HK1004557A1 - Latent epoxide composition - Google Patents

Latent epoxide composition

Info

Publication number
HK1004557A1
HK1004557A1 HK98103368A HK98103368A HK1004557A1 HK 1004557 A1 HK1004557 A1 HK 1004557A1 HK 98103368 A HK98103368 A HK 98103368A HK 98103368 A HK98103368 A HK 98103368A HK 1004557 A1 HK1004557 A1 HK 1004557A1
Authority
HK
Hong Kong
Prior art keywords
weight
solid solution
epoxide composition
latent
epoxide resin
Prior art date
Application number
HK98103368A
Other languages
English (en)
Inventor
Christopher Michael Andrews
Madan Mohan Bagga
Original Assignee
Ciba Geigy Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ciba Geigy Ag filed Critical Ciba Geigy Ag
Publication of HK1004557A1 publication Critical patent/HK1004557A1/xx

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C08G59/56—Amines together with other curing agents
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Resins (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Luminescent Compositions (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
HK98103368A 1986-09-24 1998-04-22 Latent epoxide composition HK1004557A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB868622998A GB8622998D0 (en) 1986-09-24 1986-09-24 Curable compositions

Publications (1)

Publication Number Publication Date
HK1004557A1 true HK1004557A1 (en) 1998-11-27

Family

ID=10604725

Family Applications (1)

Application Number Title Priority Date Filing Date
HK98103368A HK1004557A1 (en) 1986-09-24 1998-04-22 Latent epoxide composition

Country Status (9)

Country Link
US (1) US4866133A (xx)
EP (1) EP0266306B1 (xx)
JP (1) JPH07119274B2 (xx)
AT (1) ATE94185T1 (xx)
CA (1) CA1293340C (xx)
DE (1) DE3787343D1 (xx)
ES (1) ES2059405T3 (xx)
GB (1) GB8622998D0 (xx)
HK (1) HK1004557A1 (xx)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB8824391D0 (en) * 1988-10-18 1988-11-23 Ciba Geigy Ag Compositions
IT1261171B (it) * 1992-03-03 1996-05-09 Ruetgerswerke Ag Miscuglio resinoso a basso contenuto di prodotti di scissione.
US5360840A (en) * 1992-12-29 1994-11-01 Hercules Incorporated Epoxy resin compositions with improved storage stability
US5886302A (en) * 1995-02-08 1999-03-23 Measurement Specialties, Inc. Electrical weighing scale
JP2007211254A (ja) * 1997-01-10 2007-08-23 Nippon Kayaku Co Ltd エポキシ樹脂組成物およびエポキシ樹脂の製造方法
US6492092B1 (en) * 1999-03-12 2002-12-10 Arch Specialty Chemicals, Inc. Hydroxy-epoxide thermally cured undercoat for 193 NM lithography
US6491845B1 (en) 2000-11-16 2002-12-10 Richard D. Schile Epoxy hardener of phenolic or 2° OH polyol and methylol polyol
JP4752131B2 (ja) * 2001-05-16 2011-08-17 味の素株式会社 エポキシ樹脂用潜在性硬化剤及び硬化性エポキシ樹脂組成物
DE602004018342D1 (de) 2003-08-26 2009-01-22 Zimmer Spine Inc Zugangssysteme für die minimal invasive chirurgie
US7566122B2 (en) * 2004-04-15 2009-07-28 Hewlett-Packard Development Company, L.P. Fluid ejection device utilizing a one-part epoxy adhesive
EP1674495A1 (en) 2004-12-22 2006-06-28 Huntsman Advanced Materials (Switzerland) GmbH Coating system
JP5213313B2 (ja) * 2006-05-23 2013-06-19 リンテック株式会社 粘接着剤組成物、粘接着シートおよび半導体装置の製造方法
KR101391705B1 (ko) * 2006-06-16 2014-05-19 훈츠만 어드밴스트 머티리얼스(스위처랜드) 게엠베하 코팅 시스템
US9080007B2 (en) 2013-02-28 2015-07-14 Air Products And Chemicals, Inc. Anhydride accelerators for epoxy resin systems
EP2981565B1 (en) 2013-04-05 2017-10-04 Evonik Degussa GmbH One component epoxy curing agents comprising hydroxyalkylamino cycloalkanes
US9777197B2 (en) 2013-10-23 2017-10-03 Sunray Scientific, Llc UV-curable anisotropic conductive adhesive
US9365749B2 (en) * 2013-05-31 2016-06-14 Sunray Scientific, Llc Anisotropic conductive adhesive with reduced migration
US9546243B2 (en) * 2013-07-17 2017-01-17 Air Products And Chemicals, Inc. Amines and polymeric phenols and usage thereof as curing agents in one component epoxy resin compositions
EP2826796A1 (de) 2013-07-18 2015-01-21 HILTI Aktiengesellschaft Verwendung einer Mehrkomponenten-Mörtelmasse auf Epoxid-Amin-Basis
US11242427B2 (en) * 2015-10-20 2022-02-08 Ppg Industries Ohio, Inc. Structural adhesive compositions
EP3831863B1 (en) 2019-12-04 2023-07-05 Henkel AG & Co. KGaA One component (1k) composition based on epoxy resin
EP3831862B1 (en) 2019-12-04 2023-06-28 Henkel AG & Co. KGaA One component (1k) composition based on epoxy resin
EP3916033A1 (en) 2020-05-28 2021-12-01 Henkel AG & Co. KGaA One component (1k) composition based on epoxy resin

Family Cites Families (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB740923A (en) * 1952-05-15 1955-11-23 Gen Electric Improvements in and relating to phenolic resinous compositions
GB789475A (en) * 1955-09-21 1958-01-22 Bakelite Ltd Improvements in or relating to hardening agents for polyglycidyl ethers
NL89335C (xx) * 1956-08-30
NL109347C (xx) * 1958-05-29
NL127081C (xx) * 1958-10-31
BE585764A (xx) * 1958-12-18
DE1294669B (de) * 1962-10-23 1969-05-08 Albert Ag Chem Werke Herstellen von Epoxydharz-Formteilen
US3519576A (en) * 1966-11-23 1970-07-07 Minnesota Mining & Mfg Latent curing epoxy compositions containing a crystalline polyphenate salt of a polyamine and 2,4,4-trimethyl-2,4,7-trihydroxyflavan
US3520905A (en) * 1969-05-16 1970-07-21 Minnesota Mining & Mfg Flavan salt
CH603713A5 (xx) * 1972-07-25 1978-08-31 Hoechst Ag
US3862260A (en) * 1973-05-07 1975-01-21 Union Carbide Corp Epoxy curing system
US3956241A (en) * 1974-06-07 1976-05-11 Aerojet-General Corporation Latent catalysts for epoxy resins
CH606252A5 (xx) * 1977-01-07 1978-10-31 Ciba Geigy Ag
JPS6045212B2 (ja) * 1977-10-07 1985-10-08 株式会社日立製作所 エポキシ樹脂組成物
JPS5536212A (en) * 1978-09-06 1980-03-13 Mitsui Toatsu Chem Inc Thermosetting resin composition
DE3027140A1 (de) * 1979-07-20 1981-02-19 Ciba Geigy Ag Haertbare epoxidharzgemische und ihre verwendung
JPS5757711A (en) * 1980-09-22 1982-04-07 Rishiyou Kogyo Kk Resin composition for low-pressure molding
JPS57182316A (en) * 1981-05-07 1982-11-10 Cosmo Co Ltd Polyvinylphenol resin composition
JPS57209923A (en) * 1981-06-19 1982-12-23 Mitsui Toatsu Chem Inc Thermosetting resin composition
JPS5887122A (ja) * 1981-11-19 1983-05-24 Hitachi Chem Co Ltd エポキシ樹脂組成物の製造方法
EP0145654B2 (de) * 1983-11-09 1992-05-13 Ciba-Geigy Ag Verfahren zum Innenauskleiden von Rohren oder Rohrteilstücken
EP0152209A3 (en) * 1984-01-27 1985-09-25 LOCTITE (IRELAND) Ltd. Storage stable one-pack compositions
ATE56462T1 (de) * 1985-04-02 1990-09-15 Ciba Geigy Ag Verfahren zum verkleben von oberflaechen mit einem haertbaren epoxidharzgemisch.
JPS61293251A (ja) * 1985-05-22 1986-12-24 Sumitomo Chem Co Ltd エポキシ樹脂組成物
JPH0660231A (ja) * 1992-08-11 1994-03-04 Omron Corp 非接触パスゲートシステム

Also Published As

Publication number Publication date
ES2059405T3 (es) 1994-11-16
DE3787343D1 (de) 1993-10-14
JPS63117032A (ja) 1988-05-21
EP0266306B1 (de) 1993-09-08
US4866133A (en) 1989-09-12
EP0266306A2 (de) 1988-05-04
CA1293340C (en) 1991-12-17
JPH07119274B2 (ja) 1995-12-20
EP0266306A3 (en) 1989-05-24
ATE94185T1 (de) 1993-09-15
GB8622998D0 (en) 1986-10-29

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Legal Events

Date Code Title Description
PF Patent in force
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20040918