HK1010384A1 - A process for modifying the surfaces of molded materials made of fluorine resins - Google Patents

A process for modifying the surfaces of molded materials made of fluorine resins

Info

Publication number
HK1010384A1
HK1010384A1 HK98111163A HK98111163A HK1010384A1 HK 1010384 A1 HK1010384 A1 HK 1010384A1 HK 98111163 A HK98111163 A HK 98111163A HK 98111163 A HK98111163 A HK 98111163A HK 1010384 A1 HK1010384 A1 HK 1010384A1
Authority
HK
Hong Kong
Prior art keywords
modifying
materials made
fluorine resins
molded materials
molded
Prior art date
Application number
HK98111163A
Other languages
English (en)
Inventor
Masanobu Nishil
Yuichi Shimizu
Shunichi Kawanishi
Shunichi Sugimoto
Masao Endo
Tomohiro Nagase
Original Assignee
Kurashiki Boseki Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kurashiki Boseki Kk filed Critical Kurashiki Boseki Kk
Publication of HK1010384A1 publication Critical patent/HK1010384A1/xx

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
    • C08J7/04—Coating
    • C08J7/06—Coating with compositions not containing macromolecular substances
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
    • C08J7/12—Chemical modification
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2327/00—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Derivatives of such polymers
    • C08J2327/02—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Derivatives of such polymers not modified by chemical after-treatment
    • C08J2327/12—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Derivatives of such polymers not modified by chemical after-treatment containing fluorine atoms
HK98111163A 1993-10-15 1998-10-09 A process for modifying the surfaces of molded materials made of fluorine resins HK1010384A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP25808793 1993-10-15

Publications (1)

Publication Number Publication Date
HK1010384A1 true HK1010384A1 (en) 1999-06-17

Family

ID=17315341

Family Applications (1)

Application Number Title Priority Date Filing Date
HK98111163A HK1010384A1 (en) 1993-10-15 1998-10-09 A process for modifying the surfaces of molded materials made of fluorine resins

Country Status (7)

Country Link
US (1) US5470617A (de)
EP (1) EP0648803B1 (de)
KR (1) KR100249920B1 (de)
CN (1) CN1050851C (de)
DE (1) DE69419225T2 (de)
HK (1) HK1010384A1 (de)
MY (1) MY120404A (de)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6689426B1 (en) * 1993-03-23 2004-02-10 Tokai University Solid surface modification method and apparatus
WO1994021715A1 (en) * 1993-03-23 1994-09-29 Tokai University Solid surface modifying method and apparatus
JP2999365B2 (ja) * 1994-05-10 2000-01-17 倉敷紡績株式会社 フッ素樹脂製多孔質体の親水化法
US5833759A (en) * 1996-11-08 1998-11-10 W. L. Gore & Associates, Inc. Method for preparing vias for subsequent metallization
US6474780B1 (en) * 1998-04-16 2002-11-05 Canon Kabushiki Kaisha Liquid discharge head, cartridge having such head, liquid discharge apparatus provided with such cartridge, and method for manufacturing liquid discharge heads
US6268413B1 (en) * 1999-05-05 2001-07-31 Elmer's Products, Inc. High-strength adhesive paste and dispenser
US20050208308A1 (en) * 2001-05-21 2005-09-22 3M Innovative Properties Company Bonding compositions
US7485371B2 (en) * 2004-04-16 2009-02-03 3M Innovative Properties Company Bonding compositions
US6753087B2 (en) * 2001-05-21 2004-06-22 3M Innovative Properties Company Fluoropolymer bonding
US6630047B2 (en) 2001-05-21 2003-10-07 3M Innovative Properties Company Fluoropolymer bonding composition and method
US6685793B2 (en) 2001-05-21 2004-02-03 3M Innovative Properties Company Fluoropolymer bonding composition and method
US6752894B2 (en) 2001-12-14 2004-06-22 3M Innovative Properties Company Process for modifying a polymeric surface
US6844030B2 (en) 2001-12-14 2005-01-18 3M Innovative Properties Company Process for modifying a polymeric surface
CN1646610B (zh) * 2002-04-23 2012-09-26 劳雷尔产品有限公司 处理含氟聚合物颗粒的方法和其产品
US6938986B2 (en) * 2002-04-30 2005-09-06 Hewlett-Packard Development Company, L.P. Surface characteristic apparatus and method
US20040126708A1 (en) * 2002-12-31 2004-07-01 3M Innovative Properties Company Method for modifying the surface of a polymeric substrate
US6986947B2 (en) * 2003-10-09 2006-01-17 3M Innovative Properties Company Method of modifying a fluoropolymer and articles thereby
US7273531B2 (en) * 2003-11-05 2007-09-25 3M Innovative Properties Company Method of modifying a fluoropolymeric substrate and composite articles thereby
US7709050B2 (en) 2004-08-02 2010-05-04 Hewlett-Packard Development Company, L.P. Surface treatment for OLED material
US7655275B2 (en) 2004-08-02 2010-02-02 Hewlett-Packard Delopment Company, L.P. Methods of controlling flow
CA2675267C (en) * 2007-02-20 2015-03-31 Toray Industries, Inc. Method for producing resin molding
JP6406817B2 (ja) 2013-12-10 2018-10-17 デクセリアルズ株式会社 硬化樹脂成形体
CN111684000B (zh) * 2018-02-05 2022-12-06 阿斯制药株式会社 目标分子向聚合物成型体的选择性键合方法和目标分子键合型聚合物成型体的制造方法

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5322108A (en) * 1976-08-13 1978-03-01 Nippon Steel Corp Walking beam type electric heat treating furnace
JPS5821928A (ja) * 1981-07-31 1983-02-09 Fujitsu Ten Ltd ノイズブランカ
JPS609734A (ja) * 1983-06-30 1985-01-18 Toray Ind Inc フツ素樹脂成型体
JPH02127442A (ja) * 1988-11-04 1990-05-16 Unitika Ltd フツ化オレフイン重合体成形物の表面処理法
JPH02196834A (ja) * 1989-01-25 1990-08-03 Rikagaku Kenkyusho レーザーによるフッ素樹脂の表面改質方法
JP2892046B2 (ja) * 1989-07-25 1999-05-17 株式会社東芝 カラー受像管
JPH0358375A (ja) * 1989-07-26 1991-03-13 Hitachi Ltd 半導体記憶装置
US5051312A (en) * 1990-03-29 1991-09-24 E. I. Du Pont De Nemours And Company Modification of polymer surfaces
JPH04370123A (ja) * 1991-06-14 1992-12-22 Nitto Denko Corp 改質されたフッ素樹脂の製造法
JP3056560B2 (ja) * 1991-09-25 2000-06-26 日東電工株式会社 液体用濾過膜及びそれを用いた濾過装置
US5320789A (en) * 1991-11-06 1994-06-14 Japan Atomic Energy Research Institute Surface modification of fluorine resin with laser light
JPH07108944B2 (ja) * 1991-11-06 1995-11-22 日本原子力研究所 レーザー光によるフッ素樹脂の表面改質法
JP3227005B2 (ja) * 1993-02-26 2001-11-12 倉敷紡績株式会社 フッ素樹脂表面の改質法

Also Published As

Publication number Publication date
KR950011518A (ko) 1995-05-15
EP0648803A1 (de) 1995-04-19
US5470617A (en) 1995-11-28
KR100249920B1 (ko) 2000-04-01
EP0648803B1 (de) 1999-06-23
CN1106423A (zh) 1995-08-09
DE69419225D1 (de) 1999-07-29
CN1050851C (zh) 2000-03-29
DE69419225T2 (de) 2000-03-16
MY120404A (en) 2005-10-31

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Legal Events

Date Code Title Description
PF Patent in force
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20061013