HK1040568B - 多層壓電器件及其製造方法 - Google Patents

多層壓電器件及其製造方法

Info

Publication number
HK1040568B
HK1040568B HK02101936.3A HK02101936A HK1040568B HK 1040568 B HK1040568 B HK 1040568B HK 02101936 A HK02101936 A HK 02101936A HK 1040568 B HK1040568 B HK 1040568B
Authority
HK
Hong Kong
Prior art keywords
producing
same
piezoelectric device
multilayer piezoelectric
multilayer
Prior art date
Application number
HK02101936.3A
Other languages
English (en)
Other versions
HK1040568A1 (en
Inventor
小島達也
堀野賢治
Original Assignee
Tdk株式會社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tdk株式會社 filed Critical Tdk株式會社
Publication of HK1040568A1 publication Critical patent/HK1040568A1/xx
Publication of HK1040568B publication Critical patent/HK1040568B/zh

Links

Classifications

    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
    • H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
    • H03H3/02—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/15—Constructional features of resonators consisting of piezoelectric or electrostrictive material
    • H03H9/17—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator
    • H03H9/178—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator of a laminated structure of multiple piezoelectric layers with inner electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/05—Manufacture of multilayered piezoelectric or electrostrictive devices, or parts thereof, e.g. by stacking piezoelectric bodies and electrodes
    • H10N30/053—Manufacture of multilayered piezoelectric or electrostrictive devices, or parts thereof, e.g. by stacking piezoelectric bodies and electrodes by integrally sintering piezoelectric or electrostrictive bodies and electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/87—Electrodes or interconnections, e.g. leads or terminals
    • H10N30/871—Single-layered electrodes of multilayer piezoelectric or electrostrictive devices, e.g. internal electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/87—Electrodes or interconnections, e.g. leads or terminals
    • H10N30/877—Conductive materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/85—Piezoelectric or electrostrictive active materials
    • H10N30/853—Ceramic compositions
    • H10N30/8548—Lead-based oxides
    • H10N30/8554—Lead-zirconium titanate [PZT] based

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Compositions Of Oxide Ceramics (AREA)
  • General Electrical Machinery Utilizing Piezoelectricity, Electrostriction Or Magnetostriction (AREA)
  • Fuel-Injection Apparatus (AREA)
  • Micromachines (AREA)
  • Laminated Bodies (AREA)
HK02101936.3A 1999-09-30 2002-03-13 多層壓電器件及其製造方法 HK1040568B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP28001699 1999-09-30
JP2000190654A JP3397753B2 (ja) 1999-09-30 2000-06-26 積層型圧電素子およびその製造方法

Publications (2)

Publication Number Publication Date
HK1040568A1 HK1040568A1 (en) 2002-06-14
HK1040568B true HK1040568B (zh) 2005-09-30

Family

ID=26553578

Family Applications (1)

Application Number Title Priority Date Filing Date
HK02101936.3A HK1040568B (zh) 1999-09-30 2002-03-13 多層壓電器件及其製造方法

Country Status (5)

Country Link
US (1) US6384517B1 (zh)
JP (1) JP3397753B2 (zh)
CN (1) CN1188916C (zh)
HK (1) HK1040568B (zh)
SG (1) SG98427A1 (zh)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4683689B2 (ja) * 2000-03-29 2011-05-18 京セラ株式会社 積層型圧電素子及び圧電アクチュエータ並びに噴射装置
DE10205928A1 (de) * 2001-02-21 2002-08-22 Ceramtec Ag Verfahren zur Herstellung piezokeramischer Vielschichtaktoren
JP3975840B2 (ja) * 2002-06-27 2007-09-12 株式会社村田製作所 積層型圧電トランス
DE10326040A1 (de) * 2003-06-10 2004-12-30 Robert Bosch Gmbh Verfahren zur Herstellung von keramischen Grünfolien für keramische Bauteile
EP1653527A4 (en) * 2003-07-28 2009-12-23 Kyocera Corp ELECTRONIC COMPONENT OF THE LAMINATED TYPE, PROCESS FOR PRODUCING THE SAME, AND PIEZOELECTRIC ELEMENT OF THE LAMINATED TYPE
JP4771649B2 (ja) * 2003-07-28 2011-09-14 京セラ株式会社 積層型電子部品の製造方法
JP4593912B2 (ja) * 2003-12-24 2010-12-08 京セラ株式会社 積層型圧電素子およびその製法、並びに噴射装置
JP2005243677A (ja) * 2004-02-24 2005-09-08 Kyocera Corp 積層型電子部品とその製造方法およびこれを用いた噴射装置
JP4610215B2 (ja) * 2004-03-19 2011-01-12 株式会社ノリタケカンパニーリミテド 導体ペースト
JP4881062B2 (ja) 2006-05-15 2012-02-22 キヤノン株式会社 積層圧電素子、その製造方法および振動波駆動装置
KR100852162B1 (ko) 2006-08-23 2008-08-13 주식회사 이노칩테크놀로지 압전 진동 소자
DE102007004813B4 (de) * 2007-01-31 2016-01-14 Continental Automotive Gmbh Verfahren zur Herstellung eines piezokeramischen Vielschichtaktors
JP5006354B2 (ja) * 2009-01-29 2012-08-22 日本碍子株式会社 圧電／電歪共振子
WO2013191249A1 (ja) * 2012-06-21 2013-12-27 日本碍子株式会社 圧電／電歪セラミックス組成物及び変位発生装置
JP5679010B2 (ja) * 2013-05-07 2015-03-04 Tdk株式会社 圧電素子およびその製造方法
CN103579492A (zh) * 2013-11-19 2014-02-12 中国第一汽车股份有限公司无锡油泵油嘴研究所 压电执行元件

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6347137A (ja) * 1986-08-15 1988-02-27 松下電工株式会社 圧電セラミツク体の製法
US4988909A (en) * 1989-01-20 1991-01-29 Mitsui Toatsu Chemicals, Inc. Piezoelectric element with giant electrostrictive effect and ceramic composition for preparing same
JPH03155178A (ja) * 1989-11-14 1991-07-03 Hitachi Metals Ltd 積層型変位素子
JPH0496286A (ja) * 1990-08-03 1992-03-27 Toyota Motor Corp 積層型圧電体の製造方法
KR100200902B1 (ko) * 1990-09-19 1999-06-15 가나이 쓰도무 다층세라믹 소결체 및 그 제조방법
JPH04340778A (ja) * 1991-01-30 1992-11-27 Nec Corp 積層圧電アクチュエータ素子
JPH05110157A (ja) 1991-10-14 1993-04-30 Nec Corp 積層圧電アクチユエータ
JPH06314828A (ja) * 1993-04-28 1994-11-08 Mitsubishi Kasei Corp 積層型素子の製造方法
US5645753A (en) * 1994-05-19 1997-07-08 Kyocera Corporation Piezo-electric ceramic composition
EP0736915A1 (en) * 1995-04-03 1996-10-09 Seiko Epson Corporation Piezoelectric thin film, method for producing the same, and ink jet recording head using the thin film
JPH09261978A (ja) 1996-03-25 1997-10-03 Nippon Cement Co Ltd 積層体素子および振動駆動装置
JPH1056354A (ja) * 1996-08-09 1998-02-24 Fuji Electric Co Ltd 弾性表面波フィルタおよびその製造方法
US5935485A (en) * 1996-10-31 1999-08-10 Kabushiki Kaisha Toyota Chuo Kenkyusho Piezoelectric material and piezoelectric element
JP3596743B2 (ja) * 1999-08-19 2004-12-02 株式会社村田製作所 積層セラミック電子部品の製造方法及び積層セラミック電子部品

Also Published As

Publication number Publication date
CN1188916C (zh) 2005-02-09
JP2001168408A (ja) 2001-06-22
JP3397753B2 (ja) 2003-04-21
CN1313641A (zh) 2001-09-19
US6384517B1 (en) 2002-05-07
HK1040568A1 (en) 2002-06-14
SG98427A1 (en) 2003-09-19

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Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20100929