HK1012680A1 - Wrought tantalum or niobium alloy having silicon and a compound dopant - Google Patents
Wrought tantalum or niobium alloy having silicon and a compound dopantInfo
- Publication number
- HK1012680A1 HK1012680A1 HK98113785A HK98113785A HK1012680A1 HK 1012680 A1 HK1012680 A1 HK 1012680A1 HK 98113785 A HK98113785 A HK 98113785A HK 98113785 A HK98113785 A HK 98113785A HK 1012680 A1 HK1012680 A1 HK 1012680A1
- Authority
- HK
- Hong Kong
- Prior art keywords
- silicon
- niobium alloy
- tantalum
- wrought
- compound dopant
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C27/00—Alloys based on rhenium or a refractory metal not mentioned in groups C22C14/00 or C22C16/00
- C22C27/02—Alloys based on vanadium, niobium, or tantalum
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Powder Metallurgy (AREA)
- Manufacture And Refinement Of Metals (AREA)
- Catalysts (AREA)
- Liquid Crystal Substances (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Ceramic Products (AREA)
- Manufacture Of Alloys Or Alloy Compounds (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US07/701,428 US5171379A (en) | 1991-05-15 | 1991-05-15 | Tantalum base alloys |
PCT/US1992/004131 WO1992020828A1 (en) | 1991-05-15 | 1992-05-15 | Wrought tantalum or niobium alloy having silicon and a compound dopant |
Publications (1)
Publication Number | Publication Date |
---|---|
HK1012680A1 true HK1012680A1 (en) | 1999-08-06 |
Family
ID=24817332
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK98113785A HK1012680A1 (en) | 1991-05-15 | 1998-12-16 | Wrought tantalum or niobium alloy having silicon and a compound dopant |
Country Status (12)
Country | Link |
---|---|
US (1) | US5171379A (cs) |
EP (1) | EP0591330B1 (cs) |
JP (1) | JP2667293B2 (cs) |
KR (1) | KR100236429B1 (cs) |
AT (1) | ATE168726T1 (cs) |
AU (1) | AU2141792A (cs) |
CZ (1) | CZ290947B6 (cs) |
DE (1) | DE69226364T2 (cs) |
HK (1) | HK1012680A1 (cs) |
RU (1) | RU2103408C1 (cs) |
SG (1) | SG52570A1 (cs) |
WO (1) | WO1992020828A1 (cs) |
Families Citing this family (39)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5411611A (en) * | 1993-08-05 | 1995-05-02 | Cabot Corporation | Consumable electrode method for forming micro-alloyed products |
US5699401A (en) * | 1996-10-15 | 1997-12-16 | General Electric Company | Anode assembly for use in x-ray tubes, and related articles of manufacture |
US5680282A (en) * | 1996-10-24 | 1997-10-21 | International Business Machine Corporation | Getter layer lead structure for eliminating resistance increase phonomena and embrittlement and method for making the same |
US5918104A (en) * | 1997-12-24 | 1999-06-29 | H.C. Starck, Inc. | Production of tantalum-tungsten alloys production by powder metallurgy |
US6576069B1 (en) | 1998-05-22 | 2003-06-10 | Cabot Corporation | Tantalum-silicon alloys and products containing the same and processes of making the same |
US6323055B1 (en) * | 1998-05-27 | 2001-11-27 | The Alta Group, Inc. | Tantalum sputtering target and method of manufacture |
US6462934B2 (en) | 1998-09-16 | 2002-10-08 | Cabot Corporation | Methods to partially reduce a niobium metal oxide and oxygen reduced niobium oxides |
US6416730B1 (en) | 1998-09-16 | 2002-07-09 | Cabot Corporation | Methods to partially reduce a niobium metal oxide oxygen reduced niobium oxides |
US6391275B1 (en) | 1998-09-16 | 2002-05-21 | Cabot Corporation | Methods to partially reduce a niobium metal oxide and oxygen reduced niobium oxides |
TW479262B (en) * | 1999-06-09 | 2002-03-11 | Showa Denko Kk | Electrode material for capacitor and capacitor using the same |
US6358625B1 (en) * | 1999-10-11 | 2002-03-19 | H. C. Starck, Inc. | Refractory metals with improved adhesion strength |
US20040072009A1 (en) * | 1999-12-16 | 2004-04-15 | Segal Vladimir M. | Copper sputtering targets and methods of forming copper sputtering targets |
US6878250B1 (en) | 1999-12-16 | 2005-04-12 | Honeywell International Inc. | Sputtering targets formed from cast materials |
JP3582437B2 (ja) * | 1999-12-24 | 2004-10-27 | 株式会社村田製作所 | 薄膜製造方法及びそれに用いる薄膜製造装置 |
US7517417B2 (en) * | 2000-02-02 | 2009-04-14 | Honeywell International Inc. | Tantalum PVD component producing methods |
US6331233B1 (en) | 2000-02-02 | 2001-12-18 | Honeywell International Inc. | Tantalum sputtering target with fine grains and uniform texture and method of manufacture |
US6576099B2 (en) | 2000-03-23 | 2003-06-10 | Cabot Corporation | Oxygen reduced niobium oxides |
US20030227068A1 (en) * | 2001-05-31 | 2003-12-11 | Jianxing Li | Sputtering target |
DE10044450C1 (de) * | 2000-09-08 | 2002-01-17 | Epcos Ag | Verfahren zur Herstellung einer Elektrode für Kondensatoren und zur Herstellung eines Kondensators |
US6833058B1 (en) | 2000-10-24 | 2004-12-21 | Honeywell International Inc. | Titanium-based and zirconium-based mixed materials and sputtering targets |
JP2004513514A (ja) | 2000-11-06 | 2004-04-30 | キャボット コーポレイション | 酸素を低減した改質バルブ金属酸化物 |
JP2002217070A (ja) * | 2001-01-22 | 2002-08-02 | Kawatetsu Mining Co Ltd | ニオブ粉末及び固体電解コンデンサ用アノード |
EP1435102A2 (en) * | 2001-08-22 | 2004-07-07 | Showa Denko K.K. | Tantalum capacitor with niobium alloy lead wire |
US8562664B2 (en) * | 2001-10-25 | 2013-10-22 | Advanced Cardiovascular Systems, Inc. | Manufacture of fine-grained material for use in medical devices |
US20040123920A1 (en) * | 2002-10-08 | 2004-07-01 | Thomas Michael E. | Homogenous solid solution alloys for sputter-deposited thin films |
US7655214B2 (en) * | 2003-02-26 | 2010-02-02 | Cabot Corporation | Phase formation of oxygen reduced valve metal oxides and granulation methods |
US7445679B2 (en) * | 2003-05-16 | 2008-11-04 | Cabot Corporation | Controlled oxygen addition for metal material |
CN101676217A (zh) | 2003-05-19 | 2010-03-24 | 卡伯特公司 | 生产铌金属氧化物的方法和氧还原的铌氧化物 |
DE102004011214A1 (de) * | 2004-03-04 | 2005-10-06 | W.C. Heraeus Gmbh | Hochtemperaturbeständiger Niob-Draht |
US8252126B2 (en) * | 2004-05-06 | 2012-08-28 | Global Advanced Metals, Usa, Inc. | Sputter targets and methods of forming same by rotary axial forging |
US7666323B2 (en) * | 2004-06-09 | 2010-02-23 | Veeco Instruments Inc. | System and method for increasing the emissivity of a material |
US7666243B2 (en) * | 2004-10-27 | 2010-02-23 | H.C. Starck Inc. | Fine grain niobium sheet via ingot metallurgy |
DE102005038551B3 (de) * | 2005-08-12 | 2007-04-05 | W.C. Heraeus Gmbh | Draht und Gestell für einseitig gesockelte Lampen auf Basis von Niob oder Tantal sowie Herstellungsverfahren und Verwendung |
US20070044873A1 (en) * | 2005-08-31 | 2007-03-01 | H. C. Starck Inc. | Fine grain niobium sheet via ingot metallurgy |
US20070084527A1 (en) * | 2005-10-19 | 2007-04-19 | Stephane Ferrasse | High-strength mechanical and structural components, and methods of making high-strength components |
US20070251818A1 (en) * | 2006-05-01 | 2007-11-01 | Wuwen Yi | Copper physical vapor deposition targets and methods of making copper physical vapor deposition targets |
CN101831583A (zh) * | 2010-05-17 | 2010-09-15 | 宝鸡市众邦稀有金属材料有限公司 | 高延展性铌钇或钽钇合金板及制备工艺 |
US20120291699A1 (en) * | 2011-02-11 | 2012-11-22 | Matthew Fonte | Crucibles made with the cold form process |
US9771637B2 (en) | 2014-12-09 | 2017-09-26 | Ati Properties Llc | Composite crucibles and methods of making and using the same |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USRE26122E (en) * | 1966-12-06 | Ductile niobium and tantalum alloys | ||
US3268328A (en) * | 1964-11-03 | 1966-08-23 | Nat Res Corp | Metallurgy |
US3497402A (en) * | 1966-02-03 | 1970-02-24 | Nat Res Corp | Stabilized grain-size tantalum alloy |
US4062679A (en) * | 1973-03-29 | 1977-12-13 | Fansteel Inc. | Embrittlement-resistant tantalum wire |
JPS5352521A (en) * | 1976-10-25 | 1978-05-13 | Tokushiyu Muki Zairiyou Kenkiy | Manufacture of heat resisting tenacious cermet |
US4235629A (en) * | 1977-10-17 | 1980-11-25 | Fansteel Inc. | Method for producing an embrittlement-resistant tantalum wire |
US4859257A (en) * | 1986-01-29 | 1989-08-22 | Fansteel Inc. | Fine grained embrittlement resistant tantalum wire |
US4957541A (en) * | 1988-11-01 | 1990-09-18 | Nrc, Inc. | Capacitor grade tantalum powder |
-
1991
- 1991-05-15 US US07/701,428 patent/US5171379A/en not_active Expired - Lifetime
-
1992
- 1992-05-15 JP JP5500235A patent/JP2667293B2/ja not_active Expired - Fee Related
- 1992-05-15 DE DE69226364T patent/DE69226364T2/de not_active Expired - Fee Related
- 1992-05-15 AT AT92913315T patent/ATE168726T1/de not_active IP Right Cessation
- 1992-05-15 RU RU93058404A patent/RU2103408C1/ru not_active IP Right Cessation
- 1992-05-15 KR KR1019930703431A patent/KR100236429B1/ko not_active IP Right Cessation
- 1992-05-15 SG SG1996006236A patent/SG52570A1/en unknown
- 1992-05-15 WO PCT/US1992/004131 patent/WO1992020828A1/en active IP Right Grant
- 1992-05-15 CZ CZ19932421A patent/CZ290947B6/cs not_active IP Right Cessation
- 1992-05-15 AU AU21417/92A patent/AU2141792A/en not_active Abandoned
- 1992-05-15 EP EP92913315A patent/EP0591330B1/en not_active Expired - Lifetime
-
1998
- 1998-12-16 HK HK98113785A patent/HK1012680A1/xx not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
EP0591330A4 (en) | 1994-06-01 |
CZ242193A3 (en) | 1994-06-15 |
SG52570A1 (en) | 1998-09-28 |
RU2103408C1 (ru) | 1998-01-27 |
DE69226364T2 (de) | 1998-11-26 |
DE69226364D1 (de) | 1998-08-27 |
JPH06507209A (ja) | 1994-08-11 |
EP0591330A1 (en) | 1994-04-13 |
US5171379A (en) | 1992-12-15 |
CZ290947B6 (cs) | 2002-11-13 |
KR100236429B1 (ko) | 1999-12-15 |
ATE168726T1 (de) | 1998-08-15 |
JP2667293B2 (ja) | 1997-10-27 |
AU2141792A (en) | 1992-12-30 |
WO1992020828A1 (en) | 1992-11-26 |
EP0591330B1 (en) | 1998-07-22 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PF | Patent in force | ||
PC | Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee) |
Effective date: 20060515 |