HK1036185A1 - Printed circuit board and manufacturing process thereof. - Google Patents

Printed circuit board and manufacturing process thereof.

Info

Publication number
HK1036185A1
HK1036185A1 HK01106941A HK01106941A HK1036185A1 HK 1036185 A1 HK1036185 A1 HK 1036185A1 HK 01106941 A HK01106941 A HK 01106941A HK 01106941 A HK01106941 A HK 01106941A HK 1036185 A1 HK1036185 A1 HK 1036185A1
Authority
HK
Hong Kong
Prior art keywords
circuit board
printed circuit
manufacturing process
printed
manufacturing
Prior art date
Application number
HK01106941A
Other languages
English (en)
Inventor
Shigeru Mori
Yoshinori Ono
Original Assignee
Nec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nec Corp filed Critical Nec Corp
Publication of HK1036185A1 publication Critical patent/HK1036185A1/xx

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/024—Dielectric details, e.g. changing the dielectric material around a transmission line
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0183—Dielectric layers
    • H05K2201/0195—Dielectric or adhesive layers comprising a plurality of layers, e.g. in a multilayer structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49126—Assembling bases

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Structure Of Printed Boards (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
HK01106941A 1999-10-20 2001-10-03 Printed circuit board and manufacturing process thereof. HK1036185A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP29858899A JP3617388B2 (ja) 1999-10-20 1999-10-20 プリント配線板及びその製造方法

Publications (1)

Publication Number Publication Date
HK1036185A1 true HK1036185A1 (en) 2001-12-21

Family

ID=17861693

Family Applications (1)

Application Number Title Priority Date Filing Date
HK01106941A HK1036185A1 (en) 1999-10-20 2001-10-03 Printed circuit board and manufacturing process thereof.

Country Status (6)

Country Link
US (1) US6509528B1 (xx)
EP (1) EP1094692B1 (xx)
JP (1) JP3617388B2 (xx)
CN (1) CN1206885C (xx)
AU (1) AU6662200A (xx)
HK (1) HK1036185A1 (xx)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100391843B1 (ko) * 2001-03-26 2003-07-16 엘지.필립스 엘시디 주식회사 액정 표시 장치의 실장 방법 및 그 구조
TWI295102B (en) 2006-01-13 2008-03-21 Ind Tech Res Inst Multi-functional substrate structure
US8895873B2 (en) 2011-09-28 2014-11-25 Ibiden Co., Ltd. Printed wiring board
KR20130077537A (ko) * 2011-12-29 2013-07-09 삼성전기주식회사 회로기판
JP2014027212A (ja) 2012-07-30 2014-02-06 Ibiden Co Ltd プリント配線板
CN104159396B (zh) * 2014-08-26 2015-08-05 安捷利电子科技（苏州）有限公司 一种新型的封装基板制作方法
JP6432939B2 (ja) * 2015-02-06 2018-12-05 株式会社伸光製作所 プリント基板
CN111128679A (zh) * 2019-12-18 2020-05-08 北京无线电测量研究所 一种功分微波基板以及制作方法

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3740678A (en) * 1971-03-19 1973-06-19 Ibm Strip transmission line structures
US5136123A (en) * 1987-07-17 1992-08-04 Junkosha Co., Ltd. Multilayer circuit board
US4824511A (en) * 1987-10-19 1989-04-25 E. I. Du Pont De Nemours And Company Multilayer circuit board with fluoropolymer interlayers
JP2739726B2 (ja) * 1990-09-27 1998-04-15 インターナシヨナル・ビジネス・マシーンズ・コーポレーシヨン 多層プリント回路板
US5418689A (en) * 1993-02-01 1995-05-23 International Business Machines Corporation Printed circuit board or card for direct chip attachment and fabrication thereof
US5306670A (en) * 1993-02-09 1994-04-26 Texas Instruments Incorporated Multi-chip integrated circuit module and method for fabrication thereof
US5785789A (en) * 1993-03-18 1998-07-28 Digital Equipment Corporation Low dielectric constant microsphere filled layers for multilayer electrical structures
US5432675A (en) * 1993-11-15 1995-07-11 Fujitsu Limited Multi-chip module having thermal contacts
JPH07235741A (ja) * 1993-12-27 1995-09-05 Ngk Spark Plug Co Ltd 多層配線基板
US5958510A (en) * 1996-01-08 1999-09-28 Applied Materials, Inc. Method and apparatus for forming a thin polymer layer on an integrated circuit structure
JPH1041637A (ja) * 1996-07-23 1998-02-13 Nec Corp 高密度多層配線基板
SE513022C2 (sv) * 1998-08-19 2000-06-19 Ericsson Telefon Ab L M Dielelektriskt material för mikrovågor
US6187672B1 (en) * 1998-09-22 2001-02-13 Conexant Systems, Inc. Interconnect with low dielectric constant insulators for semiconductor integrated circuit manufacturing
US6028367A (en) * 1999-05-07 2000-02-22 Taiwan Semiconductor Manufacturing Company, Ltd. Bonds pads equipped with heat dissipating rings and method for forming

Also Published As

Publication number Publication date
EP1094692A3 (en) 2004-03-31
EP1094692B1 (en) 2015-08-19
CN1206885C (zh) 2005-06-15
US6509528B1 (en) 2003-01-21
JP2001119111A (ja) 2001-04-27
AU6662200A (en) 2001-04-26
EP1094692A2 (en) 2001-04-25
CN1299229A (zh) 2001-06-13
JP3617388B2 (ja) 2005-02-02

Similar Documents

Publication Publication Date Title
HK1027899A1 (en) Circuit board having thereon coupled ceramic capacitors and method for the manufacture thereof.
SG115480A1 (en) Printed circuit board and its manufacturing method
EP1164823A3 (en) Printed circuit board and method of manufacturing the same
GB9930051D0 (en) Electronic circuit
SG108830A1 (en) Printed wiring board and method for manufacturing printed wiring board
AU6483199A (en) Electronic circuit board
AU2001284499A1 (en) Photosensitive composition, cured article thereof, and printed circuit board using the same
EP1229769A4 (en) CARRIER FILM WITH COPPER GUIDE RAILS, METHOD TO MAKE A PCB WITH THE USE OF SUPPORT FILMS AND PCB
HK1048666A1 (en) Printed circuit boards
AU2001271381A1 (en) Vialess printed circuit board
GB2363257B (en) Printed circuit board
GB0024401D0 (en) Printed circuit board
IL151278A0 (en) Printed circuit board assembly
HK1032176A1 (en) Printed circuit boards.
GB2360399B (en) Printed circuit board connector
GB2361695B (en) Electroconductive composition and printed circuit board using the same
GB0001573D0 (en) Printed circuit board with fuse
AU2001230439A1 (en) Printed circuit board
HK1036185A1 (en) Printed circuit board and manufacturing process thereof.
GB2337862B (en) Printed circuit board
GB2345250A9 (en) Electronic games board
DE69917083D1 (de) Druckverfahren, Schaltkreissplatte und Herstellungsverfahren
AU2001234248A1 (en) Printed circuit board
GB9930675D0 (en) Electronic circuit
IL132927A0 (en) Printed circuit board antenna

Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20091020