GR3005916T3 - - Google Patents

Info

Publication number
GR3005916T3
GR3005916T3 GR920402236T GR920402236T GR3005916T3 GR 3005916 T3 GR3005916 T3 GR 3005916T3 GR 920402236 T GR920402236 T GR 920402236T GR 920402236 T GR920402236 T GR 920402236T GR 3005916 T3 GR3005916 T3 GR 3005916T3
Authority
GR
Greece
Prior art keywords
conductors
thin
film circuit
solderable
bondable
Prior art date
Application number
GR920402236T
Other languages
Greek (el)
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of GR3005916T3 publication Critical patent/GR3005916T3/el

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/019—Manufacture or treatment of bond pads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C1/00—Details
    • H01C1/14—Terminals or tapping points specially adapted for resistors; Arrangements of terminals or tapping points on resistors
    • H01C1/142—Terminals or tapping points specially adapted for resistors; Arrangements of terminals or tapping points on resistors the terminals or tapping points being coated on the resistive element
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/28—Apparatus or processes specially adapted for manufacturing resistors adapted for applying terminals
    • H01C17/288—Apparatus or processes specially adapted for manufacturing resistors adapted for applying terminals by thin film techniques
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing of the conductive pattern
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/951—Materials of bond pads
    • H10W72/952—Materials of bond pads comprising metals or metalloids, e.g. PbSn, Ag or Cu

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
  • Non-Adjustable Resistors (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Wire Bonding (AREA)
  • Details Of Resistors (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
GR920402236T 1986-02-20 1992-10-08 GR3005916T3 (enExample)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19863605425 DE3605425A1 (de) 1986-02-20 1986-02-20 Duennschichtschaltung und ein verfahren zu ihrer herstellung

Publications (1)

Publication Number Publication Date
GR3005916T3 true GR3005916T3 (enExample) 1993-06-07

Family

ID=6294533

Family Applications (1)

Application Number Title Priority Date Filing Date
GR920402236T GR3005916T3 (enExample) 1986-02-20 1992-10-08

Country Status (7)

Country Link
US (1) US4742325A (enExample)
EP (1) EP0234487B1 (enExample)
JP (1) JPS62199043A (enExample)
AT (1) ATE79483T1 (enExample)
DE (2) DE3605425A1 (enExample)
ES (1) ES2034970T3 (enExample)
GR (1) GR3005916T3 (enExample)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4136198A1 (de) * 1991-11-02 1993-05-06 Deutsche Aerospace Ag, 8000 Muenchen, De Verfahren zur herstellung eines strukturierten duennfilm-widerstandsschichtsystems sowie schaltungsanordnung mit einem insbesondere nach diesem verfahren hergestellten duennfilm-widerstandsschichtsystem
DE4314665A1 (de) * 1993-05-04 1994-11-10 Hella Kg Hueck & Co Schaltungsanordnung
WO1996004668A1 (en) * 1994-08-05 1996-02-15 Philips Electronics N.V. Electrically resistive structure
US6703666B1 (en) 1999-07-14 2004-03-09 Agere Systems Inc. Thin film resistor device and a method of manufacture therefor
US6347175B1 (en) 1999-07-14 2002-02-12 Corning Incorporated Solderable thin film
JP4774789B2 (ja) * 2004-04-14 2011-09-14 三菱化学株式会社 エッチング方法及びエッチング液
CN1946877A (zh) * 2004-04-14 2007-04-11 三菱化学株式会社 蚀刻方法和蚀刻液
US7432202B2 (en) * 2005-12-28 2008-10-07 Intel Corporation Method of substrate manufacture that decreases the package resistance
JP4516538B2 (ja) * 2006-03-01 2010-08-04 住友電工デバイス・イノベーション株式会社 半導体装置の製造方法
KR20130056629A (ko) * 2011-11-22 2013-05-30 삼성전기주식회사 기판 및 이의 제조방법
JP2020010004A (ja) * 2018-07-12 2020-01-16 Koa株式会社 抵抗器及び回路基板

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3649945A (en) * 1971-01-20 1972-03-14 Fairchild Camera Instr Co Thin film resistor contact
US4077854A (en) * 1972-10-02 1978-03-07 The Bendix Corporation Method of manufacture of solderable thin film microcircuit with stabilized resistive films
FR2210881B1 (enExample) * 1972-12-14 1976-04-23 Honeywell Bull
FR2290762A1 (fr) * 1974-11-06 1976-06-04 Lignes Telegraph Telephon Procede de realisation de contacts ohmiques pour circuits en couche mince
JPS531858A (en) * 1976-06-29 1978-01-10 Kokusai Electric Co Ltd Method of forming thin film circuit
JPS555842A (en) * 1978-06-28 1980-01-17 Kubota Ltd Preparation of synthetic resin tube
DE2906813C2 (de) * 1979-02-22 1982-06-03 Robert Bosch Gmbh, 7000 Stuttgart Elektronische Dünnschichtschaltung
EP0016263B1 (de) * 1979-03-21 1983-07-06 BBC Brown Boveri AG Dünnschichtwiderstand mit grossem Temperaturkoeffizienten und Verfahren zu dessen Herstellung
GB2186597B (en) * 1986-02-17 1990-04-04 Plessey Co Plc Electrical contact surface coating

Also Published As

Publication number Publication date
EP0234487B1 (de) 1992-08-12
JPS62199043A (ja) 1987-09-02
EP0234487A3 (en) 1990-03-07
DE3780980D1 (de) 1992-09-17
US4742325A (en) 1988-05-03
ATE79483T1 (de) 1992-08-15
DE3605425A1 (de) 1987-08-27
JPH0421359B2 (enExample) 1992-04-09
ES2034970T3 (es) 1993-04-16
EP0234487A2 (de) 1987-09-02

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