HK1022532A1 - Camera having flexible printed circuit board - Google Patents

Camera having flexible printed circuit board

Info

Publication number
HK1022532A1
HK1022532A1 HK00101627A HK00101627A HK1022532A1 HK 1022532 A1 HK1022532 A1 HK 1022532A1 HK 00101627 A HK00101627 A HK 00101627A HK 00101627 A HK00101627 A HK 00101627A HK 1022532 A1 HK1022532 A1 HK 1022532A1
Authority
HK
Hong Kong
Prior art keywords
camera
circuit board
printed circuit
flexible printed
flexible
Prior art date
Application number
HK00101627A
Other languages
English (en)
Inventor
Koji Mizobuchi
Original Assignee
Olympus Optical Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Olympus Optical Co filed Critical Olympus Optical Co
Publication of HK1022532A1 publication Critical patent/HK1022532A1/xx

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/18Printed circuits structurally associated with non-printed electric components
    • H05K1/189Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03BAPPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B17/00Details of cameras or camera bodies; Accessories therefor
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Camera Bodies And Camera Details Or Accessories (AREA)
  • Structure Of Printed Boards (AREA)
  • Studio Devices (AREA)
HK00101627A 1998-03-06 2000-03-17 Camera having flexible printed circuit board HK1022532A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10054572A JPH11249215A (ja) 1998-03-06 1998-03-06 フレキシブルプリント配線基板を有するカメラ

Publications (1)

Publication Number Publication Date
HK1022532A1 true HK1022532A1 (en) 2000-08-11

Family

ID=12974417

Family Applications (1)

Application Number Title Priority Date Filing Date
HK00101627A HK1022532A1 (en) 1998-03-06 2000-03-17 Camera having flexible printed circuit board

Country Status (4)

Country Link
US (1) US6160967A (xx)
JP (1) JPH11249215A (xx)
CN (1) CN1144093C (xx)
HK (1) HK1022532A1 (xx)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000151151A (ja) * 1998-08-31 2000-05-30 Olympus Optical Co Ltd カメラの電気基板システム
JP2001281749A (ja) * 2000-03-31 2001-10-10 Fuji Photo Optical Co Ltd カメラ
JP2001320622A (ja) * 2000-05-11 2001-11-16 Fuji Photo Film Co Ltd カメラ付き携帯電話機
FR2810192A1 (fr) * 2000-06-08 2001-12-14 Cit Alcatel Montage electronique a haute densite d'interconnexions
JP4405062B2 (ja) * 2000-06-16 2010-01-27 株式会社ルネサステクノロジ 固体撮像装置
JP3952897B2 (ja) * 2002-07-31 2007-08-01 日本電気株式会社 カメラモジュール及びそれを用いた携帯通信端末
KR100451775B1 (ko) 2002-12-31 2004-10-08 엘지.필립스 엘시디 주식회사 터치 패널
JP2004349060A (ja) * 2003-05-21 2004-12-09 Toppoly Optoelectronics Corp 発光ダイオード・アレー光源および該光源を使用するバックライトモジュール
EP1668745B1 (en) * 2003-09-30 2011-08-31 International Business Machines Corporation Flexible assembly of stacked chips
US20050287871A1 (en) * 2004-06-25 2005-12-29 Matsushita Electric Industrial Co., Ltd. Device, method, and program for computer aided design of flexible substrates
JP4398855B2 (ja) 2004-12-27 2010-01-13 株式会社東芝 情報記録再生装置およびそれに用いられる回路装置
US20080170141A1 (en) * 2007-01-11 2008-07-17 Samuel Waising Tam Folded package camera module and method of manufacture
US7796883B2 (en) * 2007-04-09 2010-09-14 Microsoft Corporation Flexible circuit connection
KR101378880B1 (ko) * 2007-07-13 2014-03-28 엘지전자 주식회사 카메라를 구비한 휴대 단말기
US8179705B2 (en) * 2008-05-27 2012-05-15 Power-One, Inc. Apparatus and method of optimizing power system efficiency using a power loss model
JP2011049158A (ja) * 2009-07-29 2011-03-10 Sanyo Electric Co Ltd バッテリモジュール、バッテリシステムおよび電動車両
TWI464477B (zh) * 2009-12-22 2014-12-11 Hon Hai Prec Ind Co Ltd 鏡頭模組及其組裝方法
KR20120079742A (ko) * 2011-01-05 2012-07-13 삼성전자주식회사 폴디드 적층 패키지 및 그 제조방법
US9001268B2 (en) 2012-08-10 2015-04-07 Nan Chang O-Film Optoelectronics Technology Ltd Auto-focus camera module with flexible printed circuit extension
KR102067148B1 (ko) * 2013-09-30 2020-01-17 삼성디스플레이 주식회사 표시 장치
EP3879805B1 (en) * 2018-11-22 2023-08-23 Ningbo Sunny Opotech Co., Ltd. Circuit board, circuit board panel, periscope camera module, and application for same

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0450834U (xx) * 1990-09-04 1992-04-28
JPH06233196A (ja) * 1993-01-29 1994-08-19 Toshiba Corp 小型カメラ装置

Also Published As

Publication number Publication date
CN1144093C (zh) 2004-03-31
US6160967A (en) 2000-12-12
CN1233773A (zh) 1999-11-03
JPH11249215A (ja) 1999-09-17

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Legal Events

Date Code Title Description
PF Patent in force
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20170305