CN103198876B - 水性纳米电子银浆及其制备方法 - Google Patents
水性纳米电子银浆及其制备方法 Download PDFInfo
- Publication number
- CN103198876B CN103198876B CN201210003336.4A CN201210003336A CN103198876B CN 103198876 B CN103198876 B CN 103198876B CN 201210003336 A CN201210003336 A CN 201210003336A CN 103198876 B CN103198876 B CN 103198876B
- Authority
- CN
- China
- Prior art keywords
- silver paste
- preparation
- electronic silver
- waterborne
- nanometer electronic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 title claims abstract description 37
- 229910052709 silver Inorganic materials 0.000 title claims abstract description 33
- 239000004332 silver Substances 0.000 title claims abstract description 33
- 238000002360 preparation method Methods 0.000 title abstract description 8
- 239000002002 slurry Substances 0.000 claims abstract description 16
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 11
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 claims description 21
- 239000003795 chemical substances by application Substances 0.000 claims description 7
- 239000013530 defoamer Substances 0.000 claims description 7
- 229920000036 polyvinylpyrrolidone Polymers 0.000 claims description 7
- 235000013855 polyvinylpyrrolidone Nutrition 0.000 claims description 7
- 239000001267 polyvinylpyrrolidone Substances 0.000 claims description 7
- 239000002245 particle Substances 0.000 abstract description 12
- 239000000463 material Substances 0.000 abstract description 9
- 238000007639 printing Methods 0.000 abstract description 8
- 239000011521 glass Substances 0.000 abstract description 7
- 238000000034 method Methods 0.000 abstract description 7
- 238000005516 engineering process Methods 0.000 abstract description 6
- 238000010257 thawing Methods 0.000 abstract description 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract description 4
- 238000006243 chemical reaction Methods 0.000 abstract description 4
- 239000002270 dispersing agent Substances 0.000 abstract description 4
- 238000003801 milling Methods 0.000 abstract description 4
- 229910052710 silicon Inorganic materials 0.000 abstract description 4
- 239000010703 silicon Substances 0.000 abstract description 4
- 235000012431 wafers Nutrition 0.000 abstract description 4
- 230000007613 environmental effect Effects 0.000 abstract description 3
- 239000006185 dispersion Substances 0.000 abstract description 2
- 150000003378 silver Chemical class 0.000 abstract 1
- 238000000227 grinding Methods 0.000 description 18
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 12
- 239000007789 gas Substances 0.000 description 12
- 239000000843 powder Substances 0.000 description 8
- 229910052786 argon Inorganic materials 0.000 description 6
- 239000008367 deionised water Substances 0.000 description 6
- 229910021641 deionized water Inorganic materials 0.000 description 6
- 230000006866 deterioration Effects 0.000 description 6
- 238000001802 infusion Methods 0.000 description 6
- 239000007788 liquid Substances 0.000 description 6
- 229940023462 paste product Drugs 0.000 description 6
- 230000001681 protective effect Effects 0.000 description 6
- 238000012857 repacking Methods 0.000 description 6
- 238000003756 stirring Methods 0.000 description 6
- 239000008187 granular material Substances 0.000 description 5
- 239000000049 pigment Substances 0.000 description 5
- 239000000758 substrate Substances 0.000 description 4
- 238000011161 development Methods 0.000 description 3
- 230000006872 improvement Effects 0.000 description 3
- 238000004377 microelectronic Methods 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 238000005245 sintering Methods 0.000 description 3
- 239000004020 conductor Substances 0.000 description 2
- 238000005189 flocculation Methods 0.000 description 2
- 230000016615 flocculation Effects 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- 229910000510 noble metal Inorganic materials 0.000 description 2
- 239000011241 protective layer Substances 0.000 description 2
- 229910001925 ruthenium oxide Inorganic materials 0.000 description 2
- WOCIAKWEIIZHES-UHFFFAOYSA-N ruthenium(iv) oxide Chemical compound O=[Ru]=O WOCIAKWEIIZHES-UHFFFAOYSA-N 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- 229920003169 water-soluble polymer Polymers 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000003638 chemical reducing agent Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 238000010791 quenching Methods 0.000 description 1
- 230000000171 quenching effect Effects 0.000 description 1
- 238000005201 scrubbing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- 238000005496 tempering Methods 0.000 description 1
- 239000005341 toughened glass Substances 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
- 238000000844 transformation Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Landscapes
- Conductive Materials (AREA)
- Manufacture Of Metal Powder And Suspensions Thereof (AREA)
Abstract
Description
Claims (1)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201210003336.4A CN103198876B (zh) | 2012-01-06 | 2012-01-06 | 水性纳米电子银浆及其制备方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CN201210003336.4A CN103198876B (zh) | 2012-01-06 | 2012-01-06 | 水性纳米电子银浆及其制备方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN103198876A CN103198876A (zh) | 2013-07-10 |
CN103198876B true CN103198876B (zh) | 2015-09-09 |
Family
ID=48721348
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201210003336.4A Expired - Fee Related CN103198876B (zh) | 2012-01-06 | 2012-01-06 | 水性纳米电子银浆及其制备方法 |
Country Status (1)
Country | Link |
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CN (1) | CN103198876B (zh) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20190164661A1 (en) * | 2017-11-27 | 2019-05-30 | Heraeus Precious Metals North America Conshohocken Llc | Water-based vehicle for electroconductive paste |
CN114534333A (zh) * | 2022-04-07 | 2022-05-27 | 上海苏煜新能源有限公司 | 一种具有粒度测试结构的光伏银浆筛选加工设备 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1134962A (zh) * | 1994-11-07 | 1996-11-06 | W·C·赫罗伊斯有限公司 | 水性含银组合物 |
CN101872653A (zh) * | 2010-06-28 | 2010-10-27 | 彩虹集团公司 | 一种纳米银导体浆料及其制备方法 |
CN102034877A (zh) * | 2009-09-30 | 2011-04-27 | 比亚迪股份有限公司 | 一种太阳能电池用导电浆料及其制备方法 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4907331B2 (ja) * | 2006-12-25 | 2012-03-28 | 京セラ株式会社 | 光電変換素子用導電性ペースト、光電変換素子、および光電変換素子の作製方法 |
-
2012
- 2012-01-06 CN CN201210003336.4A patent/CN103198876B/zh not_active Expired - Fee Related
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1134962A (zh) * | 1994-11-07 | 1996-11-06 | W·C·赫罗伊斯有限公司 | 水性含银组合物 |
CN102034877A (zh) * | 2009-09-30 | 2011-04-27 | 比亚迪股份有限公司 | 一种太阳能电池用导电浆料及其制备方法 |
CN101872653A (zh) * | 2010-06-28 | 2010-10-27 | 彩虹集团公司 | 一种纳米银导体浆料及其制备方法 |
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Publication number | Publication date |
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CN103198876A (zh) | 2013-07-10 |
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Addressee: Ren Tianbin Document name: Notification of Passing Preliminary Examination of the Application for Invention |
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C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
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Addressee: Ren Tianbin Document name: Notification of Passing Examination on Formalities |
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C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
TR01 | Transfer of patent right |
Effective date of registration: 20180815 Address after: 518106 the first floor of 9 Industrial Zone five village, Gongming street, Guangming New District, Shenzhen, Guangdong. Patentee after: Shenzhen Bo Li Mei Industrial Co., Ltd. Address before: 200092 room 11, 708 Tongji New Village, Yangpu District, Shanghai Patentee before: Ren Tianbin |
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TR01 | Transfer of patent right | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150909 Termination date: 20190106 |
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CF01 | Termination of patent right due to non-payment of annual fee |