WO2015135130A1 - 一种干簧管继电器 - Google Patents

一种干簧管继电器 Download PDF

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Publication number
WO2015135130A1
WO2015135130A1 PCT/CN2014/073201 CN2014073201W WO2015135130A1 WO 2015135130 A1 WO2015135130 A1 WO 2015135130A1 CN 2014073201 W CN2014073201 W CN 2014073201W WO 2015135130 A1 WO2015135130 A1 WO 2015135130A1
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WO
WIPO (PCT)
Prior art keywords
reed switch
pcb base
base
switch relay
relay according
Prior art date
Application number
PCT/CN2014/073201
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English (en)
French (fr)
Inventor
龚蜀刚
Original Assignee
深圳市智优电池集成技术有限公司
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Filing date
Publication date
Application filed by 深圳市智优电池集成技术有限公司 filed Critical 深圳市智优电池集成技术有限公司
Priority to PCT/CN2014/073201 priority Critical patent/WO2015135130A1/zh
Priority to US15/125,123 priority patent/US10026575B2/en
Priority to KR1020167025020A priority patent/KR101972592B1/ko
Priority to EP14885668.5A priority patent/EP3118881A4/en
Priority to JP2016556943A priority patent/JP6392368B2/ja
Priority to CN201480076948.3A priority patent/CN106104739B/zh
Publication of WO2015135130A1 publication Critical patent/WO2015135130A1/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H51/00—Electromagnetic relays
    • H01H51/28—Relays having both armature and contacts within a sealed casing outside which the operating coil is located, e.g. contact carried by a magnetic leaf spring or reed
    • H01H51/281—Mounting of the relay; Encapsulating; Details of connections
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H50/00—Details of electromagnetic relays
    • H01H50/02—Bases; Casings; Covers
    • H01H50/04—Mounting complete relay or separate parts of relay on a base or inside a case
    • H01H50/047—Details concerning mounting a relays
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H1/00—Contacts
    • H01H1/58—Electric connections to or between contacts; Terminals
    • H01H1/5805—Connections to printed circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H50/00—Details of electromagnetic relays
    • H01H50/02—Bases; Casings; Covers
    • H01H50/04—Mounting complete relay or separate parts of relay on a base or inside a case
    • H01H50/041—Details concerning assembly of relays
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H50/00—Details of electromagnetic relays
    • H01H50/10—Electromagnetic or electrostatic shielding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/0017—Casings, cabinets or drawers for electric apparatus with operator interface units
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/02—Details
    • H05K5/0217—Mechanical details of casings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/1003—Non-printed inductor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10053—Switch
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10196—Variable component, e.g. variable resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10219—Thermoelectric component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Definitions

  • the present invention relates to the technical field of electronic control devices, and more particularly to a reed switch relay.
  • the relay can control a large current with a small current, control a high voltage with a low voltage, control the alternating current with a direct current, and can isolate the control circuit from the controlled circuit.
  • Control, remote control, and protection circuits are widely used.
  • the conventional electromagnetic relay is an electrical relay that operates by the suction force generated between the electromagnet core and the armature by using the current in the input circuit.
  • the relay is large in size, slow in operation, and has limited reliability and longevity.
  • reed switch relay can meet the needs of this development in many aspects.
  • the so-called reed switch relay is to put a reed switch in the coil to get a reed switch.
  • reed switch relays are in-line reed switch relays. In production, they are first assembled through the skeleton and then plastically sealed, and the assembly process is basically done manually, which is not conducive to mass production, although the assembly process can also Production by machine, however, this requires secondary processing of the reed switch, which makes it difficult to guarantee the position tolerance and accuracy of the reed pipe, which leads to the mechanization of the next process, which greatly reduces the production efficiency. Meet the requirements of large-scale production.
  • the object of the present invention is to provide a reed switch relay, which aims to solve the problem that the conventional reed switch relay exists in the prior art, and the assembly process is not fully mechanized due to the assembly of the skeleton structure, thereby reducing product precision, and Reduced the drawbacks of production efficiency.
  • the technical solution provided by the present invention is a reed switch relay, comprising a PCB base, and a control component electrically connected to the PCB base, the control component being mounted on the PCB base by a surface packaging process
  • the control component includes an air-core coil mounted on the PCB base, a reed switch installed in the air-core coil, and a shielding layer sleeved on an outer peripheral surface of the air-core coil, the trunk
  • the spring tube has a lead, and the shielding layer is electrically connected to the pin of the reed switch.
  • a pad is fixed on the PCB base, and the control component is soldered and fixed to the pad, and is electrically connected.
  • the PCB base is provided with a pair of probes for collecting voltage, and the bottom end of the probe is soldered and fixed to the PCB base, and forms an electrical connection.
  • a side edge of the PCB base is provided with a thermistor for collecting temperature, and a bottom end of the thermistor is soldered and fixed to the PCB base, and an electrical connection is formed.
  • the PCB base is provided with an insulating and heat-conductive molding body covering the control component.
  • the molding body includes a base fixed on the PCB base, and a truncated cone disposed on the base, and one side of the molding body is provided with a groove extending through the upper and lower sides.
  • the lower bottom surface of the truncated cone is connected to the base, and the molding body is integrally injection molded.
  • the probe passes through the PCB base and the base.
  • solder ball for soldering and electrical connection is disposed on the back surface of the PCB base.
  • a through hole is defined in the PCB base, and the control component is received in the through hole.
  • the reed switch relay provided by the invention assembles the control component and the PCB base through a surface encapsulation process, thereby ensuring the position tolerance and precision of the reed switch, realizing the full mechanization of the production of the product, and improving The production efficiency meets the needs of large-scale production, thereby improving economic efficiency.
  • FIG. 1 is a top plan view of a reed switch relay according to an embodiment of the present invention
  • Figure 2 is a cross-sectional view taken along the line A-A of Figure 1;
  • Figure 3 is a cross-sectional view taken along the line B-B of Figure 1.
  • the reed switch relay in this embodiment is used on a power battery pack.
  • the reed switch relay can also be used. On other devices.
  • the reed switch relay provided in this embodiment includes a high temperature resistant PCB base 1 and a control component 2, and the control component 2 is fixedly connected and electrically connected to the PCB base 1.
  • the control component 2 adopts SMT.
  • the technology is mounted on the surface of the PCB base 1, where the SMT is a surface encapsulation process; specifically, the control assembly 2 includes an air-core coil 21, a reed switch 22, and a shield layer 23, wherein the air-core coil 21 is fixed and electrically connected
  • the reed switch 22 is built in the ring of the air-core coil 21.
  • a pair of parallel normally-opening reed pipes 22 are arranged in the ring of the air-core coil 21, and the reed switch is according to actual needs. 22 can also select a normally open and a normally closed type, the reed switch 22 has pins at both ends, and the pins at both ends of the reed switch 22 are electrically connected with the PCB base 1 to form an electrical connection, and in addition, in the air-core coil 21
  • the outer peripheral surface is also covered with a shielding layer 23 for shielding the magnetic field, the shielding layer 23 is a metal foil adapted to the outer shape of the air-core coil 21, and the shielding layer 23 is electrically connected to the pins on the reed switch 22. .
  • the above reed switch relay is applied to a power battery pack and has the following features:
  • the PCB base 1 and the control component 2 are separately designed, and a surface encapsulation process, that is, an SMT process, is adopted, by which the control component 2 and the PCB base 1 are patch-mounted, thereby ensuring the positional tolerance of the reed switch. And precision, but also achieve the full mechanization of product production, improve production efficiency, meet the needs of large-scale production, and thus improve economic efficiency.
  • the surface of the PCB base 1 is provided with a pad, and the control component 2 is soldered to the pad to form a fixed connection and form an electrical connection. Specifically, the pin and the solder of each component in the control component 2 are soldered.
  • a probe 3 is protruded from each of the two ends of the PCB base 1.
  • the two probes 3 are used to collect the voltage on the power battery pack.
  • the probe 3 uses a solder paste to pass through the reflow furnace.
  • the method is fixed and electrically connected to the PCB base 1 .
  • the probe 3 can be fixedly and electrically connected to the PCB base 1 according to actual conditions and needs. It is one of the preferred modes and is not limited.
  • the one side edge of the PCB base 1 protrudes upward with a thermistor 4, that is, NTC.
  • the temperature range of the thermistor 4 is -50 ° C to +120 ° C.
  • the heat is applied.
  • the function of the resistor 4 is to collect and detect the temperature on the power battery pack and the temperature on the reed switch; structurally, the bottom end of the thermistor 4 is soldered to the PCB base 1 and formed into electricity.
  • sexual connections of course, in other embodiments, other electronic components can be used to collect and detect the temperature on the power battery pack and the reed switch.
  • the PCB base 1 is further provided with a molding body 5, and the molding body 5 covers the control component 2, and the assembled control component 2 and the PCB base 1 are packaged during the production process. Then, the packaged relay is integrally encapsulated.
  • the material used for the plastic sealing is epoxy resin, that is, the material of the plastic sealing body 5 is epoxy resin, which has the characteristics of insulation and heat conduction.
  • other insulating and heat conductive materials can also be used for plastic sealing.
  • the molding body 5 includes a base 51 and a truncated cone 52.
  • the base 51 molds the control unit 2 on the PCB base 1, and the truncated cone 52 extends vertically from the center of the upper surface of the base 51.
  • a groove 53 for accommodating the thermistor 4 is disposed on one side of the molded body 5, and the groove 53 extends through the outer wall of the base 51 and the truncated cone 52.
  • the reed switch is applied to the power battery pack, and the truncated cone 52 serves to strengthen the contact strength between the positive electrode and the negative electrode of the power battery pack, and the overall structure of the plastic seal 5 also compensates.
  • the air-core coil 21 adopts a high-temperature enameled wire of a hot air type of 0.05 mm or less.
  • the enameled wire is wound into a hollow coil according to the size of the reed pipe 22, and the hollow coil is placed over the coil.
  • the shielding layer 23 of the metal foil is applied to the outside of the coil through the insulation treatment; the control unit 2 is covered with the plastic sealing body 5, thereby effectively preventing the The enamel wire on the air-core coil 21 is broken and the reed switch 22 is broken.
  • the upper bottom surface of the truncated cone 52 is smaller than the lower bottom area, and the lower bottom is connected to the base 51.
  • the structural design makes the truncated cone 52 and the power battery pack interlock, thereby achieving a fastening connection.
  • the base 51 and the truncated cone 52 are integrally injection molded, and the molded body 5 is formed by the process.
  • the base 51 and the truncated cone 52 may be fabricated in other forms.
  • the base 51 of the molding body 5 partially covers the probe 3, and the outer end of the probe 3 emerges from the base 51.
  • the surface is such that the probe 3 is electrically connected to the power battery pack to collect and detect the voltage thereon.
  • the PCB base 1 is provided with a through hole 11 for receiving the control component 2; the back surface of the PCB base 1 is a BGA process, that is, a ball grid array packaging process, and is provided for Solder fixed and electrically connected solder balls.
  • the wire diameter of the air-core coil 21 in the reed switch relay is relatively small, in the electric welding technology of the wire and the pin hardware, the process of the paint-removing welding is adopted to ensure the welding of the enameled wire and the pin.
  • the product space has been reduced, and two-way on-off function has been realized in a limited space.

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  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Thermally Actuated Switches (AREA)

Abstract

一种干簧管继电器，包括PCB基座（1），以及与PCB基座电性连接的控制组件（2），控制组件通过表面封装工艺贴装于PCB基座上，控制组件包括装设于PCB基座上的空心线圈（21），装设于空心线圈内的干簧管（22），以及套设于空心线圈外周表面的屏蔽层（23），干簧管上具有引脚，屏蔽层与干簧管的引脚电性连接。该干簧管继电器，通过表面封装工艺将控制组件与PCB基座进行组装，保证了干簧管的位置公差和精度，实现了产品生产的全机械化，提高了生产效率，满足了大规模生产的需要，进而提高了经济效益。

Description

一种干簧管继电器 技术领域
本发明涉及电子控制器件的技术领域，尤其涉及一种干簧管继电器。
 背景技术
继电器作为一种常用的控制组件，可以用较小的电流来控制较大的电流，用低电压来控制高电压，用直流电来控制交流电，并可实现控制电路与被控制电路的隔离，在自动控制、遥控、保护电路等方面得到广泛的应用。传统的电磁继电器是利用输入电路内电流而在电磁铁铁芯与衔铁间产生的吸力作用而工作的一种电气继电器，这种继电器体积大、动作慢、可靠性和寿命很有限。
　　随着电子电器向小型化、微型化方向发展，对继电器提出了新的要求，干簧管继电器作为一种新型继电器，在很多方面可满足这种发展的需要。所谓干簧管继电器，就是把干簧管放在线圈里，便可以得到一个干簧管继电器。
　　目前的干簧管继电器大多是直插式干簧管继电器，在生产中，先是通过骨架进行组装，然后进行塑封，而组装过程基本通过人工完成，十分不利于大规模生产，虽然组装过程也可以通过机器进行生产，但是，这样就需要对干簧管进行二次加工，就造成了干簧管的位置公差和精度难以保证，从而导致了下一工序无法机械化生产，大大降低了生产效率，无法满足大规模生产的要求。
 技术问题
本发明的目的在于提供一种干簧管继电器，旨在解决现有技术中，普通的干簧管继电器存在，因采用骨架结构进行组装而导致生产工序无法完全机械化，从而降低了产品精度，以及降低了生产效率的缺陷。
技术解决方案
本发明提供的技术方案是，一种干簧管继电器，包括PCB基座，以及与所述PCB基座电性连接的控制组件，所述控制组件通过表面封装工艺贴装于所述PCB基座上，所述控制组件包括装设于所述PCB基座上的空心线圈，装设于所述空心线圈内的干簧管，以及套设于所述空心线圈外周表面的屏蔽层，所述干簧管上具有引脚，所述屏蔽层与所述干簧管的引脚电性连接。
　　具体地，所述PCB基座上固设有焊盘，所述控制组件与所述焊盘焊接固定，并形成电性连接。
　　优选地，所述PCB基座上设有一对用于采集电压的探针，所述探针的底端与所述PCB基座焊接固定，并形成电性连接。
　　进一步地，所述PCB基座的一侧边沿设有用于采集温度的热敏电阻，所述热敏电阻的底端与所述PCB基座焊接固定，并形成电性连接。
　　更进一步地，所述PCB基座上设置有包覆所述控制组件的绝缘且导热的塑封体。
再进一步地，所述塑封体包括固设于所述PCB基座上的底座，以及设于所述底座上的圆锥台，所述塑封体的一侧开设有贯穿上下的凹槽。
　　优选地，所述圆锥台的下底面与所述底座连接，且所述塑封体采用一体注塑成型。
　　进一步地，所述探针穿设所述PCB基座以及所述底座。
　　进一步地，所述PCB基座的背面设置有用于焊接固定和电性连接的锡球。
　　具体地，所述PCB基座上开设有通孔，所述控制组件容置于所述通孔中。
 有益效果
与现有技术相比，本发明提供的干簧管继电器，通过表面封装工艺将控制组件与PCB基座进行组装，保证了干簧管的位置公差和精度，实现了产品生产的全机械化，提高了生产效率，满足了大规模生产的需要，进而提高了经济效益。
 附图说明
图1为本发明实施例提供的干簧管继电器的俯视示意图；
　　图2为图1中A-A剖切方向的剖切示意图；
　　图3为图1中B-B剖切方向的剖切示意图。
 本发明的实施方式
为了使本发明的目的、技术方案及优点更加清楚明白，以下结合附图及实施例，对本发明进行进一步详细说明。应当理解，此处所描述的具体实施例仅仅用以解释本发明，并不用于限定本发明。
　　以下结合具体实施例对本发明的实现进行详细的描述。
　　如图1~3所示，为本发明提供的一个较佳实施例，本实施例中的干簧管继电器用于动力电池组上，当然，在其他实施例中，干簧管继电器也可以运用于其他装置上。
　　本实施例提供的干簧管继电器，其包括耐高温的PCB基座1以及控制组件2，该控制组件2与PCB基座1固定连接且电性连接，本实施例中，控制组件2采用SMT技术贴装在PCB基座1的表面，此处，SMT即表面封装工艺；具体地，控制组件2包括空心线圈21、干簧管22和屏蔽层23，其中，空心线圈21固定并电性连接在PCB基座1上，干簧管22则内置在空心线圈21的圈内，此处，空心线圈21的圈内设置有一对并联的常开型干簧管22，根据实际需求，干簧管22也可以选用一常开一常闭型，干簧管22的两端具有引脚，该干簧管22两端的引脚均与PCB基座1焊接形成电性连接，另外，在空心线圈21的外周表面还包覆有一层用于屏蔽磁场的屏蔽层23，该屏蔽层23为与空心线圈21外形适配的金属箔，且该屏蔽层23与干簧管22上的引脚电性连接。
　　上述干簧管继电器应用于动力电池组上，具有如下特点：
　　将PCB基座1和控制组件2单独设计，并采用了表面封装工艺，即SMT工艺，通过该工艺将控制组件2与PCB基座1进行贴片式组装，既保证了干簧管的位置公差和精度，也实现了产品生产的全机械化，提高了生产效率，满足了大规模生产的需要，进而提高了经济效益。
　　本实施例中，上述PCB基座1的表面上设置有焊盘，上述控制组件2与焊盘焊接形成固定并形成电性连接，具体地，控制组件2内各个组件的引脚与焊
盘焊接。
　　上述PCB基座1的两端上各伸出有一探针3，这两根探针3用于采集动力电池组上的电压，本实施例中，探针3采用点锡膏过回流炉的工艺方式与PCB基座1焊接固定并形成电性连接，当然，在其他实施例中，根据实际情况和需要，也可以采用其他方式将探针3与PCB基座1固定以及电性连接，上述方式属于优选方式之一，并不作限定。
　　上述PCB基座1的一侧边沿向上伸出有热敏电阻4，即NTC，此处，该热敏电阻4的检测温度范围是-50℃~+120℃，在本实施例中，热敏电阻4的作用是，用于采集和检测动力电池组上的温度，以及干簧管继电器上的温度；在结构上，该热敏电阻4的底端与PCB基座1焊接固定，并形成电性连接，当然，在其他实施例中，也可以采用其他的电子元件进行采集和检测动力电池组和干簧管继电器上的温度。
　　本实施例中，上述PCB基座1上还设置有塑封体5，该塑封体5将上述控制组件2包覆，在生产过程中，将组装好的控制组件2与PCB基座1进行封装，接着将封装好的继电器整体进行塑封，此处，塑封时采用的材料是环氧树脂，即塑封体5的材料为环氧树脂，其具有绝缘导热的特性，当然，在其他实施例中，根据实际需求，也可以采用其他绝缘导热的材料进行塑封。
　　上述塑封体5包括底座51以及圆锥台52，其中，该底座51将上述控制组件2塑封于PCB基座1上，而圆锥台52则由底座51的上表面中心位置向外垂直伸出，另外，在塑封体5的一侧开设有用于容置上述热敏电阻4的凹槽53，该凹槽53贯穿底座51和圆锥台52的外壁。
　　本实施例中，干簧管继电器应用在动力电池组上，上述圆锥台52既起到了加固动力电池组正极以及负极的连接件接触强度的作用，同时，塑封体5的整体结构还起到了补偿动力电池组负极与负极件之间间隙的作用。
　　另外，空心线圈21采用的是热风型0.05mm以下的高温漆包线，制作控制组件2的过程中，会根据干簧管22的尺寸将漆包线绕制呈空心状的线圈，并将空心的线圈套在干簧管22上，为了避免线圈工作时产生的磁场外泄产生干扰，在线圈的外面经过绝缘处理加装金属箔的屏蔽层23；采用塑封体5包覆控制组件2，从而有效地防止了空心线圈21上的漆包线断裂以及干簧管22破裂。
　　上述圆锥台52的上底面积小于下底面积，其下底与底座51连接，这样的结构设计使圆锥台52与动力电池组实现了互锁，进而实现了紧固连接，本实施例中，底座51和圆锥台52采用了一体注塑成型工艺，通过该工艺形成了塑封体5，当然，在其他实施例中，底座51和圆锥台52也可以采用其他形式的制作工艺。
　　由于上述探针3从上述PCB基座1两端向外垂直伸出，而在塑封后，塑封体5的底座51将探针3局部包覆，探针3的外端冒出于底座51上表面，这样便于探针3电性连接动力电池组以采集和检测其上的电压。
　　本实施例中，上述PCB基座1上开设有通孔11，该通孔11用于容置上述控制组件2；PCB基座1的背面采用BGA工艺，即球栅阵列封装工艺，设置有用于焊接固定和电性连接的锡球。
　　另外，在本实施例中，由于干簧管继电器中的空心线圈21的线径比较小，在导线与引脚五金的电焊技术上，采用了退漆焊的工艺确保漆包线与引脚的焊接，缩小了产品空间，在有限的空间内实现了两路通断功能。
　　上所述仅为本发明的较佳实施例而已，并不用以限制本发明，凡在本发明的精神和原则之内所作的任何修改、等同替换和改进等，均应包含在本发明的保护范围之内。

Claims (10)

  1. 一种干簧管继电器，其特征在于，包括PCB基座，以及与所述PCB基座电性连接的控制组件，所述控制组件通过表面封装工艺贴装于所述PCB基座上，所述控制组件包括装设于所述PCB基座上的空心线圈，装设于所述空心线圈内的干簧管，以及套设于所述空心线圈外周表面的屏蔽层，所述干簧管上具有引脚，所述屏蔽层与所述干簧管的引脚电性连接。
  2. 如权利要求1所述的干簧管继电器，其特征在于，所述PCB基座上固设有焊盘，所述控制组件与所述焊盘焊接固定，并形成电性连接。
  3. 如权利要求2所述的干簧管继电器，其特征在于，所述PCB基座上设有一对用于采集电压的探针，所述探针的底端与所述PCB基座焊接固定，并形成电性连接。
  4. 如权利要求3所述的干簧管继电器，其特征在于，所述PCB基座的一侧边沿设有用于采集温度的热敏电阻，所述热敏电阻的底端与所述PCB基座焊接固定，并形成电性连接。
  5. 　　如权利要求4所述的干簧管继电器，其特征在于，所述PCB基座上设置有包覆所述控制组件的绝缘且导热的塑封体。
  6. 如权利要求5所述的干簧管继电器，其特征在于，所述塑封体包括固设于所述PCB基座上的底座，以及设于所述底座上的圆锥台，所述塑封体的一侧开设有贯穿上下的凹槽。
  7. 如权利要求6所述的干簧管继电器，其特征在于，所述圆锥台的下底面与所述底座连接，且所述塑封体采用一体注塑成型。
  8. 如权利要求6或7所述的干簧管继电器，其特征在于，所述探针穿设所述PCB基座以及所述底座。
  9. 如权利要求1~8任一项所述的干簧管继电器，其特征在于，所述PCB基座上开设有通孔，所述控制组件容置于所述通孔中。
  10. 如权利要求9所述的干簧管继电器，其特征在于，所述PCB基座的背面设置有用于焊接固定和电性连接的锡球。
PCT/CN2014/073201 2014-03-11 2014-03-11 一种干簧管继电器 WO2015135130A1 (zh)

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KR1020167025020A KR101972592B1 (ko) 2014-03-11 2014-03-11 리드 스위치 릴레이
EP14885668.5A EP3118881A4 (en) 2014-03-11 2014-03-11 Reed switch relay
JP2016556943A JP6392368B2 (ja) 2014-03-11 2014-03-11 リードスイッチリレー
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EP3118881A1 (en) 2017-01-18
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