HK102097A - Micropump and process for manufacturing a micropump - Google Patents

Micropump and process for manufacturing a micropump

Info

Publication number
HK102097A
HK102097A HK102097A HK102097A HK102097A HK 102097 A HK102097 A HK 102097A HK 102097 A HK102097 A HK 102097A HK 102097 A HK102097 A HK 102097A HK 102097 A HK102097 A HK 102097A
Authority
HK
Hong Kong
Prior art keywords
micropump
manufacturing
Prior art date
Application number
HK102097A
Other languages
English (en)
Inventor
Shinuchi Kamisuki
Yasuto Nose
Nobuo Shimizu
Shinichi Yotsuya
Original Assignee
Seiko Epson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP17506090A external-priority patent/JPH0463973A/ja
Priority claimed from JP17870890A external-priority patent/JPH0466785A/ja
Priority claimed from JP17871390A external-priority patent/JPH0466788A/ja
Priority claimed from JP17871090A external-priority patent/JPH0466787A/ja
Priority claimed from JP17870990A external-priority patent/JPH0466786A/ja
Priority claimed from JP24652790A external-priority patent/JPH04128388A/ja
Priority claimed from JP25226590A external-priority patent/JPH04132887A/ja
Application filed by Seiko Epson Corp filed Critical Seiko Epson Corp
Publication of HK102097A publication Critical patent/HK102097A/xx

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
    • B81B3/0002—Arrangements for avoiding sticking of the flexible or moving parts
    • B81B3/0005—Anti-stiction coatings
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04B—POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS
    • F04B43/00—Machines, pumps, or pumping installations having flexible working members
    • F04B43/02—Machines, pumps, or pumping installations having flexible working members having plate-like flexible members, e.g. diaphragms
    • F04B43/04—Pumps having electric drive
    • F04B43/043—Micropumps
    • F04B43/046—Micropumps with piezoelectric drive
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04B—POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS
    • F04B53/00—Component parts, details or accessories not provided for in, or of interest apart from, groups F04B1/00 - F04B23/00 or F04B39/00 - F04B47/00
    • F04B53/10—Valves; Arrangement of valves
    • F04B53/102—Disc valves
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/308—Chemical or electrical treatment, e.g. electrolytic etching using masks
    • H01L21/3083—Chemical or electrical treatment, e.g. electrolytic etching using masks characterised by their size, orientation, disposition, behaviour, shape, in horizontal or vertical plane
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/03—Microengines and actuators
    • B81B2201/036—Micropumps
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/05—Microfluidics
    • B81B2201/054—Microvalves
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2203/00—Basic microelectromechanical structures
    • B81B2203/01—Suspended structures, i.e. structures allowing a movement
    • B81B2203/0127—Diaphragms, i.e. structures separating two media that can control the passage from one medium to another; Membranes, i.e. diaphragms with filtering function

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Reciprocating Pumps (AREA)
HK102097A 1990-07-02 1997-06-26 Micropump and process for manufacturing a micropump HK102097A (en)

Applications Claiming Priority (8)

Application Number Priority Date Filing Date Title
JP17506090A JPH0463973A (ja) 1990-07-02 1990-07-02 マイクロポンプの製造方法
JP17870890A JPH0466785A (ja) 1990-07-06 1990-07-06 マイクロポンプおよびその製造方法
JP17871390A JPH0466788A (ja) 1990-07-06 1990-07-06 流体制御装置の製造方法
JP17871090A JPH0466787A (ja) 1990-07-06 1990-07-06 流体制御装置
JP17870990A JPH0466786A (ja) 1990-07-06 1990-07-06 マイクロポンプおよびその製造方法
JP24652790A JPH04128388A (ja) 1990-09-17 1990-09-17 シリコン基板の加工方法
JP25226590A JPH04132887A (ja) 1990-09-21 1990-09-21 マイクロポンプの製造方法
JP27363590 1990-10-12

Publications (1)

Publication Number Publication Date
HK102097A true HK102097A (en) 1997-08-15

Family

ID=27573331

Family Applications (1)

Application Number Title Priority Date Filing Date
HK102097A HK102097A (en) 1990-07-02 1997-06-26 Micropump and process for manufacturing a micropump

Country Status (4)

Country Link
US (1) US5259737A (de)
EP (1) EP0465229B1 (de)
DE (1) DE69106240T2 (de)
HK (1) HK102097A (de)

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EP0465229A1 (de) 1992-01-08
EP0465229B1 (de) 1994-12-28
US5259737A (en) 1993-11-09
DE69106240D1 (de) 1995-02-09

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