HK1001465A1 - Aqueous silver composition - Google Patents
Aqueous silver compositionInfo
- Publication number
- HK1001465A1 HK1001465A1 HK98100441A HK98100441A HK1001465A1 HK 1001465 A1 HK1001465 A1 HK 1001465A1 HK 98100441 A HK98100441 A HK 98100441A HK 98100441 A HK98100441 A HK 98100441A HK 1001465 A1 HK1001465 A1 HK 1001465A1
- Authority
- HK
- Hong Kong
- Prior art keywords
- coating compsn
- silver flake
- amt
- barium
- vii
- Prior art date
Links
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 title abstract 4
- 229910052709 silver Inorganic materials 0.000 title 1
- 239000004332 silver Substances 0.000 title 1
- 239000011248 coating agent Substances 0.000 abstract 6
- 238000000576 coating method Methods 0.000 abstract 6
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 abstract 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract 2
- 239000000853 adhesive Substances 0.000 abstract 2
- 230000001070 adhesive effect Effects 0.000 abstract 2
- AMWRITDGCCNYAT-UHFFFAOYSA-L hydroxy(oxo)manganese;manganese Chemical compound [Mn].O[Mn]=O.O[Mn]=O AMWRITDGCCNYAT-UHFFFAOYSA-L 0.000 abstract 2
- 239000002245 particle Substances 0.000 abstract 2
- 238000005245 sintering Methods 0.000 abstract 2
- SIQZJFKTROUNPI-UHFFFAOYSA-N 1-(hydroxymethyl)-5,5-dimethylhydantoin Chemical compound CC1(C)N(CO)C(=O)NC1=O SIQZJFKTROUNPI-UHFFFAOYSA-N 0.000 abstract 1
- QPLDLSVMHZLSFG-UHFFFAOYSA-N CuO Inorganic materials [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 abstract 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 abstract 1
- 239000000654 additive Substances 0.000 abstract 1
- 230000000996 additive effect Effects 0.000 abstract 1
- 229960005363 aluminium oxide Drugs 0.000 abstract 1
- DSAJWYNOEDNPEQ-UHFFFAOYSA-N barium atom Chemical compound [Ba] DSAJWYNOEDNPEQ-UHFFFAOYSA-N 0.000 abstract 1
- QVQLCTNNEUAWMS-UHFFFAOYSA-N barium oxide Inorganic materials [Ba]=O QVQLCTNNEUAWMS-UHFFFAOYSA-N 0.000 abstract 1
- 239000005388 borosilicate glass Substances 0.000 abstract 1
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 abstract 1
- CXKCTMHTOKXKQT-UHFFFAOYSA-N cadmium oxide Inorganic materials [Cd]=O CXKCTMHTOKXKQT-UHFFFAOYSA-N 0.000 abstract 1
- 150000001732 carboxylic acid derivatives Chemical class 0.000 abstract 1
- 239000003795 chemical substances by application Substances 0.000 abstract 1
- 230000000295 complement effect Effects 0.000 abstract 1
- 239000006184 cosolvent Substances 0.000 abstract 1
- 239000013530 defoamer Substances 0.000 abstract 1
- 230000000694 effects Effects 0.000 abstract 1
- 239000000314 lubricant Substances 0.000 abstract 1
- 150000003839 salts Chemical class 0.000 abstract 1
- 235000012239 silicon dioxide Nutrition 0.000 abstract 1
- 239000000377 silicon dioxide Substances 0.000 abstract 1
- 239000002904 solvent Substances 0.000 abstract 1
- 239000004094 surface-active agent Substances 0.000 abstract 1
- 239000002492 water-soluble polymer binding agent Substances 0.000 abstract 1
- XLOMVQKBTHCTTD-UHFFFAOYSA-N zinc oxide Inorganic materials [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/005—Electrodes
- H01G4/008—Selection of materials
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
- C09D5/24—Electrically-conducting paints
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D133/00—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Coating compositions based on derivatives of such polymers
- C09D133/02—Homopolymers or copolymers of acids; Metal or ammonium salts thereof
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49866—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials
- H01L23/49883—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials the conductive materials containing organic materials or pastes, e.g. for thick films
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
- H01L2924/097—Glass-ceramics, e.g. devitrified glass
- H01L2924/09701—Low temperature co-fired ceramic [LTCC]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Power Engineering (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Wood Science & Technology (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Life Sciences & Earth Sciences (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Dispersion Chemistry (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Manufacturing & Machinery (AREA)
- Metallurgy (AREA)
- Electrochemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Paints Or Removers (AREA)
- Agricultural Chemicals And Associated Chemicals (AREA)
- Pharmaceuticals Containing Other Organic And Inorganic Compounds (AREA)
- Conductive Materials (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US08/335,146 US5492653A (en) | 1994-11-07 | 1994-11-07 | Aqueous silver composition |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| HK1001465A1 true HK1001465A1 (en) | 1998-06-19 |
Family
ID=23310470
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| HK98100441A HK1001465A1 (en) | 1994-11-07 | 1998-01-19 | Aqueous silver composition |
Country Status (9)
| Country | Link |
|---|---|
| US (2) | US5492653A (xx) |
| EP (1) | EP0713930B1 (xx) |
| KR (1) | KR0174305B1 (xx) |
| CN (1) | CN1058741C (xx) |
| AT (1) | ATE164892T1 (xx) |
| DE (1) | DE69502004T2 (xx) |
| ES (1) | ES2115306T3 (xx) |
| FI (1) | FI114923B (xx) |
| HK (1) | HK1001465A1 (xx) |
Families Citing this family (47)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5492653A (en) * | 1994-11-07 | 1996-02-20 | Heraeus Incorporated | Aqueous silver composition |
| JPH0912385A (ja) * | 1995-04-28 | 1997-01-14 | Mitsuboshi Belting Ltd | メッキ用表面処理剤およびこれを付着した基材 |
| US5756008A (en) * | 1996-08-14 | 1998-05-26 | E. I. Du Pont De Nemours And Company | Water cleanable silver composition |
| DE19638629C2 (de) * | 1996-09-20 | 2000-05-31 | Epcos Ag | Verfahren zum Aufbringen einer elektrisch leitfähigen Grundschicht auf einen Keramikkörper |
| DE19647044A1 (de) * | 1996-11-14 | 1998-05-20 | Degussa | Paste für Einbrennschichten |
| DE19737685C2 (de) * | 1997-08-29 | 1999-08-12 | Sonderhoff Ernst Fa | Abschirmdichtung |
| JP3422233B2 (ja) | 1997-09-26 | 2003-06-30 | 株式会社村田製作所 | バイアホール用導電性ペースト、およびそれを用いた積層セラミック基板の製造方法 |
| US5855820A (en) * | 1997-11-13 | 1999-01-05 | E. I. Du Pont De Nemours And Company | Water based thick film conductive compositions |
| DE19815291B4 (de) * | 1998-04-06 | 2006-05-24 | Ferro Gmbh | Beschichtungszusammensetzung zur Herstellung von elektrisch leitfähigen Schichten |
| JPH11329073A (ja) * | 1998-05-19 | 1999-11-30 | Murata Mfg Co Ltd | 導電ペースト及びそれを用いたセラミック電子部品 |
| US7282260B2 (en) * | 1998-09-11 | 2007-10-16 | Unitech, Llc | Electrically conductive and electromagnetic radiation absorptive coating compositions and the like |
| US6576336B1 (en) * | 1998-09-11 | 2003-06-10 | Unitech Corporation, Llc | Electrically conductive and electromagnetic radiation absorptive coating compositions and the like |
| KR100339201B1 (ko) * | 2000-04-19 | 2002-05-31 | 안복현 | 도전성 페인트의 제조방법 및 도전성 페인트 조성물 |
| US6817088B1 (en) * | 2000-06-16 | 2004-11-16 | Watlow Electric Msg.C | Termination method for thick film resistance heater |
| US20050095410A1 (en) * | 2001-03-19 | 2005-05-05 | Mazurkiewicz Paul H. | Board-level conformal EMI shield having an electrically-conductive polymer coating over a thermally-conductive dielectric coating |
| EP1335393A4 (en) * | 2001-04-20 | 2008-04-16 | Matsushita Electric Ind Co Ltd | METHOD FOR PRODUCING ELECTRONIC PARTS, AND ASSOCIATED PRODUCTION ELEMENT |
| US8178188B2 (en) * | 2001-04-20 | 2012-05-15 | Panasonic Corporation | Base layer for manufacturing an electronic component by an etching process |
| US6866799B2 (en) | 2002-05-09 | 2005-03-15 | Anuvu, Inc. | Water-soluble electrically conductive composition, modifications, and applications thereof |
| US6945783B2 (en) * | 2002-05-21 | 2005-09-20 | The University Of Iowa Research Foundation | Interactive breast examination training model |
| KR20040033855A (ko) * | 2002-10-16 | 2004-04-28 | 주식회사 이페이퍼텍 | 티슈제조방법 |
| JP3991218B2 (ja) * | 2002-12-20 | 2007-10-17 | 信越化学工業株式会社 | 導電性接着剤及びその製造方法 |
| KR20060004158A (ko) * | 2004-07-08 | 2006-01-12 | 박철용 | 피티씨 특성을 갖는 수성 도전성 중합체 조성물 및 그제조방법 |
| US7316475B2 (en) * | 2004-11-10 | 2008-01-08 | Robert Wilson Cornell | Thermal printing of silver ink |
| JP4613362B2 (ja) * | 2005-01-31 | 2011-01-19 | Ｄｏｗａエレクトロニクス株式会社 | 導電ペースト用金属粉および導電ペースト |
| TW200712151A (en) * | 2005-06-09 | 2007-04-01 | Nat Starch Chem Invest | Aqueous printable electrical conductors |
| EP1904590B1 (en) * | 2005-07-15 | 2015-12-30 | Chroma Australia Pty Limited | Paint composition |
| US20070215883A1 (en) * | 2006-03-20 | 2007-09-20 | Dixon Michael J | Electroluminescent Devices, Subassemblies for use in Making Electroluminescent Devices, and Dielectric Materials, Conductive Inks and Substrates Related Thereto |
| US20080010815A1 (en) * | 2006-07-17 | 2008-01-17 | W.E.T. Automotive Group Ag | Heating tape structure |
| US8709288B2 (en) * | 2006-09-08 | 2014-04-29 | Sun Chemical Corporation | High conductive water-based silver ink |
| US7919015B2 (en) * | 2006-10-05 | 2011-04-05 | Xerox Corporation | Silver-containing nanoparticles with replacement stabilizer |
| KR101434256B1 (ko) * | 2006-12-22 | 2014-08-27 | 헨켈 아게 운트 코. 카게아아 | 수계 전도성 조성물 |
| JP4294705B2 (ja) * | 2007-05-30 | 2009-07-15 | Ｄｏｗａエレクトロニクス株式会社 | 有機物質で被覆された銀微粉の製法および銀微粉 |
| CN101781496B (zh) * | 2009-01-16 | 2013-10-02 | 比亚迪股份有限公司 | 一种水性银粉涂料组合物 |
| US7935278B2 (en) * | 2009-03-05 | 2011-05-03 | Xerox Corporation | Feature forming process using acid-containing composition |
| US20110126897A1 (en) * | 2009-05-20 | 2011-06-02 | E. I. Du Pont De Nemours And Company | Composition for extruding fibers |
| CN102034877A (zh) * | 2009-09-30 | 2011-04-27 | 比亚迪股份有限公司 | 一种太阳能电池用导电浆料及其制备方法 |
| TW201113233A (en) * | 2009-10-06 | 2011-04-16 | Guo Chun Ying | Method of coating noble metal nanoparticle in glassware |
| CN102740997B (zh) * | 2009-11-27 | 2016-02-24 | 特线工业株式会社 | 含有微小金属粒子的组合物 |
| GB201009847D0 (en) * | 2010-06-11 | 2010-07-21 | Dzp Technologies Ltd | Deposition method, apparatus, printed object and uses |
| WO2013091197A1 (en) * | 2011-12-21 | 2013-06-27 | 3M Innovative Properties Company | Resin composition and dielectric layer and capacitor produced therefrom |
| CN103177787B (zh) * | 2011-12-26 | 2016-04-27 | 比亚迪股份有限公司 | 一种用于制备导电银浆的导电粉及导电银浆 |
| CN103198876B (zh) * | 2012-01-06 | 2015-09-09 | 任天斌 | 水性纳米电子银浆及其制备方法 |
| DE102014105483A1 (de) | 2014-04-17 | 2015-10-22 | Heraeus Sensor Technology Gmbh | Sensorelement, Sensormodul, Messanordnung und Abgasrückführsystem mit einem solchen Sensorelement sowie Herstellungsverfahren |
| KR102092533B1 (ko) | 2014-06-06 | 2020-04-23 | 휴렛-팩커드 디벨롭먼트 컴퍼니, 엘.피. | 잉크 조성물 |
| WO2015187179A1 (en) | 2014-06-06 | 2015-12-10 | Hewlett-Packard Development Company, L.P. | Ink composition |
| WO2015187181A1 (en) * | 2014-06-06 | 2015-12-10 | Hewlett-Packard Development Company, L.P. | Ink composition |
| CN117238554B (zh) * | 2023-09-06 | 2024-07-16 | 淮安捷泰新能源科技有限公司 | 一种导电银浆及其制备方法 |
Family Cites Families (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CH434588A (de) * | 1962-11-15 | 1967-04-30 | Tesla Np | Verfahren zur Herstellung von Silberpulver |
| NL300391A (xx) * | 1962-11-15 | |||
| US4032350A (en) * | 1973-03-12 | 1977-06-28 | Owens-Illinois, Inc. | Printing paste vehicle, gold dispensing paste and method of using the paste in the manufacture of microelectronic circuitry components |
| US4331714A (en) * | 1979-06-29 | 1982-05-25 | E. I. Dupont De Nemours And Company | Process of making flake silver powders with chemisorbed monolayer of dispersant |
| US4950423A (en) * | 1986-01-22 | 1990-08-21 | The B. F. Goodrich Company | Coating of EMI shielding and method therefor |
| US4715989A (en) * | 1986-01-22 | 1987-12-29 | The B.F. Goodrich Company | Coating for EMI shielding |
| US4826631A (en) * | 1986-01-22 | 1989-05-02 | The B. F. Goodrich Company | Coating for EMI shielding and method for making |
| US5062891A (en) * | 1987-08-13 | 1991-11-05 | Ceramics Process Systems Corporation | Metallic inks for co-sintering process |
| US4906596A (en) * | 1987-11-25 | 1990-03-06 | E. I. Du Pont De Nemours & Co. | Die attach adhesive composition |
| US4851051A (en) * | 1988-09-09 | 1989-07-25 | E. I. Du Pont De Nemours And Company | Process for de-ionizing silver particles |
| DE69121449T2 (de) * | 1990-04-12 | 1997-02-27 | Matsushita Electric Ind Co Ltd | Leitende Tintenzusammensetzung und Verfahren zum Herstellen eines dickschichtigen Musters |
| US5242623A (en) * | 1991-08-13 | 1993-09-07 | E. I. Du Pont De Nemours And Company | Screen-printable thick film paste composition |
| US5252632A (en) * | 1992-11-19 | 1993-10-12 | Savin Roland R | Low cost cathodic and conductive coating compositions comprising lightweight hollow glass microspheres and a conductive phase |
| US5286415A (en) * | 1992-12-28 | 1994-02-15 | Advanced Products, Inc. | Water-based polymer thick film conductive ink |
| US5346651A (en) * | 1993-08-31 | 1994-09-13 | Cerdec Corporation | Silver containing conductive coatings |
| US5431718A (en) * | 1994-07-05 | 1995-07-11 | Motorola, Inc. | High adhesion, solderable, metallization materials |
| US5492653A (en) * | 1994-11-07 | 1996-02-20 | Heraeus Incorporated | Aqueous silver composition |
| US5565143A (en) * | 1995-05-05 | 1996-10-15 | E. I. Du Pont De Nemours And Company | Water-based silver-silver chloride compositions |
-
1994
- 1994-11-07 US US08/335,146 patent/US5492653A/en not_active Expired - Fee Related
-
1995
- 1995-10-17 US US08/544,038 patent/US5658499A/en not_active Expired - Fee Related
- 1995-11-01 KR KR1019950039220A patent/KR0174305B1/ko not_active IP Right Cessation
- 1995-11-02 ES ES95117196T patent/ES2115306T3/es not_active Expired - Lifetime
- 1995-11-02 AT AT95117196T patent/ATE164892T1/de not_active IP Right Cessation
- 1995-11-02 DE DE69502004T patent/DE69502004T2/de not_active Expired - Fee Related
- 1995-11-02 EP EP95117196A patent/EP0713930B1/en not_active Expired - Lifetime
- 1995-11-07 CN CN95121553A patent/CN1058741C/zh not_active Expired - Fee Related
- 1995-11-07 FI FI955353A patent/FI114923B/fi active IP Right Grant
-
1998
- 1998-01-19 HK HK98100441A patent/HK1001465A1/xx not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| KR960017803A (ko) | 1996-06-17 |
| ATE164892T1 (de) | 1998-04-15 |
| DE69502004T2 (de) | 1998-09-24 |
| KR0174305B1 (ko) | 1999-03-20 |
| CN1134962A (zh) | 1996-11-06 |
| US5658499A (en) | 1997-08-19 |
| CN1058741C (zh) | 2000-11-22 |
| EP0713930B1 (en) | 1998-04-08 |
| FI114923B (fi) | 2005-01-31 |
| ES2115306T3 (es) | 1998-06-16 |
| DE69502004D1 (de) | 1998-05-14 |
| FI955353A0 (fi) | 1995-11-07 |
| EP0713930A1 (en) | 1996-05-29 |
| FI955353A (fi) | 1996-05-08 |
| US5492653A (en) | 1996-02-20 |
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| PF | Patent in force | ||
| PC | Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee) |
Effective date: 20071102 |