ES2193643T3 - Dispositivo de conmutacion electromecanica encapsulado con entorno de impedancia controlada. - Google Patents

Dispositivo de conmutacion electromecanica encapsulado con entorno de impedancia controlada.

Info

Publication number
ES2193643T3
ES2193643T3 ES99119173T ES99119173T ES2193643T3 ES 2193643 T3 ES2193643 T3 ES 2193643T3 ES 99119173 T ES99119173 T ES 99119173T ES 99119173 T ES99119173 T ES 99119173T ES 2193643 T3 ES2193643 T3 ES 2193643T3
Authority
ES
Spain
Prior art keywords
grounding
switching device
controlled impedance
electromechanical switching
encapsulated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES99119173T
Other languages
English (en)
Inventor
Mark E Martich
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kearney National Inc
Original Assignee
Kearney National Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US09/266,978 external-priority patent/US6052045A/en
Application filed by Kearney National Inc filed Critical Kearney National Inc
Application granted granted Critical
Publication of ES2193643T3 publication Critical patent/ES2193643T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H1/00—Contacts
    • H01H1/64—Protective enclosures, baffle plates, or screens for contacts
    • H01H1/66—Contacts sealed in an evacuated or gas-filled envelope, e.g. magnetic dry-reed contacts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H51/00—Electromagnetic relays
    • H01H51/28—Relays having both armature and contacts within a sealed casing outside which the operating coil is located, e.g. contact carried by a magnetic leaf spring or reed
    • H01H51/281—Mounting of the relay; Encapsulating; Details of connections
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H1/00—Contacts
    • H01H1/58—Electric connections to or between contacts; Terminals
    • H01H2001/5888—Terminals of surface mounted devices [SMD]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/0243—Printed circuits associated with mounted high frequency components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]

Landscapes

  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Switches That Are Operated By Magnetic Or Electric Fields (AREA)
  • Details Of Connecting Devices For Male And Female Coupling (AREA)
  • Networks Using Active Elements (AREA)
  • Transceivers (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Electronic Switches (AREA)
  • Control Of Electric Motors In General (AREA)

Abstract

Dispositivo reed encapsulado (100, 200), que comprende: un interruptor reed (111, 211) que incluye terminales (106, 206) transmisores de señales eléctricas; un conductor de protección de puesta a tierra (110) dispuesto alrededor de dicho interruptor reed (111, 211); un primer terminal de puesta a tierra (108, 208) conectado a dicho conductor de protección de puesta a tierra (110); un segundo terminal de puesta a tierra (108, 208) conectado a dicho conductor de protección de puesta a tierra (110), estando dispuesto por lo menos uno de los terminales (106, 206) de transmisión de señales eléctricas entre el primer terminal de puesta a tierra y el segundo terminal de puesta a tierra (108, 208); una base de soporte (112, 212) provista de un cuerpo principal con una superficie superior (123, 223) y una superficie inferior (132, 232), estando el dispositivo interruptor reed (111, 211) dispuesto en la base de soporte (112, 212).
ES99119173T 1999-03-12 1999-10-06 Dispositivo de conmutacion electromecanica encapsulado con entorno de impedancia controlada. Expired - Lifetime ES2193643T3 (es)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/266,978 US6052045A (en) 1999-03-12 1999-03-12 Electromechanical switching device package with controlled impedance environment
US09/391,710 US6025768A (en) 1999-03-12 1999-09-08 Electromechanical switching device package with controlled impedance environment

Publications (1)

Publication Number Publication Date
ES2193643T3 true ES2193643T3 (es) 2003-11-01

Family

ID=26952147

Family Applications (1)

Application Number Title Priority Date Filing Date
ES99119173T Expired - Lifetime ES2193643T3 (es) 1999-03-12 1999-10-06 Dispositivo de conmutacion electromecanica encapsulado con entorno de impedancia controlada.

Country Status (15)

Country Link
US (1) US6025768A (es)
EP (1) EP1037236B1 (es)
JP (1) JP3442012B2 (es)
KR (1) KR100396129B1 (es)
CN (1) CN1155037C (es)
AT (1) ATE239977T1 (es)
AU (1) AU6288199A (es)
CA (1) CA2327108C (es)
DE (1) DE69907624T2 (es)
DK (1) DK1037236T3 (es)
ES (1) ES2193643T3 (es)
HK (1) HK1037059A1 (es)
PT (1) PT1037236E (es)
TW (1) TW434618B (es)
WO (1) WO2000055878A1 (es)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USRE38381E1 (en) 2000-07-21 2004-01-13 Kearney-National Inc. Inverted board mounted electromechanical device
EP1325505A4 (en) * 2000-09-18 2006-11-02 Meder Electronic FLEXIBLE RELAY MOUNT WITH SURFACE MOUNTING WITHOUT CONDUCTORS
JP3996758B2 (ja) * 2001-03-13 2007-10-24 富士通コンポーネント株式会社 作動条件制約型スイッチ及び外部磁界発生ユニット及び作動条件制約型スイッチ装置及び電子機器
GB2378042A (en) * 2001-07-24 2003-01-29 Ubinetics Ltd Fixing mechanical parts to PCBs
EP1483769B1 (en) * 2002-03-08 2007-09-19 Kearney-National, Inc. Surface mount molded relay package and method of manufacturing same
US7361844B2 (en) * 2002-11-25 2008-04-22 Vlt, Inc. Power converter package and thermal management
CN101197337A (zh) * 2006-12-05 2008-06-11 鸿富锦精密工业（深圳）有限公司 防呆集成电路元件
WO2009137239A2 (en) * 2008-04-15 2009-11-12 Coto Technology, Inc. Improved form c relay and package using same
US7920038B1 (en) * 2008-05-20 2011-04-05 Keithley Instruments, Inc. Dual shielded relay
CN106104739B (zh) * 2014-03-11 2019-03-08 广东华旵智动行运系统研究院有限公司 一种干簧管继电器
DE202018101423U1 (de) * 2018-03-14 2019-06-17 Tridonic Gmbh & Co Kg Positionierungs- und Montagehilfe für Spulen auf Leiterplatten
KR102269852B1 (ko) * 2018-04-05 2021-06-28 엘지전자 주식회사 Pcb 적층 구조체와 이를 포함하는 이동 단말기
WO2021029194A1 (ja) * 2019-08-09 2021-02-18 パナソニックＩｐマネジメント株式会社 電子基板

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE757101A (fr) * 1969-10-06 1971-03-16 Grisby Barton Inc Assemblage de relais
US3939381A (en) * 1974-03-22 1976-02-17 Mcm Industries, Inc. Universal burn-in fixture
US5438307A (en) * 1994-08-03 1995-08-01 Pen-Lin Liao Single-pole magnetic reed relay
US5684441A (en) * 1996-02-29 1997-11-04 Graeber; Roger R. Reverse power protection circuit and relay
EP0805471A1 (en) * 1996-04-30 1997-11-05 C.P. Clare Corporation Electromagnetic relay and method of manufacturing such relay
JPH11204010A (ja) * 1998-01-08 1999-07-30 Fujitsu Takamisawa Component Ltd リードリレーおよびその製造方法

Also Published As

Publication number Publication date
EP1037236A3 (en) 2001-01-17
JP2000268692A (ja) 2000-09-29
TW434618B (en) 2001-05-16
EP1037236B1 (en) 2003-05-07
PT1037236E (pt) 2003-08-29
WO2000055878A1 (en) 2000-09-21
US6025768A (en) 2000-02-15
HK1037059A1 (en) 2002-01-25
ATE239977T1 (de) 2003-05-15
JP3442012B2 (ja) 2003-09-02
EP1037236A2 (en) 2000-09-20
DE69907624D1 (de) 2003-06-12
KR100396129B1 (ko) 2003-08-27
DE69907624T2 (de) 2004-03-25
CA2327108A1 (en) 2000-09-21
CA2327108C (en) 2007-04-10
CN1298545A (zh) 2001-06-06
DK1037236T3 (da) 2003-08-25
AU6288199A (en) 2000-10-04
KR20010089117A (ko) 2001-09-29
CN1155037C (zh) 2004-06-23

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