GB0118056D0 - Fixing mechanical parts to PCBs - Google Patents
Fixing mechanical parts to PCBsInfo
- Publication number
- GB0118056D0 GB0118056D0 GBGB0118056.1A GB0118056A GB0118056D0 GB 0118056 D0 GB0118056 D0 GB 0118056D0 GB 0118056 A GB0118056 A GB 0118056A GB 0118056 D0 GB0118056 D0 GB 0118056D0
- Authority
- GB
- United Kingdom
- Prior art keywords
- pcbs
- mechanical parts
- fixing mechanical
- fixing
- parts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 150000003071 polychlorinated biphenyls Chemical class 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/002—Casings with localised screening
- H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
- H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
- H05K9/0026—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields integrally formed from metal sheet
- H05K9/0028—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields integrally formed from metal sheet with retainers or specific soldering features
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10371—Shields or metal cases
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
- H05K2203/041—Solder preforms in the shape of solder balls
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
- H05K2203/0415—Small preforms other than balls, e.g. discs, cylinders or pillars
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB0118056A GB2378042A (en) | 2001-07-24 | 2001-07-24 | Fixing mechanical parts to PCBs |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB0118056A GB2378042A (en) | 2001-07-24 | 2001-07-24 | Fixing mechanical parts to PCBs |
Publications (2)
Publication Number | Publication Date |
---|---|
GB0118056D0 true GB0118056D0 (en) | 2001-09-19 |
GB2378042A GB2378042A (en) | 2003-01-29 |
Family
ID=9919111
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB0118056A Withdrawn GB2378042A (en) | 2001-07-24 | 2001-07-24 | Fixing mechanical parts to PCBs |
Country Status (1)
Country | Link |
---|---|
GB (1) | GB2378042A (en) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1445999B1 (en) * | 2003-02-07 | 2007-10-03 | Sony Ericsson Mobile Communications AB | A method of providing a PWB with a shield can and a PWB therefor |
EP2230892B1 (en) * | 2009-03-18 | 2012-12-05 | Alcatel Lucent | Electro-magnetic sealing with solder bump array gasket on printed circuit board |
FR2966320A1 (en) * | 2011-03-24 | 2012-04-20 | Continental Automotive France | Electronic system, has case including two rigid electrically conducting half-shells, and printed circuit board clamped between half-shells, where printed circuit board includes ground track surfaces overlapping with contours of half-shells |
WO2019240822A1 (en) * | 2018-06-15 | 2019-12-19 | Hewlett-Packard Development Company, L.P. | Circuit board assemblies |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5371404A (en) * | 1993-02-04 | 1994-12-06 | Motorola, Inc. | Thermally conductive integrated circuit package with radio frequency shielding |
JP3714088B2 (en) * | 1999-02-18 | 2005-11-09 | 株式会社村田製作所 | Electronic component and manufacturing method thereof |
US6025768A (en) * | 1999-03-12 | 2000-02-15 | Kearny-National, Inc. | Electromechanical switching device package with controlled impedance environment |
US6297551B1 (en) * | 1999-09-22 | 2001-10-02 | Agere Systems Guardian Corp. | Integrated circuit packages with improved EMI characteristics |
TW531948B (en) * | 1999-10-19 | 2003-05-11 | Fci Sa | Electrical connector with strain relief |
-
2001
- 2001-07-24 GB GB0118056A patent/GB2378042A/en not_active Withdrawn
Also Published As
Publication number | Publication date |
---|---|
GB2378042A (en) | 2003-01-29 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
WAP | Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1) |