HK1036687A1 - Liquid crystal display on silicon-on-sapphire and method for fabricating the same - Google Patents
Liquid crystal display on silicon-on-sapphire and method for fabricating the sameInfo
- Publication number
- HK1036687A1 HK1036687A1 HK01107292A HK01107292A HK1036687A1 HK 1036687 A1 HK1036687 A1 HK 1036687A1 HK 01107292 A HK01107292 A HK 01107292A HK 01107292 A HK01107292 A HK 01107292A HK 1036687 A1 HK1036687 A1 HK 1036687A1
- Authority
- HK
- Hong Kong
- Prior art keywords
- sapphire
- fabricating
- silicon
- liquid crystal
- crystal display
- Prior art date
Links
- 239000004973 liquid crystal related substance Substances 0.000 title 1
- 229910052594 sapphire Inorganic materials 0.000 title 1
- 239000010980 sapphire Substances 0.000 title 1
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66409—Unipolar field-effect transistors
- H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
- H01L29/66742—Thin film unipolar transistors
- H01L29/66772—Monocristalline silicon transistors on insulating substrates, e.g. quartz substrates
- H01L29/6678—Monocristalline silicon transistors on insulating substrates, e.g. quartz substrates on sapphire substrates, e.g. SOS transistors
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1345—Conductors connecting electrodes to cell terminals
- G02F1/13454—Drivers integrated on the active matrix substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
- H01L21/82—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
- H01L21/822—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being a semiconductor, using silicon technology
- H01L21/8232—Field-effect technology
- H01L21/8234—MIS technology, i.e. integration processes of field effect transistors of the conductor-insulator-semiconductor type
- H01L21/8238—Complementary field-effect transistors, e.g. CMOS
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
- H01L21/82—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
- H01L21/84—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being other than a semiconductor body, e.g. being an insulating body
- H01L21/86—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being other than a semiconductor body, e.g. being an insulating body the insulating body being sapphire, e.g. silicon on sapphire structure, i.e. SOS
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
- H01L29/78651—Silicon transistors
- H01L29/78654—Monocrystalline silicon transistors
- H01L29/78657—SOS transistors
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Nonlinear Science (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Ceramic Engineering (AREA)
- Mathematical Physics (AREA)
- Optics & Photonics (AREA)
- Liquid Crystal (AREA)
- Thin Film Transistor (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/047,813 US6190933B1 (en) | 1993-06-30 | 1998-03-25 | Ultra-high resolution liquid crystal display on silicon-on-sapphire |
PCT/US1999/006414 WO1999049503A1 (en) | 1998-03-25 | 1999-03-24 | Ultra-high resolution liquid crystal display on silicon-on-sapphire |
Publications (1)
Publication Number | Publication Date |
---|---|
HK1036687A1 true HK1036687A1 (en) | 2002-01-11 |
Family
ID=21951120
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK01107292A HK1036687A1 (en) | 1998-03-25 | 2001-10-18 | Liquid crystal display on silicon-on-sapphire and method for fabricating the same |
Country Status (8)
Country | Link |
---|---|
US (2) | US6190933B1 (zh) |
EP (1) | EP1068636A4 (zh) |
JP (1) | JP2002508588A (zh) |
KR (1) | KR100408324B1 (zh) |
CN (1) | CN1144262C (zh) |
CA (1) | CA2324357C (zh) |
HK (1) | HK1036687A1 (zh) |
WO (1) | WO1999049503A1 (zh) |
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US6312968B1 (en) * | 1993-06-30 | 2001-11-06 | The United States Of America As Represented By The Secretary Of The Navy | Method for fabricating an electrically addressable silicon-on-sapphire light valve |
US6954236B1 (en) | 1993-06-30 | 2005-10-11 | The United States Of America As Represented By The Secretary Of The Navy | Silicon-on-sapphire display with wireless interconnections and method of fabricating same |
US6521950B1 (en) * | 1993-06-30 | 2003-02-18 | The United States Of America As Represented By The Secretary Of The Navy | Ultra-high resolution liquid crystal display on silicon-on-sapphire |
US6954235B1 (en) | 1993-06-30 | 2005-10-11 | The United States Of America As Represented By The Secretary Of The Navy | Silicon-on-sapphire display apparatus and method of fabricating same |
US7131242B2 (en) * | 1995-03-07 | 2006-11-07 | Pergo (Europe) Ab | Flooring panel or wall panel and use thereof |
SE9500810D0 (sv) * | 1995-03-07 | 1995-03-07 | Perstorp Flooring Ab | Golvplatta |
KR100294637B1 (ko) * | 1998-06-29 | 2001-10-19 | 박종섭 | 모스펫의폴리사이드게이트형성방법 |
US7877956B2 (en) * | 1999-07-05 | 2011-02-01 | Pergo AG | Floor element with guiding means |
US6636191B2 (en) * | 2000-02-22 | 2003-10-21 | Eastman Kodak Company | Emissive display with improved persistence |
EP1130567B1 (de) | 2000-02-24 | 2005-11-16 | AEG Gesellschaft für moderne Informationssysteme mbH | LCD-Pixelmatrixelement und grafikfähige LCD-Anzeigetafel mit einer Mehrzahl von solchen LCD-Pixelmatrixelementen |
JP4118484B2 (ja) * | 2000-03-06 | 2008-07-16 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
JP2001257350A (ja) | 2000-03-08 | 2001-09-21 | Semiconductor Energy Lab Co Ltd | 半導体装置およびその作製方法 |
JP4118485B2 (ja) | 2000-03-13 | 2008-07-16 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
JP4700160B2 (ja) | 2000-03-13 | 2011-06-15 | 株式会社半導体エネルギー研究所 | 半導体装置 |
JP4683688B2 (ja) | 2000-03-16 | 2011-05-18 | 株式会社半導体エネルギー研究所 | 液晶表示装置の作製方法 |
JP4393662B2 (ja) | 2000-03-17 | 2010-01-06 | 株式会社半導体エネルギー研究所 | 液晶表示装置の作製方法 |
JP2001272671A (ja) * | 2000-03-24 | 2001-10-05 | Seiko Epson Corp | プロジェクタ |
SE518184C2 (sv) | 2000-03-31 | 2002-09-03 | Perstorp Flooring Ab | Golvbeläggningsmaterial innefattande skivformiga golvelement vilka sammanfogas med hjälp av sammankopplingsorgan |
US6900084B1 (en) * | 2000-05-09 | 2005-05-31 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device having a display device |
US6582980B2 (en) * | 2001-01-30 | 2003-06-24 | Eastman Kodak Company | System for integrating digital control with common substrate display devices |
JP4037117B2 (ja) * | 2001-02-06 | 2008-01-23 | 株式会社日立製作所 | 表示装置 |
CN100463225C (zh) * | 2001-02-06 | 2009-02-18 | 株式会社日立制作所 | 显示装置及其制造方法 |
US7071037B2 (en) * | 2001-03-06 | 2006-07-04 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and manufacturing method thereof |
DE10121177A1 (de) | 2001-04-30 | 2002-11-14 | Aeg Ges Moderne Inf Sys Mbh | LCD-Zelle |
KR100771905B1 (ko) * | 2001-09-27 | 2007-11-01 | 엘지.필립스 엘시디 주식회사 | 박막트랜지스터 액정 표시 소자의 구조 및 제조 방법 |
KR100675934B1 (ko) * | 2001-12-04 | 2007-02-01 | 비오이 하이디스 테크놀로지 주식회사 | 액정표시소자 |
KR100917323B1 (ko) * | 2002-10-30 | 2009-09-11 | 엘지디스플레이 주식회사 | 강유전성 액정표시장치와 그 구동방법 |
US7274413B1 (en) | 2002-12-06 | 2007-09-25 | United States Of America As Represented By The Secretary Of The Navy | Flexible video display apparatus and method |
US20040125093A1 (en) * | 2002-12-30 | 2004-07-01 | Serge Rutman | Micro-controller with integrated light modulator |
US7330550B1 (en) | 2003-02-19 | 2008-02-12 | The United States Of America As Represented By The Secretary Of The Navy | Cryptographic system and method that uses excitation spectroscopy |
JP2004273903A (ja) * | 2003-03-11 | 2004-09-30 | Renesas Technology Corp | 回路シミュレータおよびシミュレーションシステム |
KR100600853B1 (ko) * | 2003-11-17 | 2006-07-14 | 삼성에스디아이 주식회사 | 평판표시장치 및 그의 제조방법 |
TWI382264B (zh) * | 2004-07-27 | 2013-01-11 | Samsung Display Co Ltd | 薄膜電晶體陣列面板及包括此面板之顯示器裝置 |
US7480017B2 (en) * | 2004-09-17 | 2009-01-20 | Radiant Images, Inc. | Microdisplay |
KR101182771B1 (ko) * | 2005-09-23 | 2012-09-14 | 삼성전자주식회사 | 액정 표시 패널과 그의 구동 방법 및 그를 이용한 액정표시 장치 |
JP2008085095A (ja) * | 2006-09-28 | 2008-04-10 | Oki Electric Ind Co Ltd | 半導体デバイスの製造方法 |
US8304781B2 (en) * | 2007-08-24 | 2012-11-06 | Sharp Kabushiki Kaisha | Circuit board provided with monolithic circuit having thin film transistor on substrate, and display device having the circuit board |
DE102010004717A1 (de) | 2010-01-15 | 2011-07-21 | Pergo (Europe) Ab | Set aus Paneelen umfassend Halteprofile mit einem separaten Clip sowie Verfahren zum Einbringen des Clips |
CN102214555B (zh) * | 2010-04-09 | 2013-02-06 | 中国科学院微电子研究所 | 一种对蓝宝石晶片进行减薄的方法 |
EP2569493A1 (en) | 2010-05-10 | 2013-03-20 | Pergo (Europe) AB | Set of panels |
US10840322B2 (en) * | 2018-03-29 | 2020-11-17 | Texas Instruments Incorporated | Thin film resistor and top plate of capacitor sharing a layer |
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US4024626A (en) | 1974-12-09 | 1977-05-24 | Hughes Aircraft Company | Method of making integrated transistor matrix for flat panel liquid crystal display |
US4177084A (en) | 1978-06-09 | 1979-12-04 | Hewlett-Packard Company | Method for producing a low defect layer of silicon-on-sapphire wafer |
JPS5552219A (en) * | 1978-10-13 | 1980-04-16 | Fujitsu Ltd | Semiconductor wafer |
JPS5961818A (ja) | 1982-10-01 | 1984-04-09 | Seiko Epson Corp | 液晶表示装置 |
JPS61276484A (ja) | 1985-05-31 | 1986-12-06 | Citizen Watch Co Ltd | 液晶テレビ受信装置 |
US4682055A (en) * | 1986-03-17 | 1987-07-21 | Rca Corporation | CFET inverter having equal output signal rise and fall times by adjustment of the pull-up and pull-down transconductances |
US4816893A (en) * | 1987-02-24 | 1989-03-28 | Hughes Aircraft Company | Low leakage CMOS/insulator substrate devices and method of forming the same |
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US5245207A (en) * | 1989-04-21 | 1993-09-14 | Nobuo Mikoshiba | Integrated circuit |
US5024965A (en) * | 1990-02-16 | 1991-06-18 | Chang Chen Chi P | Manufacturing high speed low leakage radiation hardened CMOS/SOI devices |
JP2798769B2 (ja) * | 1990-02-22 | 1998-09-17 | 三洋電機株式会社 | 薄膜トランジスタの製造方法 |
JPH0442579A (ja) * | 1990-06-08 | 1992-02-13 | Seiko Epson Corp | 薄膜トランジスタ及び製造方法 |
US5750000A (en) * | 1990-08-03 | 1998-05-12 | Canon Kabushiki Kaisha | Semiconductor member, and process for preparing same and semiconductor device formed by use of same |
JP3277548B2 (ja) * | 1991-05-08 | 2002-04-22 | セイコーエプソン株式会社 | ディスプレイ基板 |
EP0530972B1 (en) * | 1991-08-02 | 1997-11-05 | Canon Kabushiki Kaisha | Liquid crystal image display unit |
JP2650543B2 (ja) * | 1991-11-25 | 1997-09-03 | カシオ計算機株式会社 | マトリクス回路駆動装置 |
JP3486426B2 (ja) * | 1993-01-18 | 2004-01-13 | キヤノン株式会社 | 半導体装置及び液晶表示装置 |
US5300443A (en) | 1993-06-30 | 1994-04-05 | The United States Of America As Represented By The Secretary Of The Navy | Method for fabricating complementary enhancement and depletion mode field effect transistors on a single substrate |
US5416043A (en) | 1993-07-12 | 1995-05-16 | Peregrine Semiconductor Corporation | Minimum charge FET fabricated on an ultrathin silicon on sapphire wafer |
US5572040A (en) * | 1993-07-12 | 1996-11-05 | Peregrine Semiconductor Corporation | High-frequency wireless communication system on a single ultrathin silicon on sapphire chip |
JPH07311392A (ja) * | 1994-03-24 | 1995-11-28 | Sharp Corp | 液晶表示装置 |
JP3223997B2 (ja) * | 1994-09-13 | 2001-10-29 | シャープ株式会社 | 論理回路及び液晶表示装置 |
KR100192447B1 (ko) * | 1996-05-15 | 1999-06-15 | 구자홍 | 액정표시장치의 제조방법 |
KR100244730B1 (ko) * | 1996-10-02 | 2000-02-15 | 구본준, 론 위라하디락사 | 액정표시소자 제조방법 |
US5937271A (en) * | 1997-05-23 | 1999-08-10 | Daewoo Electronics Co., Inc. | Method for manufacturing a thin film actuated mirror array |
-
1998
- 1998-03-25 US US09/047,813 patent/US6190933B1/en not_active Expired - Fee Related
-
1999
- 1999-03-24 WO PCT/US1999/006414 patent/WO1999049503A1/en active IP Right Grant
- 1999-03-24 KR KR10-2000-7010615A patent/KR100408324B1/ko not_active IP Right Cessation
- 1999-03-24 CN CNB998057436A patent/CN1144262C/zh not_active Expired - Fee Related
- 1999-03-24 JP JP2000538377A patent/JP2002508588A/ja active Pending
- 1999-03-24 CA CA002324357A patent/CA2324357C/en not_active Expired - Fee Related
- 1999-03-24 EP EP99914090A patent/EP1068636A4/en not_active Withdrawn
-
2000
- 2000-06-29 US US09/607,438 patent/US6365936B1/en not_active Expired - Lifetime
-
2001
- 2001-10-18 HK HK01107292A patent/HK1036687A1/xx not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
US6365936B1 (en) | 2002-04-02 |
US6190933B1 (en) | 2001-02-20 |
AU735461B2 (en) | 2001-07-12 |
JP2002508588A (ja) | 2002-03-19 |
CA2324357A1 (en) | 1999-09-30 |
WO1999049503A1 (en) | 1999-09-30 |
CA2324357C (en) | 2008-06-10 |
AU3201399A (en) | 1999-10-18 |
EP1068636A1 (en) | 2001-01-17 |
KR20010074459A (ko) | 2001-08-04 |
EP1068636A4 (en) | 2003-08-06 |
CN1144262C (zh) | 2004-03-31 |
CN1299515A (zh) | 2001-06-13 |
KR100408324B1 (ko) | 2003-12-06 |
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