GB2378042A - Fixing mechanical parts to PCBs - Google Patents
Fixing mechanical parts to PCBs Download PDFInfo
- Publication number
- GB2378042A GB2378042A GB0118056A GB0118056A GB2378042A GB 2378042 A GB2378042 A GB 2378042A GB 0118056 A GB0118056 A GB 0118056A GB 0118056 A GB0118056 A GB 0118056A GB 2378042 A GB2378042 A GB 2378042A
- Authority
- GB
- United Kingdom
- Prior art keywords
- solder
- circuit board
- printed circuit
- mechanical part
- pieces
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 150000003071 polychlorinated biphenyls Chemical class 0.000 title description 3
- 229910000679 solder Inorganic materials 0.000 claims abstract description 102
- 238000012216 screening Methods 0.000 claims abstract description 23
- 238000010438 heat treatment Methods 0.000 claims abstract description 3
- 238000000034 method Methods 0.000 claims description 30
- NMWSKOLWZZWHPL-UHFFFAOYSA-N 3-chlorobiphenyl Chemical compound ClC1=CC=CC(C=2C=CC=CC=2)=C1 NMWSKOLWZZWHPL-UHFFFAOYSA-N 0.000 description 4
- 101001082832 Saccharomyces cerevisiae (strain ATCC 204508 / S288c) Pyruvate carboxylase 2 Proteins 0.000 description 4
- 239000000463 material Substances 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 230000004907 flux Effects 0.000 description 2
- 230000007246 mechanism Effects 0.000 description 2
- 238000004886 process control Methods 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- ZGHQUYZPMWMLBM-UHFFFAOYSA-N 1,2-dichloro-4-phenylbenzene Chemical compound C1=C(Cl)C(Cl)=CC=C1C1=CC=CC=C1 ZGHQUYZPMWMLBM-UHFFFAOYSA-N 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/002—Casings with localised screening
- H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
- H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
- H05K9/0026—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields integrally formed from metal sheet
- H05K9/0028—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields integrally formed from metal sheet with retainers or specific soldering features
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10371—Shields or metal cases
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
- H05K2203/041—Solder preforms in the shape of solder balls
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
- H05K2203/0415—Small preforms other than balls, e.g. discs, cylinders or pillars
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
A mechanical part (1) (such as a screening or shielding can) is fixed to a printed circuit board (2) by fixing a plurality of discrete solder pieces (3) to that portion of the mechanical part (1) to be fixed to the printed circuit board; placing the mechanical part on the printed circuit board in the desired position with the solder pieces in contact with the printed circuit board; heating the solder pieces to soften the solder sufficiently for it to flow whilst maintaining the discrete nature of the solder pieces; and allowing the solder to harden, thereby fixing the mechanical part to the printed circuit board.
Description
<Desc/Clms Page number 1>
Fixing Mechanical Parts to PCBs This invention relates to a method of fixing a mechanical part to a printed circuit board (PCB), particularly a high-density PCB, and to a PCB made in accordance with such a method.
Mechanical parts such as screening cans and other metal plated plastics-material parts can be difficult to fix to high-density PCBs in a low cost and reliable way. The conventional method of attaching such a part is to provide it with extensions ("legs") that fit through holes in the PCB, and can be bent over on the reverse side to give a mechanical fixing. This method is not suitable for surface mount assembly processes, is difficult to assemble cost-effectively, and is wasteful in board area.
Although such mechanical parts can be assembled to a PCB using surface mount processes (i. e. solder paste and reflow) it is very difficult to manufacture larger parts with sufficient flatness and good enough process control to guarantee that all surfaces will remain in contact with the solder paste and will solder correctly-there can be gaps as a result, and these are unacceptable in many instances as, for example, they prevent a screening can functioning correctly, or a metal part sitting flat enough on the PCB.
The aim of the invention is to provide an improved method of fixing a mechanical part (such as a screening can) to a high density PCB.
The present invention provides a method of fixing a mechanical part to a printed circuit board, the method comprising the steps of :- a) fixing a plurality of discrete solder pieces to either the printed circuit board or to that portion of the mechanical part to be fixed to the printed circuit board; b) placing the mechanical part against the printed circuit board in the desired position with the solder pieces in contact with the printed circuit board and said portion of the mechanical part;
<Desc/Clms Page number 2>
c) heating the solder pieces to soften the solder sufficiently for it to flow whilst maintaining the discrete nature of the solder pieces; and d) allowing the solder to harden, thereby fixing the mechanical part to the printed circuit board.
In a preferred embodiment, solder balls constitute the solder pieces. Alternatively, solder columns or other pre-formed shapes constitute the solder pieces.
In a preferred embodiment, the solder pieces are fixed to said portion of the mechanical part, and the mechanical part is then placed on the printed circuit board in the desired position. Advantageously, the solder pieces are substantially equispaced along an edge surface of the mechanical part, preferably by distances lying within the range of from
1mm to 5mm.
Advantageously, the edge surface is formed on an in-turned or out-turned flange of the mechanical part. Alternatively, the edge surface is constituted by the co-planar surfaces of a plurality of in-turned or out-turned tabs formed on the mechanical part, a respective solder piece being associated with each of the tabs.
The method may further comprise the step of applying solder paste to each region of the edge surface of the mechanical part to which a solder piece is to fixed, prior to placing the discrete solder pieces in position. When the edge surface is formed on said flange, the method may further comprise the step of applying solder resist to those portions of the edge surface between said regions.
Alternatively, the edge surface is formed with a plurality of detents for locating the solder pieces.
Conveniently, the solder pieces are positioned and on, and soldered to, said portion of the mechanical part with said portion uppermost, and step c) is carried out with the mechanical part on top of the printed circuit board, and with the solder pieces facing downwardly.
<Desc/Clms Page number 3>
In a preferred embodiment, the mechanical part is placed on the printed circuit board with the solder pieces in contact with a ground track provided on the surface of the printed circuit board. Alternatively, the mechanical part is placed on the printed circuit board with the solder pieces in contact with respective vias connected to a ground layer formed within the printed circuit board.
The invention also provides a printed circuit board provided with a mechanical part, the mechanical part being fixed to the printed circuit board by means of a plurality of discrete solder pieces fixed to the printed circuit board and positioned along, and fixed to, an edge surface of the mechanical part, the solder pieces having been subjected to heat so as to soften the solder sufficiently for it to flow whilst maintaining the discrete nature of the solder pieces.
A screening may constitute the mechanical part.
The invention will now be described in greater detail, by way of example, with reference to the drawings in which :-
Figure 1 is a schematic side elevation showing a screening can fixed to a PCB by a method in accordance with the invention;
Figure 2 is a schematic end elevation of the arrangement shown in Figure 1; and
Figure 3 is a schematic end elevation of a modified arrangement.
Referring the drawings, Figure 1 shows a screening can 1 fixed to a PCB 2 by means of a plurality of solder balls 3 and a ground track 4 provided on the top surface of the PCB. The solder balls 3 are positioned along a horizontal lower surface 5a of an inwardly-turned flange 5 of the screening can 1. The solder balls 3 are regularly spaced along the surface 5a, for example on a regular pitch of between 1 and 2mm. In order to locate and fix the solder balls 3 in their correct positions, and to prevent the solder balls touching one another, solder resist is applied to the surface Sa at positions between those where the solder balls are to be fixed, and solder paste is applied to the surface 5a, using a stencil, at positions where the solder balls are to be fixed. The
<Desc/Clms Page number 4>
solder balls 3 are then applied to the solder pasted parts of the surface 5a, with the screening can 1 upside-down so that the surface Sa is uppermost, using an apertured plate (or other similar alignment mechanism). The screening can 1 then undergoes reflow whilst upside-down, that is to say with the solder balls 3 uppermost. After the solder balls 3 have solidified, the screening can 1 is then positioned over the PCB 2 in its normal orientation (that is to say with the solder balls 3 lowermost), by aligning the solder balls with the ground track 4, and the connection is completed by treating in a reflow oven, that is to say the screening can is mounted onto the PCB as a conventional large BGA-type device using standard SMT processes.
Figure 3 shows a modified arrangement, in which solder balls 13 are positioned on an underneath surface 15a of a screening can 11, each solder ball being positioned within a respective location detent 15b formed in the surface 15a. Here again, the surfaces of the detents 15b are covered with solder paste via a stencil. However, because of the detents 15b, the remaining area of the surface 15a may not need to be coated with solder resist. The screening can 11 then undergoes reflow whilst upside-down, that is
to say with the solder balls 13 facing upwards. The screening can 11 is then mounted onto a PCB 12 in a similar manner to that in which the screening can 1 of the embodiment of Figures 1 and 2 is mounted on the PCB 2. The connection is completed by treating in a reflow oven.
It will be apparent that modifications could be made to each of the arrangements described above. In particular, a separate small tab for each of the solder balls 3 could be provided in the first embodiment in place of the continuous flange 5. Moreover, in each of the embodiments, pre-formed connections other than solder balls could be used, for example solder columns. It will also be apparent that the screening cans 1 and 11 could be made of cast metal or high temperature plastics material coated with a conductive solderable material.
The use of discrete solder balls 3, 13 gives inherent compliance and tolerance of a lack of flatness during the soldering process. Moreover, by appropriately spacing the solder balls 3, 13. EMC performance will not be significantly degraded. Thus, the solder balls
<Desc/Clms Page number 5>
3, 13, when molten, tend to drop down and partially flow to"fill the gap"between a non-perfectly-flat surface of the screening can 1,11 and the PCB 2,12, thereby making the process of soldering less dependent on accurate process control. In this connection, it should be noted that the surface tension of the molten solder prevents the solder from simply flowing away from the screening can 1, 11 and along the ground track 4,14 of the PCB 2, 12.
It should also be noted that there is no electrical requirement for the screening can to PCB joint to be continuous, as long as the maximum length of gap is less than a predetermined proportion (typically 5 to 10%) of the wavelength of the highest frequency to be screened. It would also be possible to connect the solder balls 3, 13 to a ground layer formed within the PCB 2,12 via multiple low impedance vias or other equivalent mechanisms. However, whether the solder balls 3,13 are connected to a ground track 4,14 or to a nearby ground layer, the continuity and low impedance of the ground connection between the screening can 1, 11 and the PCB 2,12 via the solder balls 3, 13 is important if EMC performance is to be maintained.
It should also be noted that the use of solder paste (and flux) and solder resist is essential only in certain screening can/PCB configurations, and that the use of solder paste, flux and resist is often unnecessary.
Claims (22)
- Claims 1. A method of fixing a mechanical part to a printed circuit board, the method comprising the steps of :- a) fixing a plurality of discrete solder pieces to either the printed circuit board or to that portion of the mechanical part to be fixed to the printed circuit board; b) placing the mechanical part against the printed circuit board in the desired position with the solder pieces in contact with the printed circuit board and said portion of the mechanical part; c) heating the solder pieces to soften the solder sufficiently for it to flow whilst maintaining the discrete nature of the solder pieces; and d) allowing the solder to harden, thereby fixing the mechanical part to the printed circuit board.
- 2. A method as claimed in claim 1, wherein solder balls constitute the solder pieces.
- 3. A method as claimed in claim 1, wherein solder columns or other pre-formed shapes constitute the solder pieces.
- 4. A method as claimed in any one of claims 1 to 3, wherein the solder pieces are fixed to said portion of the mechanical part; and the mechanical part is then placed on the printed circuit board in the desired position.
- 5. A method as claimed in claim 4, wherein the solder pieces are substantially equispaced along an edge surface of the mechanical part.
- 6. A method as claimed in claim 5. wherein the solder pieces are spaced apart by distances lying within the range of from 1 mm to 5mm.
- 7. A method as claimed in claim 5 or claim 6, wherein the edge surface is formed on an in-turned or out-turned flange of the mechanical part.<Desc/Clms Page number 7>
- 8. A method as claimed in claim 5 or claim 6, wherein the edge surface is constituted by the co-planar surfaces of a plurality of in-turned or out-turned tabs formed on the mechanical part, a respective solder piece being associated with each of the tabs.
- 9. A method as claimed in any one of claims 5 to 8, further comprising the step of applying solder paste to each region of the edge surface of the mechanical part to which a solder piece is to fixed, prior to placing the discrete solder pieces in position.
- 10. A method as claimed in claim 9 when appendant to claim 7, further comprising the step of applying solder resist to those portions of the edge surface between said regions.
- 11. A method as claimed in claim 5 or claim 6, wherein the edge surface is formed with a plurality of detents for locating the solder pieces.
- 12. A method as claimed in any one of claims 4 to 11, wherein the solder pieces are positioned on, and soldered to, said portion of the mechanical part with said portion uppermost.
- 13. A method as claimed in claim 12, wherein step c) is carried out with the mechanical part on top of the printed circuit board, and with the solder pieces facing downwardly.
- 14. A method as claimed in any one of claims 4 to 13, wherein the mechanical part is placed on the printed circuit board with the solder pieces in contact with a ground track provided on the surface of the printed circuit board.
- 15. A method as claimed in any one of claims 4 to 13, wherein the mechanical part is placed on the printed circuit board with the solder pieces in contact with respective vias connected to a ground layer formed within the printed circuit board.<Desc/Clms Page number 8>
- 16. A printed circuit board provided with a mechanical part, the mechanical part fixed to the printed circuit board and being fixed to the printed circuit board by means of a plurality of discrete solder pieces fixed to the printed circuit board and fixed to the printed circuit board and positioned along, and fixed to, an edge surface of the mechanical part, the solder pieces having been subjected to heat so as to soften the solder sufficiently for it to flow whilst maintaining the discrete nature of the solder pieces.
- 17. A printed circuit board as claimed in claim 16, wherein solder balls constitute the solder pieces.
- 18. A printed circuit board as claimed in claim 16, wherein solder columns or other pre- formed shapes constitute the solder pieces.
- 19. A printed circuit board as claimed in any one of claims 16 to 18, wherein the solder pieces are substantially equispaced along the edge surface of the mechanical part.
- 20. A printed circuit board as claimed in any one of claims 16 to 19, wherein the edge surface is formed on an in-turned or out-turned flange of the mechanical part.
- 21. A printed circuit board as claimed in any one of claims 16 to 20, wherein the edge surface is constituted by the co-planar surfaces of a plurality of in-turned or out-turned tabs formed on the mechanical part, a respective solder piece being associated with each of the tabs.
- 22. A printed circuit board as claimed in any one of claims 16 to 21, wherein a screening can constitutes the mechanical part.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB0118056A GB2378042A (en) | 2001-07-24 | 2001-07-24 | Fixing mechanical parts to PCBs |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB0118056A GB2378042A (en) | 2001-07-24 | 2001-07-24 | Fixing mechanical parts to PCBs |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| GB0118056D0 GB0118056D0 (en) | 2001-09-19 |
| GB2378042A true GB2378042A (en) | 2003-01-29 |
Family
ID=9919111
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB0118056A Withdrawn GB2378042A (en) | 2001-07-24 | 2001-07-24 | Fixing mechanical parts to PCBs |
Country Status (1)
| Country | Link |
|---|---|
| GB (1) | GB2378042A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1445999A1 (en) * | 2003-02-07 | 2004-08-11 | Sony Ericsson Mobile Communications AB | A method of providing a PWB with a shield can and a PWB therefor |
| EP2230892A1 (en) * | 2009-03-18 | 2010-09-22 | Alcatel Lucent | Electro-magnetic sealing with solder bump array gasket on printed circuit board |
| FR2966320A1 (en) * | 2011-03-24 | 2012-04-20 | Continental Automotive France | Electronic system, has case including two rigid electrically conducting half-shells, and printed circuit board clamped between half-shells, where printed circuit board includes ground track surfaces overlapping with contours of half-shells |
| CN112020907A (en) * | 2018-06-15 | 2020-12-01 | 惠普发展公司，有限责任合伙企业 | Circuit board assembly |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1994018707A1 (en) * | 1993-02-04 | 1994-08-18 | Motorola, Inc. | Thermally conductive integrated circuit package with radio frequency shielding |
| EP1037236A2 (en) * | 1999-03-12 | 2000-09-20 | Kearney-National, Inc. | Electromechanical switching device package with controlled impedance environment |
| JP2000307231A (en) * | 1999-02-18 | 2000-11-02 | Murata Mfg Co Ltd | Electronic part and manufacture thereof |
| EP1089336A2 (en) * | 1999-09-22 | 2001-04-04 | Lucent Technologies Inc. | Integrated circuit packages with improved EMI characteristics |
| EP1094547A2 (en) * | 1999-10-19 | 2001-04-25 | Berg Electronics Manufacturing B.V. | Electrical connector with strain relief |
-
2001
- 2001-07-24 GB GB0118056A patent/GB2378042A/en not_active Withdrawn
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1994018707A1 (en) * | 1993-02-04 | 1994-08-18 | Motorola, Inc. | Thermally conductive integrated circuit package with radio frequency shielding |
| JP2000307231A (en) * | 1999-02-18 | 2000-11-02 | Murata Mfg Co Ltd | Electronic part and manufacture thereof |
| EP1037236A2 (en) * | 1999-03-12 | 2000-09-20 | Kearney-National, Inc. | Electromechanical switching device package with controlled impedance environment |
| EP1089336A2 (en) * | 1999-09-22 | 2001-04-04 | Lucent Technologies Inc. | Integrated circuit packages with improved EMI characteristics |
| EP1094547A2 (en) * | 1999-10-19 | 2001-04-25 | Berg Electronics Manufacturing B.V. | Electrical connector with strain relief |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1445999A1 (en) * | 2003-02-07 | 2004-08-11 | Sony Ericsson Mobile Communications AB | A method of providing a PWB with a shield can and a PWB therefor |
| EP2230892A1 (en) * | 2009-03-18 | 2010-09-22 | Alcatel Lucent | Electro-magnetic sealing with solder bump array gasket on printed circuit board |
| FR2966320A1 (en) * | 2011-03-24 | 2012-04-20 | Continental Automotive France | Electronic system, has case including two rigid electrically conducting half-shells, and printed circuit board clamped between half-shells, where printed circuit board includes ground track surfaces overlapping with contours of half-shells |
| CN112020907A (en) * | 2018-06-15 | 2020-12-01 | 惠普发展公司，有限责任合伙企业 | Circuit board assembly |
Also Published As
| Publication number | Publication date |
|---|---|
| GB0118056D0 (en) | 2001-09-19 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| WAP | Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1) |