AU2001283449A1 - Piezoelectric composite device and method for making same - Google Patents

Piezoelectric composite device and method for making same

Info

Publication number
AU2001283449A1
AU2001283449A1 AU2001283449A AU8344901A AU2001283449A1 AU 2001283449 A1 AU2001283449 A1 AU 2001283449A1 AU 2001283449 A AU2001283449 A AU 2001283449A AU 8344901 A AU8344901 A AU 8344901A AU 2001283449 A1 AU2001283449 A1 AU 2001283449A1
Authority
AU
Australia
Prior art keywords
making same
composite device
piezoelectric composite
piezoelectric
making
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001283449A
Inventor
Benjamin M. Copeland
Garnett C. Horner
William Eugene Robbins
John Edward Teter Jr.
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
National Aeronautics and Space Administration NASA
Original Assignee
National Aeronautics and Space Administration NASA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by National Aeronautics and Space Administration NASA filed Critical National Aeronautics and Space Administration NASA
Publication of AU2001283449A1 publication Critical patent/AU2001283449A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/88—Mounts; Supports; Enclosures; Casings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/02—Forming enclosures or casings
AU2001283449A 2000-08-18 2001-08-17 Piezoelectric composite device and method for making same Abandoned AU2001283449A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US22672900P 2000-08-18 2000-08-18
US60226729 2000-08-18
PCT/US2001/025898 WO2002017407A2 (en) 2000-08-18 2001-08-17 Piezoelectric composite device and method for making same

Publications (1)

Publication Number Publication Date
AU2001283449A1 true AU2001283449A1 (en) 2002-03-04

Family

ID=22850156

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001283449A Abandoned AU2001283449A1 (en) 2000-08-18 2001-08-17 Piezoelectric composite device and method for making same

Country Status (3)

Country Link
US (1) US20020038990A1 (en)
AU (1) AU2001283449A1 (en)
WO (1) WO2002017407A2 (en)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7400040B2 (en) * 2003-06-10 2008-07-15 Intel Corporation Thermal interface apparatus, systems, and methods
US6988706B2 (en) * 2003-12-17 2006-01-24 General Electric Company Piezoelectric microvalve
US7082655B2 (en) * 2003-12-18 2006-08-01 Ge Inspection Technologies, Lp Process for plating a piezoelectric composite
US7732998B2 (en) * 2006-08-03 2010-06-08 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Telescoping cylindrical piezoelectric fiber composite actuator assemblies
US20080202664A1 (en) * 2007-02-27 2008-08-28 Iptrade, Inc. Method of manufacturing a piezoelectric package having a composite structure
CN101951187A (en) * 2010-07-30 2011-01-19 昆明理工大学 Power generation device made of rare earth ultra-magnetic telescopic material
CN101924493A (en) * 2010-07-30 2010-12-22 昆明理工大学 Power generation device prepared by piezoelectric materials
KR101433655B1 (en) 2013-08-28 2014-08-25 주식회사 네미센스 Monitoring Patch Sensor Using Macro Fiber Composite For Wind Power Generation Blade
CN110634970B (en) * 2018-05-31 2021-04-30 北京晖宏科技有限公司 High-temperature cloth, photovoltaic module and preparation method of photovoltaic module

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4047214A (en) * 1975-09-04 1977-09-06 Westinghouse Electric Corporation Electrostatically bonded dielectric-on-semiconductor device, and a method of making the same
US4849668A (en) * 1987-05-19 1989-07-18 Massachusetts Institute Of Technology Embedded piezoelectric structure and control
US5305507A (en) * 1990-10-29 1994-04-26 Trw Inc. Method for encapsulating a ceramic device for embedding in composite structures
US6420819B1 (en) * 1994-01-27 2002-07-16 Active Control Experts, Inc. Packaged strain actuator
US5632841A (en) * 1995-04-04 1997-05-27 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Thin layer composite unimorph ferroelectric driver and sensor
US5920145A (en) * 1996-09-09 1999-07-06 Mcdonnell Douglas Corporation Method and structure for embedding piezoelectric transducers in thermoplastic composites
US6107726A (en) * 1997-07-25 2000-08-22 Materials Systems, Inc. Serpentine cross-section piezoelectric linear actuator
US6512323B2 (en) * 2000-03-22 2003-01-28 Caterpillar Inc. Piezoelectric actuator device

Also Published As

Publication number Publication date
WO2002017407A3 (en) 2002-06-06
US20020038990A1 (en) 2002-04-04
WO2002017407A2 (en) 2002-02-28

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