23 Murata Manufacturing Co., Ltd. Piezoelektrisches element
EP1801894B1 (de) * 2005-12-23 2009-04-22 Delphi Technologies, Inc. Verfahren zum Herstellen eines piezoelektrischen Bauteils
JP5201958B2 (ja) * 2007-11-22 2013-06-05 国立大学法人東京工業大学 圧電トランス電極を用いたイオナイザ及びそれによる除電用イオン発生方法
JP5639738B2 (ja) * 2008-02-14 2014-12-10 日本碍子株式会社 圧電／電歪素子の製造方法
JP4930569B2 (ja) * 2009-10-14 2012-05-16 株式会社村田製作所 磁気ヘッド駆動用圧電セラミックアクチュエータ
CN102208528B (zh) * 2011-05-31 2013-06-05 广州市番禺奥迪威电子有限公司 一种多层压电元件电极表面保护层的制造工艺
JP2013101020A (ja) * 2011-11-08 2013-05-23 Seiko Epson Corp センサー素子、力検出装置およびロボット
DE102012105318A1 (de) * 2012-06-19 2013-12-19 Epcos Ag Verfahren zur Herstellung eines keramischen Bauelements und ein keramisches Bauelement
DE102012218755B4 (de) * 2012-10-15 2018-07-05 Continental Automotive Gmbh Verfahren zum Herstellen eines elektronischen Bauelements als Stapel und als Stapel ausgebildetes elektronisches Bauelement
JP6076051B2 (ja) * 2012-11-19 2017-02-08 日本碍子株式会社 圧電素子
DE102013200242A1 (de) * 2013-01-10 2014-07-10 Robert Bosch Gmbh Piezoelektrisches Bauteil und Verfahren zur Herstellung eines piezoelektrischen Bauteils
KR20150042498A (ko) * 2013-10-11 2015-04-21 삼성전기주식회사 압전소자 및 이를 포함하는 진동발생장치
JP2015170848A (ja) * 2014-03-10 2015-09-28 サムソン エレクトロ−メカニックス カンパニーリミテッド． 圧電素子及びこれを含む圧電振動子
CN106716660B (zh) * 2014-08-29 2019-09-13 天津威盛电子有限公司 层叠式压电陶瓷元件
JP1565481S (de) * 2016-05-25 2016-12-19
USD857020S1 (en) * 2016-05-25 2019-08-20 Tdk Corporation Piezoelectric element
DE102019201650A1 (de) * 2019-02-08 2020-08-13 Pi Ceramic Gmbh Verfahren zur Herstellung eines piezoelektrischen Stapelaktors und piezoelektrischer Stapelaktor, vorzugsweise hergestellt nach dem Verfahren
CN113072362A (zh) * 2020-10-15 2021-07-06 中科传感技术(青岛)研究院 一种保护多层压电陶瓷片表面电极的烧结方法
JP2022170162A (ja) * 2021-04-28 2022-11-10 Tdk株式会社 電子部品
CN117412660B (zh) * 2023-12-14 2024-04-16 乌镇实验室 一种共烧型多层压电致动器

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US4160184A (en) * 1978-01-09 1979-07-03 The Singer Company Piezoelectric actuator for a ring laser
JPS6115382A (ja) 1984-07-02 1986-01-23 Nec Corp クランプ素子
JPS6127688A (ja) * 1984-07-02 1986-02-07 Nec Corp 電歪効果素子およびその製造方法
JPS63137491A (ja) * 1986-11-29 1988-06-09 Shimadzu Corp 圧電素子型センサ
JPS647575A (en) * 1987-06-29 1989-01-11 Tokin Corp Formation of electrode of laminated piezoelectric actuator
US5118982A (en) * 1989-05-31 1992-06-02 Nec Corporation Thickness mode vibration piezoelectric transformer
US5191688A (en) * 1989-07-27 1993-03-09 Olympus Optical Co., Ltd. Method for producing a superior longitudinal vibrator
JPH04179286A (ja) * 1990-11-14 1992-06-25 Nec Corp 積層圧電アクチュエータ
JPH05299719A (ja) 1992-04-16 1993-11-12 Nec Kansai Ltd 積層アクチュエータ素子及びその製造方法
JP3286949B2 (ja) 1993-03-30 2002-05-27 株式会社トーキン 積層型圧電アクチュエータの製造方法
JP2830724B2 (ja) * 1993-12-20 1998-12-02 日本電気株式会社 圧電アクチュエータの製造方法
JPH07240545A (ja) 1994-03-02 1995-09-12 Brother Ind Ltd 積層型圧電素子
JPH0832131A (ja) * 1994-07-20 1996-02-02 Brother Ind Ltd 積層型圧電素子並びにその製造方法
JPH09260736A (ja) 1996-03-25 1997-10-03 Chichibu Onoda Cement Corp 積層セラミックス素子及びその製造方法
JPH10136665A (ja) 1996-10-31 1998-05-22 Tdk Corp 圧電アクチュエータ
KR100314762B1 (ko) 1998-02-27 2002-01-09 사토 히로시 압전세라믹 및 압전장치
US6577486B1 (en) * 1998-12-03 2003-06-10 Nec Tokin Corporation Stacked-type electronic device having film electrode for breaking abnormal current

Also Published As

Publication number Publication date
US6411012B2 (en) 2002-06-25
EP1107325A2 (de) 2001-06-13
DE60038276T2 (de) 2009-03-26
EP1107325A3 (de) 2005-01-19
EP1107325B1 (de) 2008-03-12
CN1197179C (zh) 2005-04-13
US20010009344A1 (en) 2001-07-26
DE60038276D1 (de) 2008-04-24
CN1299153A (zh) 2001-06-13

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Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20101208