HK1037059A1 - Electromechanical switching device package with controlled impedance environment. - Google Patents

Electromechanical switching device package with controlled impedance environment.

Info

Publication number
HK1037059A1
HK1037059A1 HK01106718A HK01106718A HK1037059A1 HK 1037059 A1 HK1037059 A1 HK 1037059A1 HK 01106718 A HK01106718 A HK 01106718A HK 01106718 A HK01106718 A HK 01106718A HK 1037059 A1 HK1037059 A1 HK 1037059A1
Authority
HK
Hong Kong
Prior art keywords
ground
signal
reed switch
main body
opposing sides
Prior art date
Application number
HK01106718A
Other languages
English (en)
Inventor
Mark E Martich
Original Assignee
Kearney National Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US09/266,978 external-priority patent/US6052045A/en
Application filed by Kearney National Inc filed Critical Kearney National Inc
Publication of HK1037059A1 publication Critical patent/HK1037059A1/xx

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H1/00—Contacts
    • H01H1/64—Protective enclosures, baffle plates, or screens for contacts
    • H01H1/66—Contacts sealed in an evacuated or gas-filled envelope, e.g. magnetic dry-reed contacts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H51/00—Electromagnetic relays
    • H01H51/28—Relays having both armature and contacts within a sealed casing outside which the operating coil is located, e.g. contact carried by a magnetic leaf spring or reed
    • H01H51/281—Mounting of the relay; Encapsulating; Details of connections
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H1/00—Contacts
    • H01H1/58—Electric connections to or between contacts; Terminals
    • H01H2001/5888—Terminals of surface mounted devices [SMD]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/0243—Printed circuits associated with mounted high frequency components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]

Landscapes

  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Switches That Are Operated By Magnetic Or Electric Fields (AREA)
  • Details Of Connecting Devices For Male And Female Coupling (AREA)
  • Transceivers (AREA)
  • Networks Using Active Elements (AREA)
  • Electronic Switches (AREA)
  • Control Of Electric Motors In General (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
HK01106718A 1999-03-12 2001-09-24 Electromechanical switching device package with controlled impedance environment. HK1037059A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/266,978 US6052045A (en) 1999-03-12 1999-03-12 Electromechanical switching device package with controlled impedance environment
US09/391,710 US6025768A (en) 1999-03-12 1999-09-08 Electromechanical switching device package with controlled impedance environment
PCT/US1999/023129 WO2000055878A1 (en) 1999-03-12 1999-10-06 Electromechanical switching device package with controlled impedance environment

Publications (1)

Publication Number Publication Date
HK1037059A1 true HK1037059A1 (en) 2002-01-25

Family

ID=26952147

Family Applications (1)

Application Number Title Priority Date Filing Date
HK01106718A HK1037059A1 (en) 1999-03-12 2001-09-24 Electromechanical switching device package with controlled impedance environment.

Country Status (15)

Country Link
US (1) US6025768A (xx)
EP (1) EP1037236B1 (xx)
JP (1) JP3442012B2 (xx)
KR (1) KR100396129B1 (xx)
CN (1) CN1155037C (xx)
AT (1) ATE239977T1 (xx)
AU (1) AU6288199A (xx)
CA (1) CA2327108C (xx)
DE (1) DE69907624T2 (xx)
DK (1) DK1037236T3 (xx)
ES (1) ES2193643T3 (xx)
HK (1) HK1037059A1 (xx)
PT (1) PT1037236E (xx)
TW (1) TW434618B (xx)
WO (1) WO2000055878A1 (xx)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USRE38381E1 (en) 2000-07-21 2004-01-13 Kearney-National Inc. Inverted board mounted electromechanical device
WO2002023566A2 (en) * 2000-09-18 2002-03-21 Meder Electronic A lead-less surface mount reed relay
JP3996758B2 (ja) * 2001-03-13 2007-10-24 富士通コンポーネント株式会社 作動条件制約型スイッチ及び外部磁界発生ユニット及び作動条件制約型スイッチ装置及び電子機器
GB2378042A (en) * 2001-07-24 2003-01-29 Ubinetics Ltd Fixing mechanical parts to PCBs
EP1483769B1 (en) * 2002-03-08 2007-09-19 Kearney-National, Inc. Surface mount molded relay package and method of manufacturing same
US7361844B2 (en) * 2002-11-25 2008-04-22 Vlt, Inc. Power converter package and thermal management
CN101197337A (zh) * 2006-12-05 2008-06-11 鸿富锦精密工业（深圳）有限公司 防呆集成电路元件
WO2009137239A2 (en) * 2008-04-15 2009-11-12 Coto Technology, Inc. Improved form c relay and package using same
US7920038B1 (en) * 2008-05-20 2011-04-05 Keithley Instruments, Inc. Dual shielded relay
US10026575B2 (en) * 2014-03-11 2018-07-17 Shenzhen Zhiyou Battery Integration Technology Co., Ltd Reed relay
DE202018101423U1 (de) * 2018-03-14 2019-06-17 Tridonic Gmbh & Co Kg Positionierungs- und Montagehilfe für Spulen auf Leiterplatten
WO2019194346A1 (ko) * 2018-04-05 2019-10-10 엘지전자 주식회사 Pcb 적층 구조체와 이를 포함하는 이동 단말기
JPWO2021029194A1 (xx) * 2019-08-09 2021-02-18

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE757101A (fr) * 1969-10-06 1971-03-16 Grisby Barton Inc Assemblage de relais
US3939381A (en) * 1974-03-22 1976-02-17 Mcm Industries, Inc. Universal burn-in fixture
US5438307A (en) * 1994-08-03 1995-08-01 Pen-Lin Liao Single-pole magnetic reed relay
US5684441A (en) * 1996-02-29 1997-11-04 Graeber; Roger R. Reverse power protection circuit and relay
EP0805471A1 (en) * 1996-04-30 1997-11-05 C.P. Clare Corporation Electromagnetic relay and method of manufacturing such relay
JPH11204010A (ja) * 1998-01-08 1999-07-30 Fujitsu Takamisawa Component Ltd リードリレーおよびその製造方法

Also Published As

Publication number Publication date
CN1298545A (zh) 2001-06-06
DE69907624D1 (de) 2003-06-12
CA2327108A1 (en) 2000-09-21
PT1037236E (pt) 2003-08-29
TW434618B (en) 2001-05-16
WO2000055878A1 (en) 2000-09-21
EP1037236A3 (en) 2001-01-17
EP1037236A2 (en) 2000-09-20
DK1037236T3 (da) 2003-08-25
JP2000268692A (ja) 2000-09-29
JP3442012B2 (ja) 2003-09-02
CA2327108C (en) 2007-04-10
CN1155037C (zh) 2004-06-23
KR100396129B1 (ko) 2003-08-27
ATE239977T1 (de) 2003-05-15
KR20010089117A (ko) 2001-09-29
EP1037236B1 (en) 2003-05-07
ES2193643T3 (es) 2003-11-01
US6025768A (en) 2000-02-15
AU6288199A (en) 2000-10-04
DE69907624T2 (de) 2004-03-25

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Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20121006