HK1014295A1 - Master slice integrated circuit power supply system - Google Patents

Master slice integrated circuit power supply system

Info

Publication number
HK1014295A1
HK1014295A1 HK98115538A HK98115538A HK1014295A1 HK 1014295 A1 HK1014295 A1 HK 1014295A1 HK 98115538 A HK98115538 A HK 98115538A HK 98115538 A HK98115538 A HK 98115538A HK 1014295 A1 HK1014295 A1 HK 1014295A1
Authority
HK
Hong Kong
Prior art keywords
power supply
integrated circuit
supply system
circuit power
master slice
Prior art date
Application number
HK98115538A
Other languages
English (en)
Inventor
Yasuhisa Hirabayashi
Takashi Sakuda
Kazuhiko Okawa
Yasuhiro Oguchi
Original Assignee
Seiko Epson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp filed Critical Seiko Epson Corp
Publication of HK1014295A1 publication Critical patent/HK1014295A1/xx

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
    • H01L27/08—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/528—Geometry or layout of the interconnection structure
    • H01L23/5286—Arrangements of power or ground buses
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
    • H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L24/06—Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
    • H01L27/10—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a repetitive configuration
    • H01L27/118—Masterslice integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0555—Shape
    • H01L2224/05552—Shape in top view
    • H01L2224/05554—Shape in top view being square
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Geometry (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)
  • Semiconductor Integrated Circuits (AREA)
HK98115538A 1989-09-08 1998-12-24 Master slice integrated circuit power supply system HK1014295A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP23332689 1989-09-08
JP2166115A JP2917434B2 (ja) 1989-09-08 1990-06-25 マスタースライス集積回路装置

Publications (1)

Publication Number Publication Date
HK1014295A1 true HK1014295A1 (en) 1999-09-24

Family

ID=26490608

Family Applications (1)

Application Number Title Priority Date Filing Date
HK98115538A HK1014295A1 (en) 1989-09-08 1998-12-24 Master slice integrated circuit power supply system

Country Status (7)

Country Link
US (2) US5153698A (xx)
EP (1) EP0416456B1 (xx)
JP (1) JP2917434B2 (xx)
KR (1) KR0154121B1 (xx)
DE (1) DE69033641T2 (xx)
HK (1) HK1014295A1 (xx)
SG (1) SG87731A1 (xx)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05308136A (ja) * 1992-04-01 1993-11-19 Nec Corp マスタスライス集積回路
US5416431A (en) * 1994-03-21 1995-05-16 At&T Corp. Integrated circuit clock driver having improved layout
EP0791930B1 (en) * 1995-10-02 2004-02-18 Matsushita Electric Industrial Co., Ltd. Electric signal supply circuit and semiconductor memory device
JP2001053155A (ja) * 1999-06-04 2001-02-23 Seiko Epson Corp 半導体集積回路装置
JP3964295B2 (ja) * 2002-09-18 2007-08-22 松下電器産業株式会社 集積回路設計における電源経路構造
US20070090385A1 (en) * 2005-10-21 2007-04-26 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
KR100763108B1 (ko) * 2005-11-24 2007-10-04 주식회사 하이닉스반도체 파워 라인의 폭을 선택적으로 조절하는 반도체 장치의 파워라인 제어 회로
WO2016129109A1 (ja) * 2015-02-13 2016-08-18 ルネサスエレクトロニクス株式会社 半導体装置およびその製造方法
CN109755279B (zh) * 2019-01-09 2020-11-17 昆山国显光电有限公司 Oled显示面板及oled显示装置

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5835963A (ja) * 1981-08-28 1983-03-02 Fujitsu Ltd 集積回路装置
EP0074805B2 (en) * 1981-09-10 1992-03-11 Fujitsu Limited Semiconductor integrated circuit comprising a semiconductor substrate and interconnecting layers
JPS6017932A (ja) * 1983-07-09 1985-01-29 Fujitsu Ltd ゲ−ト・アレイ
JPS60101951A (ja) * 1983-11-08 1985-06-06 Sanyo Electric Co Ltd ゲ−トアレイ
JPS6120349A (ja) * 1984-07-06 1986-01-29 Hitachi Ltd Ｌｓｉ集合体
JPS61241964A (ja) * 1985-04-19 1986-10-28 Hitachi Ltd 半導体装置
JPH0785490B2 (ja) * 1986-01-22 1995-09-13 日本電気株式会社 集積回路装置
JPH0828421B2 (ja) * 1987-08-27 1996-03-21 株式会社東芝 半導体集積回路装置
DE4433617C2 (de) * 1994-09-21 1997-04-24 Kostal Leopold Gmbh & Co Kg Elektrisches Steckverbindungsteil
JP3456768B2 (ja) * 1994-09-28 2003-10-14 株式会社東芝 アドレス変換装置

Also Published As

Publication number Publication date
US5345098A (en) 1994-09-06
JP2917434B2 (ja) 1999-07-12
EP0416456B1 (en) 2000-10-04
SG87731A1 (en) 2002-04-16
EP0416456A1 (en) 1991-03-13
KR0154121B1 (ko) 1998-10-15
DE69033641T2 (de) 2001-05-03
JPH03174770A (ja) 1991-07-29
KR910007131A (ko) 1991-04-30
DE69033641D1 (de) 2000-11-09
US5153698A (en) 1992-10-06

Similar Documents

Publication Publication Date Title
EP0257437A3 (en) Master slice type integrated circuit
EP0419015A3 (en) Power supply system
IL94546A0 (en) Vhf-dc-dc power supply
EP0278857A3 (en) Master slice type integrated circuit
HK124497A (en) Power source circuit
EP0410423A3 (en) Multiple power supply system
HK1014295A1 (en) Master slice integrated circuit power supply system
KR910000024B1 (en) Master slice type integrated circuit
GB2237082B (en) Power booster
GB2221090B (en) Master slice semiconductor device
EP0454859A4 (en) Semiconducteur integrated circuit
GB2233479B (en) Power supply
GB2231720B (en) Integrated circuit
HK67396A (en) Integrated limiting circuit for ac-voltages
EP0416510A3 (en) Dc power supply circuit arrangement
GB2236062B (en) Integrated circuit
GB8714216D0 (en) Power supply circuits
GB2238671B (en) An electrical supply system
GB8805499D0 (en) Master slice circuit having memory region
GB8902519D0 (en) Power supply system
GB8826712D0 (en) Electrical supply system
GB8613567D0 (en) Power supply circuits
GB2265260B (en) Power supply unit
GB8907560D0 (en) Power supply system
GB8919164D0 (en) Supply circuits

Legal Events

Date Code Title Description
PF Patent in force
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20080829