HK1000976A1 - Method of reducing hot-electron degradation in semi-conductor devices - Google Patents

Method of reducing hot-electron degradation in semi-conductor devices

Info

Publication number
HK1000976A1
HK1000976A1 HK97102597A HK97102597A HK1000976A1 HK 1000976 A1 HK1000976 A1 HK 1000976A1 HK 97102597 A HK97102597 A HK 97102597A HK 97102597 A HK97102597 A HK 97102597A HK 1000976 A1 HK1000976 A1 HK 1000976A1
Authority
HK
Hong Kong
Prior art keywords
semi
conductor devices
reducing hot
electron degradation
degradation
Prior art date
Application number
HK97102597A
Other languages
English (en)
Inventor
Stefan K Lai
Daniel N Tang
Simon Y Wang
Susan L Kao
Baylor B Triplett
Original Assignee
Intel Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Intel Corp filed Critical Intel Corp
Publication of HK1000976A1 publication Critical patent/HK1000976A1/xx

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76Unipolar devices, e.g. field effect transistors
    • H01L29/772Field effect transistors
    • H01L29/78Field effect transistors with field effect produced by an insulated gate
    • H01L29/788Field effect transistors with field effect produced by an insulated gate with floating gate
    • H01L29/7881Programmable transistors with only two possible levels of programmation
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/52Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/532Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body characterised by the materials
    • H01L23/53204Conductive materials
    • H01L23/53209Conductive materials based on metals, e.g. alloys, metal silicides
    • H01L23/53214Conductive materials based on metals, e.g. alloys, metal silicides the principal metal being aluminium
    • H01L23/53223Additional layers associated with aluminium layers, e.g. adhesion, barrier, cladding layers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/40Electrodes ; Multistep manufacturing processes therefor
    • H01L29/43Electrodes ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
    • H01L29/45Ohmic electrodes
    • H01L29/456Ohmic electrodes on silicon
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Ceramic Engineering (AREA)
  • Semiconductor Memories (AREA)
  • Non-Volatile Memory (AREA)
  • Junction Field-Effect Transistors (AREA)
HK97102597A 1989-03-22 1997-12-23 Method of reducing hot-electron degradation in semi-conductor devices HK1000976A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US32730289A 1989-03-22 1989-03-22

Publications (1)

Publication Number Publication Date
HK1000976A1 true HK1000976A1 (en) 1998-05-15

Family

ID=23276001

Family Applications (1)

Application Number Title Priority Date Filing Date
HK97102597A HK1000976A1 (en) 1989-03-22 1997-12-23 Method of reducing hot-electron degradation in semi-conductor devices

Country Status (6)

Country Link
JP (1) JPH02281663A (xx)
DE (1) DE4007895C2 (xx)
FR (1) FR2644934A1 (xx)
GB (1) GB2229575B (xx)
HK (1) HK1000976A1 (xx)
IT (1) IT1239459B (xx)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR960015322B1 (ko) * 1993-07-23 1996-11-07 현대전자산업 주식회사 차폐용 플레이트를 갖는 반도체소자 제조방법
JP2003297956A (ja) 2002-04-04 2003-10-17 Toshiba Corp 半導体記憶装置及びその製造方法
JP4212299B2 (ja) 2002-05-09 2009-01-21 株式会社東芝 不揮発性半導体記憶装置

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3879746A (en) * 1972-05-30 1975-04-22 Bell Telephone Labor Inc Gate metallization structure
US4288256A (en) * 1977-12-23 1981-09-08 International Business Machines Corporation Method of making FET containing stacked gates
WO1981000487A1 (en) * 1979-08-13 1981-02-19 Ncr Co Hydrogen annealing process for silicon gate memory device
JP2515715B2 (ja) * 1984-02-24 1996-07-10 株式会社日立製作所 半導体集積回路装置の製造方法
US4566026A (en) * 1984-04-25 1986-01-21 Honeywell Inc. Integrated circuit bimetal layer
US4743564A (en) * 1984-12-28 1988-05-10 Kabushiki Kaisha Toshiba Method for manufacturing a complementary MOS type semiconductor device
JPS62143476A (ja) * 1985-12-18 1987-06-26 Fujitsu Ltd 半導体記憶装置
US4707721A (en) * 1986-02-20 1987-11-17 Texas Instruments Incorporated Passivated dual dielectric gate system and method for fabricating same
IT1201840B (it) * 1986-08-28 1989-02-02 Sgs Microelettronica Spa Procedimento per realizzare contatti ohmici metallo-semiconduttore
CA1306072C (en) * 1987-03-30 1992-08-04 John E. Cronin Refractory metal - titanium nitride conductive structures and processes for forming the same
US4824803A (en) * 1987-06-22 1989-04-25 Standard Microsystems Corporation Multilayer metallization method for integrated circuits

Also Published As

Publication number Publication date
DE4007895C2 (de) 2000-03-30
GB2229575B (en) 1993-05-12
IT9019716A0 (it) 1990-03-19
IT1239459B (it) 1993-11-02
FR2644934A1 (fr) 1990-09-28
GB9000360D0 (en) 1990-03-07
GB2229575A (en) 1990-09-26
IT9019716A1 (it) 1991-09-19
JPH02281663A (ja) 1990-11-19
DE4007895A1 (de) 1990-09-27

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Legal Events

Date Code Title Description
PF Patent in force
PE Patent expired

Effective date: 20100107