JPS6415667A - Chip test ring - Google Patents
Chip test ringInfo
- Publication number
- JPS6415667A JPS6415667A JP62171418A JP17141887A JPS6415667A JP S6415667 A JPS6415667 A JP S6415667A JP 62171418 A JP62171418 A JP 62171418A JP 17141887 A JP17141887 A JP 17141887A JP S6415667 A JPS6415667 A JP S6415667A
- Authority
- JP
- Japan
- Prior art keywords
- electrodes
- solder
- test ring
- wiring board
- printed wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/225—Correcting or repairing of printed circuits
Abstract
PURPOSE:To mount a printed wiring board only by the single surface thereof without opening a hole thereto and further providing an adsorbing surface thereto, by providing an electrode with solder possible in planar mounting. CONSTITUTION:This test ring is constituted of electrodes 1a with solder, test ring electrodes 1b, an adsorbing surface 1c and a conductive material having good conductivity and, by soldering the electrodes 1a with solder to a circuit of potential to be measured as shown by numerals 5, a test post can be provided without opening a hole to a printed wiring board 3. Further, since the electrodes 1a with solder, the test ring electrodes 1b and the adsorbing surface 1c are integrally constituted and no fall at the time of mounting is generated, planning enhancing the mounting density of parts can be performed. Further, since the insulating strips 2 present between the left and right electrodes 1a with solder insulate a chip test ring 1 from the copper foil 4 of the printed wiring board, if this test ring is utilized so as to be also used as a chip jumper in combination, the number of parts can be reduced.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62171418A JPS6415667A (en) | 1987-07-09 | 1987-07-09 | Chip test ring |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62171418A JPS6415667A (en) | 1987-07-09 | 1987-07-09 | Chip test ring |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6415667A true JPS6415667A (en) | 1989-01-19 |
Family
ID=15922766
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62171418A Pending JPS6415667A (en) | 1987-07-09 | 1987-07-09 | Chip test ring |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6415667A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102590561A (en) * | 2012-02-06 | 2012-07-18 | 山东建筑大学 | Power detecting electrode of laser diode chip |
-
1987
- 1987-07-09 JP JP62171418A patent/JPS6415667A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102590561A (en) * | 2012-02-06 | 2012-07-18 | 山东建筑大学 | Power detecting electrode of laser diode chip |
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