HK1017392A1 - Process and circuitry for generating current pulses for electrolytic metal deposition - Google Patents

Process and circuitry for generating current pulses for electrolytic metal deposition

Info

Publication number
HK1017392A1
HK1017392A1 HK99102336A HK99102336A HK1017392A1 HK 1017392 A1 HK1017392 A1 HK 1017392A1 HK 99102336 A HK99102336 A HK 99102336A HK 99102336 A HK99102336 A HK 99102336A HK 1017392 A1 HK1017392 A1 HK 1017392A1
Authority
HK
Hong Kong
Prior art keywords
electroplating
current
pct
pulse
pulses
Prior art date
Application number
HK99102336A
Other languages
English (en)
Inventor
Egon Huebel
Original Assignee
Atotech Deutschland Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Atotech Deutschland Gmbh filed Critical Atotech Deutschland Gmbh
Publication of HK1017392A1 publication Critical patent/HK1017392A1/xx

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/18—Electroplating using modulated, pulsed or reversing current
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
HK99102336A 1995-12-21 1999-05-25 Process and circuitry for generating current pulses for electrolytic metal deposition HK1017392A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19547948A DE19547948C1 (de) 1995-12-21 1995-12-21 Verfahren und Schaltungsanordnung zur Erzeugung von Strompulsen zur elektrolytischen Metallabscheidung
PCT/EP1996/004232 WO1997023665A1 (de) 1995-12-21 1996-09-27 Verfahren und schaltungsanordnung zur erzeugung von strompulsen zur elektrolytischen metallabscheidung

Publications (1)

Publication Number Publication Date
HK1017392A1 true HK1017392A1 (en) 1999-11-19

Family

ID=7780889

Family Applications (1)

Application Number Title Priority Date Filing Date
HK99102336A HK1017392A1 (en) 1995-12-21 1999-05-25 Process and circuitry for generating current pulses for electrolytic metal deposition

Country Status (13)

Country Link
US (1) US6132584A (de)
EP (1) EP0868545B1 (de)
JP (1) JP4028892B2 (de)
KR (1) KR100465545B1 (de)
CN (1) CN1093337C (de)
AT (1) ATE186081T1 (de)
BR (1) BR9612163A (de)
CA (1) CA2241055A1 (de)
CZ (1) CZ290052B6 (de)
DE (2) DE19547948C1 (de)
ES (1) ES2139388T3 (de)
HK (1) HK1017392A1 (de)
WO (1) WO1997023665A1 (de)

Families Citing this family (30)

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Publication number Priority date Publication date Assignee Title
US6174425B1 (en) 1997-05-14 2001-01-16 Motorola, Inc. Process for depositing a layer of material over a substrate
US6946065B1 (en) * 1998-10-26 2005-09-20 Novellus Systems, Inc. Process for electroplating metal into microscopic recessed features
US6793796B2 (en) 1998-10-26 2004-09-21 Novellus Systems, Inc. Electroplating process for avoiding defects in metal features of integrated circuit devices
US6344419B1 (en) 1999-12-03 2002-02-05 Applied Materials, Inc. Pulsed-mode RF bias for sidewall coverage improvement
US6231743B1 (en) 2000-01-03 2001-05-15 Motorola, Inc. Method for forming a semiconductor device
KR20020078307A (ko) 2001-04-09 2002-10-18 주식회사 하이닉스반도체 반도체 소자의 커패시터 제조 방법
DE10259365A1 (de) 2002-04-08 2003-10-30 Siemens Ag Vorrichtung und Verfahren zur Entfernung von Oberflächenbereichen eines Bauteils
NL1022786C2 (nl) * 2003-02-26 2004-08-30 Tendris Solutions Bv Omzetschakeling, systeem en werkwijze voor het uitvoeren van een elektrochemisch proces.
DE10311575B4 (de) * 2003-03-10 2007-03-22 Atotech Deutschland Gmbh Verfahren zum elektrolytischen Metallisieren von Werkstücken mit Bohrungen mit einem hohen Aspektverhältnis
US20070068821A1 (en) * 2005-09-27 2007-03-29 Takahisa Hirasawa Method of manufacturing chromium plated article and chromium plating apparatus
US20050157475A1 (en) * 2004-01-15 2005-07-21 Endicott Interconnect Technologies, Inc. Method of making printed circuit board with electroplated conductive through holes and board resulting therefrom
DE102004045451B4 (de) * 2004-09-20 2007-05-03 Atotech Deutschland Gmbh Galvanisches Verfahren zum Füllen von Durchgangslöchern mit Metallen, insbesondere von Leiterplatten mit Kupfer
SE0403047D0 (sv) * 2004-12-14 2004-12-14 Polymer Kompositer I Goeteborg Pulse-plating method and apparatus
PL377451A1 (pl) * 2005-10-05 2007-04-16 Instytut Wysokich Ciśnień PAN Sposób prowadzenia reakcji i reaktor chemiczny
EP1890004A1 (de) 2006-08-08 2008-02-20 Siemens Aktiengesellschaft Verfahren zum Herstellen einer Nutzschicht aus wiederverwendetem Schichtmaterial
DE102006044416A1 (de) * 2006-09-18 2008-03-27 Siemens Ag Verfahren zum elektrochemischen Be- oder Entschichten von Bauteilen
US20080271995A1 (en) * 2007-05-03 2008-11-06 Sergey Savastiouk Agitation of electrolytic solution in electrodeposition
US8603864B2 (en) 2008-09-11 2013-12-10 Infineon Technologies Ag Method of fabricating a semiconductor device
US11225727B2 (en) 2008-11-07 2022-01-18 Lam Research Corporation Control of current density in an electroplating apparatus
US10011917B2 (en) 2008-11-07 2018-07-03 Lam Research Corporation Control of current density in an electroplating apparatus
US9011706B2 (en) * 2008-12-16 2015-04-21 City University Of Hong Kong Method of making foraminous microstructures
US9385035B2 (en) 2010-05-24 2016-07-05 Novellus Systems, Inc. Current ramping and current pulsing entry of substrates for electroplating
JP6161863B2 (ja) * 2010-12-28 2017-07-12 株式会社荏原製作所 電気めっき方法
US9028666B2 (en) 2011-05-17 2015-05-12 Novellus Systems, Inc. Wetting wave front control for reduced air entrapment during wafer entry into electroplating bath
CN102277603A (zh) * 2011-08-03 2011-12-14 深圳大学 一种感应热/电沉积制备涂层或薄膜的装置及方法
AP2016009258A0 (en) * 2013-11-19 2016-06-30 Hecker Electronica Potencia Y Procesos S A Method of superimposing alternating current on direct current in electrolytic methods
EP3029178A1 (de) * 2014-12-05 2016-06-08 ATOTECH Deutschland GmbH Verfahren und Vorrichtung zum elektrolytischen Abscheiden eines Metalls auf einem Substrat
EP3485068A4 (de) 2016-07-13 2020-04-22 Iontra LLC Elektrochemische verfahren, vorrichtungen und zusammensetzungen
RU2722754C1 (ru) * 2019-04-23 2020-06-03 Общество с ограниченной ответственностью "Керамик тех" (ООО "Керамик тех") Устройство для формирования электрохимическим оксидированием покрытий на вентильных металлах или сплавах
CN114836797B (zh) * 2022-05-12 2023-08-29 广州市慧科高新材料科技有限公司 一种基于脉冲搭桥的通孔填孔电镀工艺

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3616434A (en) * 1968-04-18 1971-10-26 Novachrome Inc Apparatus with power source for plating
US3959088A (en) * 1975-03-19 1976-05-25 The United States Of America As Represented By The Secretary Of The Army Method and apparatus for generating high amperage pulses from an A-C power source
CH629542A5 (de) * 1976-09-01 1982-04-30 Inoue Japax Res Verfahren und vorrichtung zur galvanischen materialablagerung.
US4208254A (en) * 1976-09-22 1980-06-17 Satoshi Ichioka Method of plating an iron-cobalt alloy on a substrate
US4517059A (en) * 1981-07-31 1985-05-14 The Boeing Company Automated alternating polarity direct current pulse electrolytic processing of metals
GB8801827D0 (en) * 1988-01-27 1988-02-24 Jct Controls Ltd Improvements in electrochemical processes
DE4005346A1 (de) * 1990-02-20 1991-08-22 Siemens Ag Verfahren zur erzeugung von hochfrequenten strompulsen mit steilen pulsflanken in galvanikanlagen und versorgungsschaltung zur durchfuehrung des verfahrens

Also Published As

Publication number Publication date
ATE186081T1 (de) 1999-11-15
CA2241055A1 (en) 1997-07-03
KR100465545B1 (ko) 2005-02-28
JP4028892B2 (ja) 2007-12-26
DE59603510D1 (de) 1999-12-02
KR19990071793A (ko) 1999-09-27
US6132584A (en) 2000-10-17
EP0868545A1 (de) 1998-10-07
BR9612163A (pt) 1999-07-13
EP0868545B1 (de) 1999-10-27
WO1997023665A1 (de) 1997-07-03
CZ170098A3 (cs) 1998-10-14
CN1205745A (zh) 1999-01-20
CN1093337C (zh) 2002-10-23
CZ290052B6 (cs) 2002-05-15
ES2139388T3 (es) 2000-02-01
DE19547948C1 (de) 1996-11-21
JP2000505145A (ja) 2000-04-25

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Legal Events

Date Code Title Description
PF Patent in force
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20080927