GB2236062B - Integrated circuit - Google Patents

Integrated circuit

Info

Publication number
GB2236062B
GB2236062B GB9010466A GB9010466A GB2236062B GB 2236062 B GB2236062 B GB 2236062B GB 9010466 A GB9010466 A GB 9010466A GB 9010466 A GB9010466 A GB 9010466A GB 2236062 B GB2236062 B GB 2236062B
Authority
GB
United Kingdom
Prior art keywords
integrated circuit
integrated
circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
GB9010466A
Other versions
GB2236062A (en
GB9010466D0 (en
Inventor
Peter Moran
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Publication of GB9010466D0 publication Critical patent/GB9010466D0/en
Publication of GB2236062A publication Critical patent/GB2236062A/en
Application granted granted Critical
Publication of GB2236062B publication Critical patent/GB2236062B/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
GB9010466A 1989-05-10 1990-05-10 Integrated circuit Expired - Fee Related GB2236062B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB8910685A GB8910685D0 (en) 1989-05-10 1989-05-10 Integrated circuit package

Publications (3)

Publication Number Publication Date
GB9010466D0 GB9010466D0 (en) 1990-07-04
GB2236062A GB2236062A (en) 1991-03-27
GB2236062B true GB2236062B (en) 1993-05-26

Family

ID=10656481

Family Applications (2)

Application Number Title Priority Date Filing Date
GB8910685A Pending GB8910685D0 (en) 1989-05-10 1989-05-10 Integrated circuit package
GB9010466A Expired - Fee Related GB2236062B (en) 1989-05-10 1990-05-10 Integrated circuit

Family Applications Before (1)

Application Number Title Priority Date Filing Date
GB8910685A Pending GB8910685D0 (en) 1989-05-10 1989-05-10 Integrated circuit package

Country Status (1)

Country Link
GB (2) GB8910685D0 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2326256B (en) * 1994-04-01 1999-02-10 Fujitsu Ltd Network service system
DE19530577B4 (en) * 1995-08-19 2005-03-10 Conti Temic Microelectronic Housing for microelectronic components and method for its production
GB9520072D0 (en) * 1995-10-02 1995-12-06 Dewhurst Plc Indicators and push-button members and method of forming the same
US7659617B2 (en) * 2006-11-30 2010-02-09 Tessera, Inc. Substrate for a flexible microelectronic assembly and a method of fabricating thereof

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1406207A (en) * 1973-02-16 1975-09-17 Matsushita Electronics Corp Method of manufacturing a metallic lead frame for a semiconductor device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1406207A (en) * 1973-02-16 1975-09-17 Matsushita Electronics Corp Method of manufacturing a metallic lead frame for a semiconductor device

Also Published As

Publication number Publication date
GB2236062A (en) 1991-03-27
GB9010466D0 (en) 1990-07-04
GB8910685D0 (en) 1989-06-28

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee

Effective date: 20030510